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Infineon Technologies S29GL256S10DHA023
- Part No.:
- S29GL256S10DHA023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S10DHA023.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,884
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Product details
Overview
S29GL256S10DHA023 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware execution in industrial controllers.
For engineers reviewing the S29GL256S10DHA023 datasheet, S29GL256S10DHA023 pinout, S29GL256S10DHA023 application, or S29GL256S10DHA023 equivalent, key selection factors include its 128 kB uniform sector erase granularity, 512-byte write buffer, Versatile I/O (1.65 V to VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and TSOP-56 packaging.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard read and 32-byte page-mode read. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.
The flash array is organized into uniform 128 kB sectors, each individually erasable. Sector protection uses advanced methods-volatile (via status register) and non-volatile (via lock bits)-and includes a dedicated 1024-byte OTP array with two lockable regions for secure configuration or calibration data storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), enabling full firmware image storage for mid-tier microcontrollers |
| Random access time | 90 ns at VCC = VIO, meeting real-time boot latency requirements in industrial PLCs |
| Page access time | 15 ns, accelerating sequential instruction fetch during XIP operation |
| Write buffer size | 512 bytes, reducing effective programming time by up to 4× vs. single-word writes |
| ECC support | On-die hardware single-bit error correction, eliminating need for external ECC logic |
| Endurance & retention | 100,000 program/erase cycles and 20-year data retention at 85°C |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2), qualified for under-hood automotive ECUs |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, surface-mount, JEDEC MO-141 compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 32 MB address space (word-aligned) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports Versatile I/O (VIO = 1.65 V to VCC) |
| CE# | Chip enable | Active-low device select; controls power-down entry when deasserted |
| OE# | Output enable | Active-low control for data output buffer; enables read data gating |
| WE# | Write enable | Active-low control for write latching; initiates program/erase command sequences |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation (low = busy) |
| RESET# | Hardware reset | Active-low input forcing device into reset state; clears internal state and aborts ongoing operations |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse technology | Enables higher density and lower power vs. legacy 90 nm NOR, with improved reliability |
| Asynchronous 32-byte page read | Reduces average instruction fetch latency in XIP applications without requiring burst clocks |
| Automatic ECC with single-bit correction | Eliminates soft-error-induced crashes in safety-critical firmware storage without software overhead |
| Advanced sector protection (ASP) | Allows independent locking/unlocking of any 128 kB sector via volatile or non-volatile methods |
| Separate 1024-byte OTP array | Provides tamper-resistant storage for calibration data, MAC addresses, or security keys |
Applications
| Industrial PLC Firmware Storage | Automotive ECU Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with deterministic 90 ns access. Use Value: Eliminates external RAM copy step during boot; supports field firmware updates via sector-erase granularity. | Use Scenario: Holding certified boot code and diagnostic firmware in engine control units exposed to under-hood thermal cycling. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified NOR flash serving as primary boot source with ECC-protected integrity. Use Value: Meets ASIL-B functional safety requirements through hardware ECC and 100K-cycle endurance. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound and MRI subsystems requiring high reliability. IC Role / Device Role / Timing Role: Secure, long-retention storage for critical startup code with OTP region for device-specific calibration constants. Use Value: Prevents unauthorized reprogramming via ASP and ensures 20-year data retention across clinical service life. | Use Scenario: Storing FPGA configuration, protocol stacks, and field-upgradable firmware in 5G remote radio units. IC Role / Device Role / Timing Role: High-speed parallel interface flash enabling fast cold-boot and over-the-air update staging. Use Value: 512-byte write buffer accelerates firmware patching; Versatile I/O simplifies integration with mixed-voltage FPGAs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P10TFI020 | Same density and core voltage, but 64-ball LAE FBGA (9 mm × 9 mm); no TSOP option | Limited to space-constrained PCBs; lacks TSOP footprint compatibility | Select when board area is constrained and BGA assembly is available |
| MX29GL256FHI-90G | Macronix part; 90 ns access, same 256 Mb density, but no integrated ECC or OTP array | Requires external ECC handling; unsuitable for safety-critical boot storage | Select only for cost-sensitive, non-safety applications where ECC is managed in software |
Compared with S29GL256P10TFI020, this TSOP-56 variant offers direct drop-in replacement in legacy designs; versus MX29GL256FHI-90G, it delivers hardware ECC and OTP security absent in the Macronix part-critical for automotive and medical boot integrity.
Availability
S29GL256S10DHA023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ECU boot memory, and medical imaging system BIOS requiring stable component supply across extended product lifecycles.
Supply support for S29GL256S10DHA023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The GL-S family targets high-reliability embedded systems needing XIP-capable NOR flash with enhanced endurance, ECC, and automotive qualification-designed specifically for boot code, firmware, and secure configuration storage.
FAQ
Is S29GL256S10DHA023 pin-compatible with earlier S29GL256N or S29GL256P variants?
No. While functionally similar, S29GL256S uses updated command sets and timing parameters. Pinout matches S29GL256P in TSOP-56, but differences in RESET# behavior and RY/BY# drive strength require validation per Infineon's migration notes. Electrical compatibility is confirmed, but firmware initialization sequences may need revision.
Does this device support execute-in-place (XIP) operation without external buffering?
Yes. The 90 ns random access time and 15 ns page access time enable direct CPU instruction fetch from the flash array. No external cache or SRAM buffering is required for XIP, provided the host processor supports asynchronous 16-bit NOR interface timing and proper wait-state configuration.
What is the purpose of the separate 1024-byte OTP array?
The OTP array provides one-time programmable storage for immutable data such as device serial numbers, calibration coefficients, or cryptographic keys. It is divided into two independently lockable 512-byte regions, preventing accidental overwrite after initial programming while allowing staged provisioning in manufacturing.
How does the Versatile I/O (VIO) feature simplify system integration?
Versatile I/O allows the device's I/O pins to operate between 1.65 V and VCC (2.7–3.6 V), enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V logic families without level shifters. This reduces BOM count and PCB complexity in mixed-voltage systems like FPGA-based telecom platforms.
S29GL256S10DHA023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL256S10DHA023 FAQ
1.How can I place an order for S29GL256S10DHA023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S10DHA023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S10DHA023 reliable?
The price and inventory of S29GL256S10DHA023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10DHA023 is usually 5 days.
3.What payment methods are accepted for S29GL256S10DHA023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10DHA023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S10DHA023?
S29GL256S10DHA023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S10DHA023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S10DHA023?
For technical support, including S29GL256S10DHA023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10DHA023 requirements.
6.How does Aetrix verify that S29GL256S10DHA023 is sourced from the original manufacturer or authorized distributors?
All S29GL256S10DHA023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10DHA023 meets industry standards.
7.What is the process for return or replacement of S29GL256S10DHA023?
All S29GL256S10DHA023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10DHA023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S10DHA023 part is unused and in its original packaging.
Return procedure for S29GL256S10DHA023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S10DHA023 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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AT24C04C-SSHM-T
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