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Infineon Technologies S29GL256S10DHAV10

Name: S29GL256S10DHAV10
Brand: Infineon Technologies
SKU: S29GL256S10DHAV10
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S10DHAV10

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S10DHAV10.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL256S10DHAV10 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, and 15 ns page access time. It implements MIRRORBIT™ Eclipse 65 nm technology, features 512-byte write buffer, hardware ECC for single-bit correction, and uniform 128 kB sectors-used in boot code storage for industrial microcontroller systems requiring XIP execution and reliable firmware retention.

For engineers reviewing the S29GL256S10DHAV10 datasheet, S29GL256S10DHAV10 pinout, S29GL256S10DHAV10 application, or S29GL256S10DHAV10 equivalent, this device supports asynchronous read, sector erase suspend/resume, CFI-compliant identification, OTP array for secure configuration, and operates across –40°C to +105°C (Industrial Plus grade).

Technical Context

This parallel NOR flash integrates an embedded algorithm controller (EAC) that executes program/erase operations autonomously using command sequences. Its architecture supports page-mode reads (32-byte aligned, 15 ns subsequent access) and buffer programming of up to 512 bytes per operation, reducing effective programming time versus byte-by-byte writes.

The device uses dual-plane MIRRORBIT™ cells enabling high density and endurance (100,000 cycles), with on-die ECC logic correcting single-bit errors during read and reporting multi-bit errors via status register. Sector protection includes volatile/non-volatile lock bits and a dedicated 1024-byte OTP array split into two lockable regions.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	256 Mb (32 MB), organized as 2,097,152 × 16-bit words - sufficient for full bootloader + firmware image in resource-constrained embedded hosts.
Access Time	90 ns random access, 15 ns page access - enables fast XIP execution without external cache in MCU-based control systems.
Write Buffer Size	512 bytes (256 words) - allows burst programming of contiguous sectors, cutting typical firmware update time by >3× vs. standard word programming.
ECC Capability	On-chip hardware single-bit error correction with detection of multi-bit errors - eliminates need for external ECC logic in safety-critical boot memory paths.
Endurance & Retention	100,000 program/erase cycles; 20-year data retention - meets long-life requirements for industrial automation and transportation electronics.
Operating Voltage	VCC = 2.7–3.6 V; VIO = 1.65–VCC - supports mixed-voltage system interfacing (e.g., 1.8 V I/O with 3.3 V core) without level shifters.
Temperature Grade	Industrial Plus (–40°C to +105°C) - qualified for under-hood automotive ECUs and high-ambient industrial controllers.

Pinout & Package

Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.5 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address Inputs	23-bit address bus supporting full 256 Mb addressing (A22 = MSB); word-aligned only - no byte enable required.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports both read and write transfers in word granularity; compatible with 16-bit microprocessor buses.
CE#	Chip Enable	Active-low chip select; controls device power state - deassertion places device in low-power standby (100 µA).
OE#	Output Enable	Active-low read strobe; gates output drivers - used with CE# to implement asynchronous read timing (tOE = 25 ns max).
WE#	Write Enable	Active-low write strobe; initiates command latching or data loading during program/erase sequences.
RY/BY#	Ready/Busy Output	Open-drain status indicator - low during embedded operations (program/erase), high when ready for next command.
RESET#	Hardware Reset	Active-low asynchronous reset - forces device into reading ID mode or aborts ongoing operations.
WP#	Write Protect	Hardware sector protection enable - when asserted, prevents accidental program/erase of protected sectors.

Key Features

Feature	Design Value
Page-mode read (32-byte aligned)	15 ns subsequent access time - accelerates sequential instruction fetch in XIP applications without CPU wait states.
Uniform 128-kB sectors	2048 individually erasable sectors - enables fine-grained firmware partitioning (e.g., separate boot loader, app, config sectors).
Suspend/resume for program & erase	Allows interrupting long erase (up to 1 s) to service real-time read requests - critical for deterministic response in control loops.
Common Flash Interface (CFI)	Standardized parameter table at known address - enables OS/bootloader auto-detection and vendor-agnostic flash management.
Advanced Sector Protection (ASP)	Volatile (lock-down via command) and non-volatile (hardware fuse) sector locking - supports field-upgrade-safe boot code protection.

Applications

Industrial PLC Firmware Storage

Automotive ECU Boot Memory

Use Scenario: Storing boot firmware and real-time control logic in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory executing XIP code directly from flash; provides deterministic 90 ns read latency for interrupt response.

Use Value: 20-year data retention and 100K-cycle endurance ensure firmware integrity over 15+ year equipment lifecycles without refresh.

Use Scenario: Holding ASW-compliant boot code and calibration data in engine control units exposed to under-hood thermal stress.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 (–40°C to +105°C) boot flash with hardware ECC - guarantees safe startup after power cycling.

Use Value: On-die ECC corrects bit flips induced by radiation/temperature, eliminating uncorrectable boot failures in safety-critical systems.

Medical Imaging System Configuration

Telecom Base Station BIOS

Use Scenario: Storing FPGA configuration bitstreams and device-specific calibration tables in portable ultrasound and MRI subsystems.

IC Role / Device Role / Timing Role: Secure silicon region (OTP) stores cryptographic keys and calibration checksums; ASP locks OTP against overwrite.

Use Value: Two-lockable 512-byte OTP regions enable separation of factory-programmed keys and field-updatable calibration data.

Use Scenario: Hosting BIOS and FPGA initialization code in carrier-grade 5G base station radios requiring zero-downtime field updates.

IC Role / Device Role / Timing Role: Dual-bank emulation via sector erase suspend - allows background firmware update while maintaining active runtime code.

Use Value: Suspend/resume capability enables <10 ms interruption window during 128 kB sector erase, meeting telecom availability SLAs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P10TFIV10	Same density and timing, but 64-ball LAE FBGA (9 mm × 9 mm) package - no TSOP option; lacks Versatile I/O (VIO fixed to VCC).	Preferred for space-constrained PCBs where BGA routing is acceptable; unsuitable for legacy TSOP footprints or mixed-voltage I/O designs.	Select when board layout prioritizes miniaturization over through-hole compatibility or flexible I/O voltage support.
MX29GL256FHT2I-90G	256 Mb parallel NOR, 90 ns access, but no on-die ECC; requires external error handling; 100K cycles, –40°C to +85°C only.	Lower-cost alternative for non-safety-critical consumer applications where ECC is implemented in software or omitted.	Choose only if system-level ECC is already present and temperature range does not exceed +85°C ambient.

Compared with S29GL256P10TFIV10, the S29GL256S10DHAV10 offers TSOP compatibility and Versatile I/O flexibility; versus MX29GL256FHT2I-90G, it delivers integrated ECC and extended temperature support essential for industrial and automotive use.

Availability

S29GL256S10DHAV10 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ECU boot memory, medical imaging configuration, and telecom base station BIOS requiring stable component supply across long production lifecycles.

Supply support for S29GL256S10DHAV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

The GL-S family targets high-reliability embedded systems needing XIP-capable, high-endurance NOR flash - designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 qualification and 20-year data retention.

FAQ

Does S29GL256S10DHAV10 support byte-level writes?

No. This device operates exclusively on 16-bit word boundaries due to its ×16 data bus architecture. All write operations - including command loading and data programming - require 16-bit alignment. Byte-level access is not supported, and attempts to write misaligned data will result in undefined behavior or bus errors.

What is the function of the STB pin on this device?

The STB (Strobe) pin is not present on S29GL256S10DHAV10. It appears only in the block diagram as a generic label for internal signal gating and is not bonded out to the 56-pin TSOP package. The actual pinout contains only A0–A22, DQ0–DQ15, CE#, OE#, WE#, RY/BY#, RESET#, WP#, VCC, VSS, and VIO.

Can the OTP array be reprogrammed after initial lock?

No. Once either of the two 512-byte OTP regions is permanently locked via the appropriate CFI command sequence, its contents become read-only and cannot be altered. Unlocking is not supported - the lock is irreversible, ensuring cryptographic key or calibration data immutability in production units.

Is hardware reset (RESET#) required before power-up?

No. The device incorporates internal power-on reset (POR) circuitry that automatically initializes internal logic upon VCC ramp. RESET# is optional and used only for synchronous recovery from error states or forced return to reading device ID - it is not needed for normal power sequencing.

S29GL256S10DHAV10 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL256S10DHAV10 FAQ

1.How can I place an order for S29GL256S10DHAV10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10DHAV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10DHAV10 reliable?

The price and inventory of S29GL256S10DHAV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10DHAV10 is usually 5 days.

3.What payment methods are accepted for S29GL256S10DHAV10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10DHAV10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10DHAV10?

S29GL256S10DHAV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10DHAV10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10DHAV10?

For technical support, including S29GL256S10DHAV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10DHAV10 requirements.

6.How does Aetrix verify that S29GL256S10DHAV10 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10DHAV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10DHAV10 meets industry standards.

7.What is the process for return or replacement of S29GL256S10DHAV10?

All S29GL256S10DHAV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10DHAV10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10DHAV10 part is unused and in its original packaging.

Return procedure for S29GL256S10DHAV10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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