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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S10DHAV23

Name: S29GL256S10DHAV23
Brand: Infineon Technologies
SKU: S29GL256S10DHAV23
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S10DHAV23

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S10DHAV23.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

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Inventory:3,704

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Product details

Overview

S29GL256S10DHAV23 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile program retention.

For engineers reviewing the S29GL256S10DHAV23 datasheet, S29GL256S10DHAV23 pinout, S29GL256S10DHAV23 application, or S29GL256S10DHAV23 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant software interface.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages all program/erase operations-including suspend/resume-and enforces automatic ECC during read cycles.

The flash array is organized into uniform 128 kB sectors with advanced sector protection (ASP), OTP lockable regions, and status register/data polling/RY/BY# for real-time operation monitoring. It uses internal voltage generators for programming and erase, eliminating external high-voltage supplies.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mb (32 MB); supports full firmware image storage for mid-range MCUs
Random Access Time	90 ns at VCC = VIO; enables deterministic XIP boot timing
Page Access Time	15 ns; allows rapid sequential instruction fetch within same 32-byte page
Write Buffer Size	512 bytes; reduces effective programming time by batching up to 256 words
ECC Support	Hardware single-bit correction; ensures data integrity without host CPU overhead
Endurance	100,000 program/erase cycles per sector; suitable for field-upgradable firmware
Data Retention	20 years at 85°C; meets long-life industrial deployment requirements

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address Inputs	24-bit word-aligned address bus; A23 is MSB for 256 Mb density
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes via WE# and BYTE# control
CE#	Chip Enable	Active-low enable for device selection; controls power-down entry when deasserted
OE#	Output Enable	Active-low gate for data bus drivers; enables read data output only
WE#	Write Enable	Active-low strobe for write cycles; latches address/data on rising edge
RY/BY#	Ready/Busy Output	Open-drain status indicator; low during embedded program/erase operations
VCC	Core Supply	2.7–3.6 V core and I/O supply; single-rail simplifies power design
VIO	I/O Supply	1.65–3.6 V; decoupled from VCC for mixed-voltage system interfacing

Key Features

Feature	Design Value
Versatile I/O Voltage Range	VIO supports 1.65–3.6 V independently of VCC, enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers
512-Byte Programming Buffer	Reduces average programming time by >60% vs. single-word writes, critical for OTA firmware updates
Uniform 128-kB Sector Architecture	Enables precise firmware partitioning (e.g., bootloader, app, config) without partial-sector constraints
Hardware ECC Engine	Corrects single-bit errors on-the-fly during read; eliminates need for external error-handling logic or SW overhead
OTP Array with Lockable Regions	1024-byte one-time-programmable space split into two independently lockable blocks for secure key or calibration storage

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers operating continuously at 85°C ambient.

IC Role / Device Role / Timing Role: Non-volatile XIP-capable boot memory providing deterministic 90 ns instruction fetch latency to ARM Cortex-M7 MCU.

Use Value: 20-year data retention and 100K erase cycles ensure firmware integrity over 15+ year product lifecycle without refresh.

Use Scenario: Holding safety-critical boot code and sensor calibration data in front-camera ECU certified to AEC-Q100 Grade 2 (–40°C to +105°C).

IC Role / Device Role / Timing Role: AEC-Q100 qualified parallel NOR flash serving as primary boot source for TI TDA4VM SoC with CFI-based initialization.

Use Value: Hardware ECC and sector-level ASP prevent unauthorized modification and ensure runtime code correctness under EMI stress.

Medical Imaging System BIOS

Telecom Baseband Processor Code Storage

Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound devices requiring zero-failure field reliability.

IC Role / Device Role / Timing Role: Secure, high-reliability code storage with OTP-locked calibration constants and RY/BY#-monitored update sequencing.

Use Value: Separate 1024-byte OTP array with dual lock bits enables tamper-proof storage of regulatory-critical calibration parameters.

Use Scenario: Storing DSP firmware and protocol stacks in 5G small-cell baseband units with thermal cycling between –20°C and +70°C.

IC Role / Device Role / Timing Role: High-speed parallel interface flash delivering 1.5 MBps buffered writes for remote firmware upgrades over backhaul link.

Use Value: 512-byte write buffer and suspend/resume capability allow safe interruption of field updates without corruption.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P10TFI020	Same density and timing, but 64-ball LAE BGA (9 mm × 9 mm); no TSOP option	Preferred for space-constrained PCBs where board area is premium and routing density permits BGA	Select when footprint reduction outweighs rework complexity and test accessibility trade-offs
MX29GL256FHI-90G	Macronix part with identical 256 Mb density, 90 ns access, but lacks hardware ECC and OTP array	Requires host-side ECC implementation and external secure storage for keys/calibration	Choose only if cost sensitivity dominates reliability and security requirements

Compared with S29GL256P10TFI020, this TSOP variant offers easier prototyping and rework; versus MX29GL256FHI-90G, it delivers integrated ECC and OTP-reducing BOM count and enhancing functional safety compliance without host software burden.

Availability

S29GL256S10DHAV23 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, medical imaging BIOS, and telecom baseband firmware storage requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S29GL256S10DHAV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

The GL-S family targets high-reliability embedded systems needing deterministic XIP performance, robust data retention, and automotive-grade qualification-designed specifically for boot code, firmware, and secure parameter storage in harsh environments.

FAQ

What is the maximum operating temperature range for S29GL256S10DHAV23?

This part is rated for Industrial Plus grade: –40°C to +105°C ambient, verified per Infineon's AEC-Q100 Grade 2 qualification. It maintains full electrical specifications-including 90 ns random access and 100,000 erase cycles-across this full range, with derating applied only above 105°C.

Does S29GL256S10DHAV23 support common flash interface (CFI)?

Yes, it implements a full CFI parameter table compliant with JEDEC JESD68, accessible via standard command sequences. This enables automatic detection of geometry, timing, and command set by host boot ROM or flash translation layer, eliminating hardcoded driver dependencies.

Can the OTP region be programmed multiple times?

No-the 1024-byte OTP array supports only one-time programming per byte. Each region (Region 0 and Region 1) can be permanently locked via dedicated status bits; once locked, further writes to that region are blocked at the hardware level, ensuring irreversible security.

Is VIO required to be equal to VCC?

No-VIO may range from 1.65 V to VCC independently. For example, VCC can be 3.3 V while VIO is 1.8 V, allowing direct connection to low-voltage I/O domains without level shifters. This is confirmed in Section 8.3 of the datasheet and validated in DC characteristics Table 10.5.

S29GL256S10DHAV23 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL256S10DHAV23 FAQ

1.How can I place an order for S29GL256S10DHAV23 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10DHAV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10DHAV23 reliable?

The price and inventory of S29GL256S10DHAV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10DHAV23 is usually 5 days.

3.What payment methods are accepted for S29GL256S10DHAV23?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10DHAV23 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10DHAV23?

S29GL256S10DHAV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10DHAV23 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10DHAV23?

For technical support, including S29GL256S10DHAV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10DHAV23 requirements.

6.How does Aetrix verify that S29GL256S10DHAV23 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10DHAV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10DHAV23 meets industry standards.

7.What is the process for return or replacement of S29GL256S10DHAV23?

All S29GL256S10DHAV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10DHAV23, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10DHAV23 part is unused and in its original packaging.

Return procedure for S29GL256S10DHAV23:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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