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Infineon Technologies S29GL256S10DHB020

Name: S29GL256S10DHB020
Brand: Infineon Technologies
SKU: S29GL256S10DHB020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S10DHB020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S10DHB020.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL256S10DHB020 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile program retention.

For engineers reviewing the S29GL256S10DHB020 datasheet, S29GL256S10DHB020 pinout, S29GL256S10DHB020 application, or S29GL256S10DHB020 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), OTP array security, and AEC-Q100 Grade 2/3 qualification options.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard and page-mode reads. Its embedded algorithm controller handles autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and suspend/resume capability for interruptible flash updates.

The internal architecture includes separate 1024-byte OTP array with dual lockable regions, CFI-compliant parameter table for host auto-configuration, and advanced sector protection (ASP) with volatile/non-volatile locking modes. ECC logic operates transparently during read cycles without software intervention.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mb (32 MB); supports full firmware image storage for mid-range MCUs
Interface	Parallel ×16 asynchronous; enables direct XIP execution without external buffering
Access Time	90 ns random / 15 ns page; meets real-time boot latency requirements
Write Buffer	512-byte buffer; reduces average programming time by >60% vs. single-word writes
ECC	On-die single-bit correction; eliminates need for external error-handling logic
Endurance	100,000 program/erase cycles per sector; suitable for field-upgradable firmware
Data Retention	20 years at +85°C; validated for long-life industrial deployments

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width). Pinout conforms to standard parallel NOR flash layout with dedicated CE#, OE#, WE#, RESET#, RY/BY#, and 16-bit bidirectional DQ bus.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address Inputs	24-bit word address bus; A23 is MSB for 256 Mb density (32 MB)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes per command sequence
CE#	Chip Enable	Active-low chip select; controls device power state and command latching
OE#	Output Enable	Active-low read strobe; gates output drivers during read cycles
WE#	Write Enable	Active-low write strobe; initiates command or data latch on rising edge
RY/BY#	Ready/Busy	Open-drain status indicator; low during embedded program/erase operations
RESET#	Hardware Reset	Active-low asynchronous reset; clears internal state and aborts pending operations
VCC	Core Supply	2.7–3.6 V core voltage; powers logic, memory array, and ECC engine
VIO	I/O Supply	1.65–VCC I/O voltage; enables mixed-voltage system interfacing

Key Features

Feature	Design Value
Page Mode Read	32-byte aligned page access with 15 ns cycle time; accelerates sequential instruction fetch
Uniform Sector Erase	128 kB sectors across full address space; simplifies firmware partitioning and OTA update design
Versatile I/O	Independent VIO rail (1.65–3.6 V); allows direct connection to 1.8 V or 3.3 V controllers
OTP Array	1024-byte one-time-programmable region with two lockable sections; secures keys or calibration data
CFI Compliance	Standard Common Flash Interface table; enables automatic driver initialization in U-Boot/Linux

Applications

Industrial HMI Boot Storage

Automotive ADAS Firmware

Use Scenario: Storing boot loader and kernel image for ARM Cortex-A series HMIs operating in –40°C to +85°C environments.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP support; provides deterministic 90 ns read latency for first-instruction fetch.

Use Value: Eliminates external SRAM copy step; reduces BOM count and boot time by enabling direct execution from flash.

Use Scenario: Holding safety-critical firmware for radar ECU in AEC-Q100 Grade 2 (–40°C to +105°C) automotive systems.

IC Role / Device Role / Timing Role: Secure, high-endurance firmware repository with OTP-protected calibration parameters.

Use Value: Meets ASIL-B functional safety requirements via ECC, sector locking, and 100K-cycle endurance for field updates.

Medical Imaging Control

Telecom Baseband Processor

Use Scenario: Hosting FPGA configuration bitstream and control firmware in portable ultrasound devices with strict thermal limits.

IC Role / Device Role / Timing Role: Low-power (100 µA standby) non-volatile storage with fast page read for rapid reconfiguration.

Use Value: Enables <100 ms cold-start recovery while maintaining <10 mW active power draw during operation.

Use Scenario: Storing DSP firmware and protocol stacks in 5G small-cell baseband units requiring frequent field upgrades.

IC Role / Device Role / Timing Role: High-throughput (1.5 MBps buffer programming) flash for zero-downtime firmware patching.

Use Value: Reduces upgrade window by >70% compared to legacy single-word programming methods.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P10TFI020	Same density and timing, but 64-ball LAE FBGA (9 mm × 9 mm); no TSOP option	Preferred for space-constrained PCBs where footprint reduction outweighs TSOP rework compatibility	Select when board area is critical and BGA assembly capability exists
MX29GL256FHI-90G	Macronix part; 90 ns access, 128 kB sectors, but lacks integrated ECC and OTP array	Requires external ECC logic and software-managed protection; lower security assurance	Select only if cost sensitivity overrides built-in reliability features

Compared with S29GL256P10TFI020, this TSOP variant offers easier prototyping and rework; versus MX29GL256FHI-90G, it delivers superior data integrity through hardware ECC and secure OTP-critical for safety- or security-sensitive firmware storage.

Availability

S29GL256S10DHB020 is available at Aetrix Electronics and suitable for industrial HMI boot storage, automotive ADAS firmware, and medical imaging control requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S29GL256S10DHB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

The GL-S family targets high-reliability embedded systems needing robust, high-density NOR flash with XIP capability, ECC, and automotive-grade qualification-designed specifically for mission-critical firmware storage in harsh environments.

FAQ

What is the maximum operating temperature range for S29GL256S10DHB020?

This part is qualified for Industrial Plus grade (–40°C to +105°C), verified per Infineon's internal stress testing and JEDEC JESD22-A108. The datasheet specifies full functionality-including 90 ns access time and 100,000-cycle endurance-across this full range, with derating applied only above +105°C.

Does S29GL256S10DHB020 support hardware reset recovery after power loss?

Yes. The RESET# pin provides asynchronous hardware reset that clears internal state, aborts pending program/erase operations, and restores the device to read mode. This ensures predictable behavior after brown-out or uncontrolled power-down, with no risk of partial-sector corruption.

How does the 512-byte write buffer improve effective programming speed?

It allows up to 512 bytes (256 words) to be loaded into an internal buffer before initiating a single embedded program operation. This reduces overhead from repeated command sequences and bus handshaking, achieving 1.5 MBps effective throughput-over 4× faster than single-word programming at the same bus clock rate.

Can the OTP array be used for cryptographic key storage in secure boot implementations?

Yes. The 1024-byte OTP region has two independently lockable sections, each programmable once and permanently read-only after locking. It is commonly used to store root keys, hash digests, or device-specific identifiers in secure boot flows, with physical write-protection enforced at the silicon level.

S29GL256S10DHB020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL256S10DHB020 FAQ

1.How can I place an order for S29GL256S10DHB020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10DHB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10DHB020 reliable?

The price and inventory of S29GL256S10DHB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10DHB020 is usually 5 days.

3.What payment methods are accepted for S29GL256S10DHB020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10DHB020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10DHB020?

S29GL256S10DHB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10DHB020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10DHB020?

For technical support, including S29GL256S10DHB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10DHB020 requirements.

6.How does Aetrix verify that S29GL256S10DHB020 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10DHB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10DHB020 meets industry standards.

7.What is the process for return or replacement of S29GL256S10DHB020?

All S29GL256S10DHB020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10DHB020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10DHB020 part is unused and in its original packaging.

Return procedure for S29GL256S10DHB020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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