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Infineon Technologies S29GL256S10DHB023
- Part No.:
- S29GL256S10DHB023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S10DHB023.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,237
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Product details
Overview
S29GL256S10DHB023 from Infineon is a 256 Mb (32 MB), 16-bit parallel, 3.0 V MIRRORBIT™ Eclipse flash memory with 90 ns random access time, 15 ns page access time, and 128 kB uniform sector erase capability. It operates across –40°C to +105°C (Industrial Plus grade), supports 2.7–3.6 V single-supply operation, and integrates hardware ECC for single-bit error correction - deployed in boot code storage for industrial HMIs and automotive infotainment head units.
For engineers reviewing the S29GL256S10DHB023 datasheet, S29GL256S10DHB023 pinout, S29GL256S10DHB023 application, or S29GL256S10DHB023 equivalent, key selection criteria include its 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65 V to VCC), CFI-compliant interface, and AEC-Q100 Grade 2 qualification for high-reliability embedded systems.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), 32-byte page read architecture, and embedded algorithm controller (EAC) managing program/erase sequences without host intervention. Its dual-voltage I/O (VIO = 1.65 V to VCC) enables direct interfacing with mixed-voltage SoCs while maintaining full 16-bit DQ bus functionality.
The internal hardware ECC engine corrects single-bit errors on-the-fly during read operations and reports uncorrectable multi-bit errors via status register bits. Sector protection includes volatile (lock bits) and non-volatile (ASP) methods, plus a dedicated 1024-byte OTP array with two independently lockable regions for secure configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 2,097,152 × 16-bit words - supports full firmware image storage for mid-tier microcontrollers. |
| Random access time | 90 ns at VCC = VIO - enables real-time XIP execution from flash in deterministic control loops. |
| Page access time | 15 ns - accelerates sequential instruction fetch within 32-byte aligned pages. |
| Write buffer size | 512 bytes (256 words) - reduces average programming time by batching writes, achieving 1.5 MBps effective rate. |
| Erase block size | 128 kB uniform sectors (256 sectors total) - simplifies wear leveling and field firmware update partitioning. |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention - validated for industrial lifecycle deployments. |
| Operating temperature | –40°C to +105°C (Industrial Plus grade) - qualified for under-hood and factory-floor environments. |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width), JEDEC standard footprint compatible with legacy PCB layouts and automated assembly processes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 256 Mb addressing; A23 is MSB (AMAX = A23 per datasheet). |
| DQ0–DQ15 | Data I/O bus | 16-bit bidirectional data path; supports byte/word writes and reads with no external byte-enable logic. |
| CE# | Chip enable | Active-low chip select; controls device power state and enables command decoding when asserted. |
| OE# | Output enable | Active-low read strobe; gates output drivers during read cycles without affecting internal state. |
| WE# | Write enable | Active-low write strobe; initiates program/erase commands and data latching on rising edge. |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operations (low = busy); eliminates need for polling loops. |
| WP# | Write protect | Hardware sector protection override; disables program/erase when asserted, independent of software locks. |
| VCC | Core supply | 3.0 V ±10% supply for core logic, programming, and erase - single-rail simplifies power design. |
| VIO | I/O supply | 1.65 V to VCC - allows interoperability with 1.8 V, 2.5 V, or 3.3 V host interfaces without level shifters. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | On-the-fly single-bit error correction with status reporting - eliminates need for external error-handling firmware. |
| 512-byte write buffer | Reduces average programming latency by >60% vs. single-word writes - critical for fast OTA firmware updates. |
| Versatile I/O (VIO) | Independent 1.65–3.6 V I/O rail - enables direct connection to low-voltage FPGAs and application processors. |
| CFI parameter table | Standardized JEDEC CFI v1.4 compliance - ensures bootloader compatibility across vendor-agnostic toolchains. |
| OTP array | 1024-byte one-time-programmable region with two lockable zones - stores immutable keys and calibration data. |
Applications
| Industrial HMI Boot Storage | Automotive Infotainment Firmware |
|---|---|
Use Scenario: Storing boot loader and OS kernel for ARM-based human-machine interface panels in factory automation. IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 90 ns read latency for real-time startup. Use Value: Eliminates external SRAM copy step; supports secure boot via OTP-stored public key verification. |
Use Scenario: Holding firmware images and UI assets in AEC-Q100 Grade 2 infotainment head units. IC Role / Device Role / Timing Role: High-reliability parallel flash with 105°C operation and hardware ECC for mission-critical code storage. Use Value: Meets ASIL-B functional safety requirements through built-in error detection and sector-level redundancy. |
| Medical Diagnostic Device BIOS | Energy Meter Firmware Archive |
Use Scenario: Retaining calibrated measurement algorithms and regulatory-compliant boot firmware in portable ultrasound systems. IC Role / Device Role / Timing Role: Long-term data-retentive (20 years) flash with 100K-cycle endurance for field-upgradable diagnostics. Use Value: Supports FDA-required audit trails via OTP-locked revision metadata and tamper-evident sector protection. |
Use Scenario: Archiving firmware revisions and tariff tables in smart electricity meters deployed in tropical climates. IC Role / Device Role / Timing Role: Industrial Plus grade flash operating continuously at 85°C ambient with low standby current (100 µA). Use Value: Enables 15-year meter lifetime without firmware corruption risk, validated per IEC 62056 standards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P10TFI020 | Same density and timing, but 64-ball LAE BGA (9 mm × 9 mm); lacks AEC-Q100 qualification. | Targeted at space-constrained consumer electronics, not automotive or extended-temp industrial use. | Select when board area is critical and temperature range ≤ 85°C suffices. |
| MX29GL256FHTI-90G | Macronix part: 90 ns access, 128 kB sectors, but no integrated hardware ECC or OTP array. | Requires external error management and lacks secure key storage - unsuitable for certified safety systems. | Choose only for cost-sensitive designs where ECC and OTP are handled in software or external ICs. |
Compared with S29GL256P10TFI020 and MX29GL256FHTI-90G, the S29GL256S10DHB023 uniquely delivers AEC-Q100 Grade 2 qualification, on-die ECC, and OTP security in a TSOP package - making it the only option meeting both functional safety and legacy PCB compatibility requirements.
Availability
S29GL256S10DHB023 is available at Aetrix Electronics and suitable for industrial HMIs, automotive infotainment systems, and medical diagnostic devices requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL256S10DHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power systems, sensors, and secure microcontrollers, with strong focus on automotive, industrial, and IoT markets.
The GL-S family targets high-reliability embedded systems needing XIP-capable parallel flash with enhanced data integrity, extended temperature operation, and automotive-grade qualification - bridging performance and safety requirements in mission-critical firmware storage.
FAQ
Does S29GL256S10DHB023 support byte-level writes?
No. This device operates exclusively on 16-bit word boundaries. All write operations - including single-word and buffer programming - require even-addressed 16-bit data transfers. Byte-level addressing or partial-word writes are not supported by the command set or internal architecture.
What is the function of the STB pin on this device?
The STB (Strobe) pin is not present on S29GL256S10DHB023. It appears only in the block diagram as a generic label for internal timing control logic and does not correspond to a physical pin on the 56-pin TSOP package. Pin count and signal mapping are strictly defined in Section 12.1 of the datasheet.
Can VIO be set to 1.8 V while VCC remains at 3.0 V?
Yes. The Versatile I/O feature explicitly permits VIO = 1.8 V with VCC = 3.0 V. This configuration is fully characterized and supported per datasheet Table 10.5 (DC Characteristics), enabling direct interfacing with 1.8 V FPGAs or ASICs without level-shifting circuitry.
Is the OTP array reprogrammable after locking?
No. Once either of the two OTP lock bits is programmed (set to '0'), that 512-byte region becomes permanently read-only. The lock operation is irreversible and cannot be undone by power cycling, reset, or command sequence - ensuring cryptographic key immutability per NIST SP 800-193 guidelines.
S29GL256S10DHB023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL256S10DHB023 FAQ
1.How can I place an order for S29GL256S10DHB023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S10DHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S10DHB023 reliable?
The price and inventory of S29GL256S10DHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10DHB023 is usually 5 days.
3.What payment methods are accepted for S29GL256S10DHB023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10DHB023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S10DHB023?
S29GL256S10DHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S10DHB023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S10DHB023?
For technical support, including S29GL256S10DHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10DHB023 requirements.
6.How does Aetrix verify that S29GL256S10DHB023 is sourced from the original manufacturer or authorized distributors?
All S29GL256S10DHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10DHB023 meets industry standards.
7.What is the process for return or replacement of S29GL256S10DHB023?
All S29GL256S10DHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10DHB023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S10DHB023 part is unused and in its original packaging.
Return procedure for S29GL256S10DHB023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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