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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S10DHI013

Name: S29GL256S10DHI013
Brand: Infineon Technologies
SKU: S29GL256S10DHI013
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S10DHI013

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S10DHI013.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL256S10DHI013 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile firmware retention.

For engineers reviewing the S29GL256S10DHI013 datasheet, S29GL256S10DHI013 pinout, S29GL256S10DHI013 application, or S29GL256S10DHI013 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and OTP array for secure configuration storage.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and suspend/resume capability for concurrent background operations.

The architecture includes dedicated sectors for advanced protection (ASP), a 1024-byte one-time-programmable (OTP) array with dual lockable regions, and Common Flash Interface (CFI) compliance for host software identification and parameter retrieval - enabling plug-and-play integration in legacy BIOS and bootloader environments.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mb (32 MB); supports full firmware image storage for mid-range MCUs without external memory expansion.
Random Access Time	90 ns at VCC = VIO; enables direct XIP execution from flash with minimal CPU stall cycles.
Page Access Time	15 ns; allows rapid sequential reads within 32-byte aligned pages for tight-loop code execution.
Write Buffer Size	512 bytes; reduces effective programming time by batching up to 256 words per command, improving firmware update efficiency.
ECC Support	Hardware single-bit error correction; eliminates need for external ECC logic or software overhead in safety-critical systems.
Endurance & Retention	100,000 program/erase cycles and 20-year data retention; meets long-lifecycle requirements for industrial control and automotive ECUs.
Operating Temp	–40°C to +105°C (AEC-Q100 Grade 2); qualified for under-hood automotive applications and high-ambient industrial environments.
Supply Range	VCC = VIO = 2.7–3.6 V; simplifies power design with single-rail operation for read, program, and erase functions.

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address Inputs	24-bit word-aligned address bus; A23 is MSB for 256 Mb density (max address = 0x1FFFFFF).
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes and reads without external data masking logic.
CE#	Chip Enable	Active-low enable controlling device selection; tCE = 90 ns max ensures timing compatibility with 10 MHz+ bus controllers.
OE#	Output Enable	Active-low control for data output gating; tOE = 25 ns supports fast read turnaround in burst-access scenarios.
WE#	Write Enable	Active-low signal initiating internal program/erase algorithms; latches command sequences on rising edge.
RY/BY#	Ready/Busy Output	Open-drain status indicator; low during embedded operations, enabling hardware polling without CPU intervention.
RESET#	Hardware Reset	Active-low input forcing device into reset state; required for recovery after power-on or error conditions.
WP#	Write Protect	Hardware sector protection enable; when asserted, prevents accidental program/erase of protected sectors.

Key Features

Feature	Design Value
Versatile I/O Voltage	VIO range 1.65–3.6 V decouples I/O voltage from core supply, enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers without level shifters.
Uniform Sector Architecture	128 kB sectors simplify firmware partitioning and over-the-air (OTA) update management with deterministic erase boundaries.
Suspend/Resume Capability	Allows interrupting ongoing erase or program operations to service higher-priority reads, critical for real-time interrupt latency control.
Secure OTP Array	1024-byte one-time-programmable region with two independently lockable sections stores cryptographic keys or calibration data immune to field reprogramming.
CFI Compliance	Standardized parameter table enables automatic detection and configuration by generic flash drivers, reducing BSP porting effort across platforms.

Applications

Automotive ECU Boot Memory

Industrial PLC Firmware Storage

Use Scenario: Stores boot loader and safety-critical application code in engine control units operating under under-hood thermal stress.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with <90 ns latency and AEC-Q100 Grade 2 reliability.

Use Value: Eliminates need for external SRAM shadowing; hardware ECC ensures functional safety compliance (ISO 26262 ASIL-B) without software overhead.

Use Scenario: Holds firmware and configuration data for programmable logic controllers deployed in factory automation environments with wide temperature swings.

IC Role / Device Role / Timing Role: Standalone parallel flash memory interfaced to ARM Cortex-M7 or RISC-V SoCs via static memory controller (SMC).

Use Value: 100,000-cycle endurance and 20-year retention guarantee uninterrupted operation over 15+ year equipment lifecycles.

Medical Imaging System BIOS

Avionics Data Logger

Use Scenario: Stores diagnostic firmware and calibration tables in portable ultrasound and MRI subsystems requiring radiation-tolerant, high-reliability storage.

IC Role / Device Role / Timing Role: Secure boot ROM with OTP-locked calibration parameters and CFI-enabled auto-configuration in multi-vendor hardware platforms.

Use Value: Dual-lock OTP regions prevent unauthorized modification of medical device calibration data, supporting FDA 21 CFR Part 11 compliance.

Use Scenario: Captures flight-critical telemetry and black-box logs in unmanned aerial vehicles where power loss may occur mid-write.

IC Role / Device Role / Timing Role: Non-volatile storage with hardware reset recovery and suspend/resume for robust logging during transient brownouts.

Use Value: Power-off protection and RY/BY# status signaling ensure no partial-sector corruption during unexpected shutdowns.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P10TFI010	Same density and timing, but uses 64-ball LAE Fortified BGA (9 mm × 9 mm); lacks OTP array and ASP flexibility.	Preferred for space-constrained PCB layouts where TSOP footprint is prohibitive; not suitable for secure key storage.	Select when board area is primary constraint and OTP functionality is unnecessary.
MX29GL256FHT2I-90G	Macronix part with identical 256 Mb density, 90 ns access, and 128 kB sectors; no hardware ECC or Versatile I/O support.	Requires external ECC logic or software correction; limited to 3.3 V I/O only, reducing controller compatibility.	Choose only if cost sensitivity outweighs ECC requirement and I/O voltage flexibility is not needed.

Compared with S29GL256P10TFI010 and MX29GL256FHT2I-90G, the S29GL256S10DHI013 uniquely combines AEC-Q100 Grade 2 qualification, integrated hardware ECC, and 1.65–3.6 V Versatile I/O - making it the only option qualified for automotive safety-critical boot memory without external support circuitry.

Availability

S29GL256S10DHI013 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware updates, and avionics data logger designs requiring stable component supply across extended product lifecycles.

Supply support for S29GL256S10DHI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in flash memory for safety-critical systems.

The GL-S family targets high-reliability embedded applications demanding fast XIP performance, long-term data integrity, and automotive-grade qualification - specifically designed for boot code storage in ECUs, PLCs, and medical devices.

FAQ

Does S29GL256S10DHI013 support execute-in-place (XIP) operation?

Yes. The device supports true XIP operation with 90 ns random access time and 15 ns page-mode reads, enabling CPU instruction fetch directly from flash without copying to RAM. Its architecture includes dedicated address decoding and fast output enable timing (tOE = 25 ns), meeting real-time latency requirements for Cortex-M and Power Architecture cores.

What is the function of the RY/BY# pin and how is it used in system design?

RY/BY# is an open-drain ready/busy status output that goes low during internal program or erase operations and returns high upon completion. It enables hardware polling without CPU intervention and can be wired-OR'd with other status signals. In interrupt-driven systems, it may trigger an external interrupt to notify the host processor of operation completion or timeout.

How does the Versatile I/O feature benefit mixed-voltage system designs?

Versatile I/O allows independent setting of VIO between 1.65 V and 3.6 V while maintaining full VCC = 2.7–3.6 V operation. This permits direct connection to 1.8 V FPGA I/O banks or 2.5 V ASIC interfaces without level shifters, reducing BOM count and signal integrity risk. It also supports hot-plug compatibility in modular systems with varying rail voltages.

Can the OTP array be reprogrammed after initial programming?

No. The 1024-byte OTP array consists of one-time-programmable fuses and cannot be erased or rewritten. It contains two independently lockable regions: one for permanent device configuration (e.g., boot mode selection) and another for secure keys or calibration data. Once locked, the region is permanently read-only and immune to software or hardware overwrite attempts.

S29GL256S10DHI013 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL256S10DHI013 FAQ

1.How can I place an order for S29GL256S10DHI013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10DHI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10DHI013 reliable?

The price and inventory of S29GL256S10DHI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10DHI013 is usually 5 days.

3.What payment methods are accepted for S29GL256S10DHI013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10DHI013 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10DHI013?

S29GL256S10DHI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10DHI013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10DHI013?

For technical support, including S29GL256S10DHI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10DHI013 requirements.

6.How does Aetrix verify that S29GL256S10DHI013 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10DHI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10DHI013 meets industry standards.

7.What is the process for return or replacement of S29GL256S10DHI013?

All S29GL256S10DHI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10DHI013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10DHI013 part is unused and in its original packaging.

Return procedure for S29GL256S10DHI013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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