Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S10DHI020

Name: S29GL256S10DHI020
Brand: Infineon Technologies
SKU: S29GL256S10DHI020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: S29GL256S10DHI020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S10DHI020.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:3,065

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

S29GL256S10DHI020 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with MIRRORBIT™ Eclipse 65 nm technology, 16-bit data bus, and single 2.7–3.6 V supply for read/program/erase. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction - deployed in automotive instrument clusters requiring deterministic boot code storage.

For engineers reviewing the S29GL256S10DHI020 datasheet, S29GL256S10DHI020 pinout, S29GL256S10DHI020 application, or S29GL256S10DHI020 equivalent, key selection criteria include sector erase granularity (128 kB), OTP array size (1024 bytes), Versatile I/O voltage range (1.65 V to VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and 100,000 program/erase cycles.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages autonomous program and erase operations, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.

The internal architecture includes a 512-byte write buffer enabling burst programming up to 256 words per command, and a dedicated 1024-byte one-time-programmable (OTP) array split into two lockable regions for secure configuration storage. ECC logic operates transparently during read cycles without software intervention.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	256 Mb (32 MB), mapped as 2²³ × 16-bit words - supports full firmware image storage for mid-tier microcontrollers
Random access time	90 ns at VCC = VIO - enables direct XIP execution from flash with sub-11 MHz bus timing margin
Page access time	15 ns - accelerates sequential instruction fetch within 32-byte aligned pages
Erase block size	Uniform 128 kB sectors - simplifies wear leveling and firmware update partitioning
Write buffer capacity	512 bytes (256 words) - reduces effective programming time by >3× vs. single-word writes
Data retention	20 years at +85°C - meets long-life requirements for automotive ECUs and industrial controllers
Endurance	100,000 program/erase cycles per sector - supports field-upgradable firmware with robust revision management

Pinout & Package

Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.55 mm pitch), RoHS-compliant, lead-free, industrial temperature grade.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address inputs	24-bit word address bus; A23 is MSB for 256 Mb density (2²³ words)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes per CE#/WE# strobe
CE#	Chip enable	Active-low device select; controls power state entry and command latching
OE#	Output enable	Active-low read gate; isolates DQ bus during standby or write operations
WE#	Write enable	Active-low control for write cycles; initiates command sequences and buffer loads
RY/BY#	Ready/Busy output	Open-drain status indicator; low during embedded program/erase, high when idle or ready
RESET#	Hardware reset	Active-low asynchronous abort of ongoing operations and return to read mode
VCC	Core supply	2.7–3.6 V single supply for all functions - eliminates need for separate VPP or VIO regulators
VIO	I/O supply	1.65–VCC - allows interfacing with 1.8 V, 2.5 V, or 3.3 V host logic without level shifters

Key Features

Feature	Design Value
Hardware ECC	Single-bit error correction with automatic detection on every read - eliminates need for external error-handling firmware
512-byte write buffer	Enables 256-word buffered programming - cuts typical firmware update time by ≥65% vs. legacy NOR devices
Suspend/resume	Interrupts active program or erase to service higher-priority reads - critical for real-time HMI responsiveness
1024-byte OTP array	Two independently lockable 512-byte regions - stores immutable keys, calibration data, or serial numbers
Advanced sector protection	Volatile and non-volatile lock bits per 128 kB sector - prevents accidental overwrite during field updates

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing boot loader and GUI assets in digital dashboards with <100 ms cold-start requirement.

IC Role / Device Role / Timing Role: Primary XIP-capable code storage device; provides deterministic 90 ns random access for CPU instruction fetch.

Use Value: Eliminates external SRAM cache layer due to fast page-mode read (15 ns), reducing BOM count and PCB area.

Use Scenario: Holding firmware images and configuration tables in programmable logic controllers operating in harsh factory environments.

IC Role / Device Role / Timing Role: Non-volatile firmware repository with AEC-Q100 Grade 2 qualification (–40°C to +105°C) and 20-year data retention.

Use Value: Supports over-the-air (OTA) updates via 128 kB uniform sector erase - enables atomic firmware swaps without runtime corruption risk.

Medical Diagnostic Imaging Boot

Avionics Display System

Use Scenario: Secure boot code storage for MRI/X-ray subsystem controllers where firmware integrity is safety-critical (IEC 62304 Class C).

IC Role / Device Role / Timing Role: Trusted boot source with hardware ECC and OTP-locked cryptographic keys.

Use Value: Internal ECC corrects bit flips caused by cosmic radiation; OTP region prevents tampering with root-of-trust parameters.

Use Scenario: Storing display firmware and font assets in certified cockpit displays requiring DO-160G environmental compliance.

IC Role / Device Role / Timing Role: High-reliability parallel flash with 100,000-cycle endurance and extended temperature operation.

Use Value: Meets avionics lifecycle requirements via 128 kB sector granularity - simplifies DO-178C verification of firmware update routines.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256S10TFI020	Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm) package - no TSOP footprint compatibility	Targeted at space-constrained designs where board area is prioritized over manual reworkability	Select when using fine-pitch BGA assembly and thermal cycling exceeds TSOP limits
N25Q256A13ESE40F	Quad SPI interface, 3 V supply, no built-in ECC - requires external error handling and serial-to-parallel bridge logic	Used in cost-sensitive IoT gateways where pin count reduction outweighs XIP performance needs	Select only if migrating from parallel to serial architecture and accepting firmware overhead for ECC emulation

Compared with S29GL256S10DHI020, the TSOP-packaged variant offers superior manufacturability and thermal reliability for automotive under-hood use, while the Quad SPI alternative trades deterministic latency for reduced interconnect complexity - making the TSOP version optimal for XIP-critical, safety-certified systems.

Availability

S29GL256S10DHI020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, medical diagnostic imaging boot, and avionics display systems requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL256S10DHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and automotive qualification expertise.

The GL-S family targets high-reliability embedded systems needing deterministic XIP performance, robust data retention, and AEC-Q100-compliant flash - designed specifically for automotive, industrial, and medical applications demanding verified endurance and security features.

FAQ

Does S29GL256S10DHI020 support execute-in-place (XIP) operation?

Yes. The device supports true XIP operation with 90 ns random access time and 15 ns page-mode read, allowing microcontrollers to fetch instructions directly from flash without copying to RAM. Its asynchronous interface and word-aligned addressing ensure deterministic timing for real-time code execution without wait states.

What is the function of the Versatile I/O (VIO) supply pin?

VIO sets the input/output voltage level independently from VCC, ranging from 1.65 V to VCC. This enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without external level shifters, while maintaining full 2.7–3.6 V core operation for reliable program/erase functionality.

How does the 512-byte write buffer improve programming efficiency?

The buffer accepts up to 512 bytes (256 words) in a single command sequence, reducing overhead from repeated command latching. At 1.5 MBps effective rate, it cuts typical 32 kB firmware sector programming time from ~210 ms (single-word) to ~22 ms - accelerating field updates and manufacturing programming.

Is the OTP array truly one-time programmable?

Yes. The 1024-byte OTP region consists of two 512-byte lockable sections. Once locked (via dedicated command), bits cannot be altered or erased. This ensures permanent storage of cryptographic keys, calibration constants, or device identifiers - meeting IEC 62443 and ISO 21434 security requirements.

S29GL256S10DHI020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL256S10DHI020 FAQ

1.How can I place an order for S29GL256S10DHI020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10DHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10DHI020 reliable?

The price and inventory of S29GL256S10DHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10DHI020 is usually 5 days.

3.What payment methods are accepted for S29GL256S10DHI020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10DHI020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10DHI020?

S29GL256S10DHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10DHI020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10DHI020?

For technical support, including S29GL256S10DHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10DHI020 requirements.

6.How does Aetrix verify that S29GL256S10DHI020 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10DHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10DHI020 meets industry standards.

7.What is the process for return or replacement of S29GL256S10DHI020?

All S29GL256S10DHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10DHI020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10DHI020 part is unused and in its original packaging.

Return procedure for S29GL256S10DHI020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

2026-08-11 LDO Regulator: Dropout Voltage, Noise, PSRR and Power Dissipation

LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…