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Infineon Technologies S29GL256S10DHI023
- Part No.:
- S29GL256S10DHI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S10DHI023.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,438
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Product details
Overview
S29GL256S10DHI023 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, and 15 ns page access time. It implements MIRRORBIT™ Eclipse 65 nm technology, features 512-byte write buffer, hardware ECC for single-bit correction, and uniform 128 kB sectors - deployed in automotive instrument clusters for firmware storage and boot code execution.
For engineers reviewing the S29GL256S10DHI023 datasheet, S29GL256S10DHI023 pinout, S29GL256S10DHI023 application, or S29GL256S10DHI023 equivalent, key selection criteria include sector erase granularity, Versatile I/O voltage range (1.65–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant software interface compatibility.
Technical Context
This device operates as an asynchronous parallel NOR flash with XIP-capable read architecture: initial random access fetches a full 32-byte aligned page, followed by 15 ns sub-page reads within the same page using low-order address bits. The embedded algorithm controller (EAC) handles all program/erase sequences, including suspend/resume and status reporting via RY/BY#, data polling, or status register.
It integrates hardware-based ECC for real-time single-bit error correction during read operations and supports both volatile and non-volatile advanced sector protection (ASP). The 1024-byte OTP array includes two lockable regions for secure configuration or calibration data storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 2,097,152 × 16-bit words - supports full firmware image storage for mid-tier automotive ECUs. |
| Random access time (tACC) | 90 ns at VCC = VIO - enables direct code execution without wait states in 5 MHz bus systems. |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch within 32-byte pages during XIP operation. |
| Write buffer size | 512 bytes (256 words) - reduces effective programming time by batching writes, critical for OTA update efficiency. |
| ECC capability | Internal hardware single-bit error correction - ensures data integrity over 20-year retention without host-side ECC overhead. |
| Endurance | 100,000 program/erase cycles per sector - supports frequent field firmware updates in telematics modules. |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2) - validated for under-hood ECU deployment with thermal cycling reliability. |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width), JEDEC standard footprint compatible with automated PCB assembly and rework.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit word address bus (AMAX = A23 for 256 Mb); supports full linear addressing of 2M × 16-bit space. |
| DQ0–DQ15 | Data I/O bus | 16-bit bidirectional data path; operates at VIO (1.65–VCC), enabling mixed-voltage system interfacing. |
| CE# | Chip enable | Active-low device select; tCE = 90 ns - defines minimum chip activation delay before valid read/write. |
| OE# | Output enable | Active-low output control; tOE = 25 ns - governs data hold timing during read cycles. |
| WE# | Write enable | Active-low write strobe; initiates command latching and embedded program/erase algorithms. |
| RY/BY# | Ready/Busy indicator | Open-drain status signal; low during active program/erase - enables hardware flow control without polling. |
| RESET# | Hardware reset | Active-low asynchronous reset; restores device to read mode and clears internal state after power-up or fault. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page-mode read | 32-byte aligned page fetch with 15 ns intra-page access - delivers 66.7 MBps sustained read bandwidth for XIP code execution. |
| Versatile I/O (VIO) | Independent 1.65–VCC I/O supply - eliminates level shifters when interfacing with 1.8 V or 2.5 V microcontrollers. |
| Embedded Algorithm Controller (EAC) | On-die state machine executing program/erase/suspend/resume - removes host CPU overhead and guarantees command sequence compliance. |
| Advanced Sector Protection (ASP) | Volatile and non-volatile locking per 128 kB sector - enables secure bootloader partitioning and runtime write-protection of critical firmware sections. |
| CFI-compliant interface | Standardized parameter table accessible via read commands - simplifies driver development and enables auto-configuration across GL-S family densities. |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated gauge graphics, driver alert logic, and CAN message lookup tables in digital dashboards. IC Role / Device Role / Timing Role: Non-volatile XIP-capable code/data storage with deterministic 90 ns read latency for real-time UI rendering. Use Value: Eliminates external SRAM buffering; supports AEC-Q100 Grade 2 thermal profile for direct mounting on cluster PCBs. |
Use Scenario: Holding firmware images, configuration parameters, and ladder logic binaries in modular industrial controllers. IC Role / Device Role / Timing Role: Boot ROM and field-upgradable application storage with sector-level write protection for safety-critical code segments. Use Value: ASP and OTP regions prevent accidental overwrite of certified control algorithms during maintenance updates. |
| Telematics Control Unit (TCU) | Medical Diagnostic Imaging Bootloader |
Use Scenario: Secure OTA update staging area and fallback firmware repository in cellular-connected vehicle gateways. IC Role / Device Role / Timing Role: Dual-bank capable storage with suspend/resume during erase - enables atomic firmware swaps without system downtime. Use Value: 100,000-cycle endurance and 20-year retention ensure reliable multi-year field operation with repeated remote updates. |
Use Scenario: Storing certified bootloader and cryptographic keys for FDA-compliant imaging equipment with secure boot chain. IC Role / Device Role / Timing Role: Trusted root-of-trust storage with hardware ECC and lockable OTP regions for immutable key material. Use Value: Internal ECC prevents silent corruption of boot code; OTP lock prevents post-manufacturing key exposure or tampering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S10TFI020 | Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP package; identical timing and feature set. | Used where board space is constrained and BGA assembly is available; lacks TSOP's reworkability. | Select for high-density routing and thermal performance; avoid if manual repair or prototyping is required. |
| MX29GL256FHT2I-90G | Micron 256 Mb parallel NOR; 90 ns tACC but no integrated ECC; requires host-side error handling; CFI-compatible but different command set. | Suitable for cost-sensitive industrial designs where ECC is managed externally or not required. | Choose only if ECC is unnecessary and existing Micron driver stack is in place; not drop-in for Infineon firmware. |
Compared with S29GL256S10DHI023, the TSOP-packaged Infineon variant offers superior reworkability and legacy system compatibility, while the Micron alternative trades ECC and ASP for lower unit cost - making it viable only in non-safety-critical, ECC-tolerant environments.
Availability
S29GL256S10DHI023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, and telematics control units requiring stable component supply across extended product lifecycles.
Supply support for S29GL256S10DHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global manufacturing and R&D infrastructure.
The GL-S family targets automotive and industrial applications demanding high-reliability, AEC-Q100 qualified parallel NOR flash for boot code, firmware, and secure data storage - emphasizing endurance, ECC, and temperature robustness.
FAQ
Is S29GL256S10DHI023 pin-compatible with earlier S29GL256P or S29GL256N variants?
No. S29GL256S10DHI023 uses a 56-pin TSOP package with updated pin assignments for Versatile I/O and enhanced RESET# behavior. The S29GL256P/N series use different pinouts and lack VIO support, making them electrically and mechanically incompatible despite shared density and bus width.
Does this device support execute-in-place (XIP) operation without external caching?
Yes. Its 90 ns random access time and 15 ns page-mode read latency meet typical MCU bus timing requirements for direct XIP. The device delivers full 32-byte pages on first access and supports rapid intra-page reads - eliminating need for external cache in most Cortex-M or TriCore-based automotive designs.
What is the role of the 1024-byte OTP array, and how is it secured?
The OTP array contains two independently lockable 512-byte regions used for storing immutable data such as calibration coefficients, cryptographic keys, or device-specific identifiers. Once locked via dedicated CFI commands, OTP regions become permanently read-only - verified by hardware fuse state and enforced by the embedded algorithm controller.
How does the Versatile I/O (VIO) feature impact system-level voltage translation design?
VIO allows the DQ pins to operate at 1.65–VCC independently of the 2.7–3.6 V core supply. This eliminates external level shifters when interfacing with 1.8 V or 2.5 V microcontrollers, reducing BOM count and signal integrity risk - provided VIO is decoupled with its own 100 nF capacitor and referenced to the same ground as VCC.
S29GL256S10DHI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL256S10DHI023 FAQ
1.How can I place an order for S29GL256S10DHI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S10DHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S10DHI023 reliable?
The price and inventory of S29GL256S10DHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10DHI023 is usually 5 days.
3.What payment methods are accepted for S29GL256S10DHI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10DHI023 transactions.
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4.How is shipping managed for S29GL256S10DHI023?
S29GL256S10DHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S10DHI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S10DHI023?
For technical support, including S29GL256S10DHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10DHI023 requirements.
6.How does Aetrix verify that S29GL256S10DHI023 is sourced from the original manufacturer or authorized distributors?
All S29GL256S10DHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10DHI023 meets industry standards.
7.What is the process for return or replacement of S29GL256S10DHI023?
All S29GL256S10DHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10DHI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S10DHI023 part is unused and in its original packaging.
Return procedure for S29GL256S10DHI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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