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Infineon Technologies S29GL256S10DHIV10
- Part No.:
- S29GL256S10DHIV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S10DHIV10.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:500
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Product details
Overview
S29GL256S10DHIV10 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-designed for boot code storage and firmware execution in industrial control and automotive infotainment systems.
For engineers reviewing the S29GL256S10DHIV10 datasheet, S29GL256S10DHIV10 pinout, S29GL256S10DHIV10 application, or S29GL256S10DHIV10 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant interface for standardized firmware update handling.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages all program/erase operations-including suspend/resume-and enforces automatic ECC during read cycles.
The flash array is organized into uniform 128 kB sectors, each individually lockable via Advanced Sector Protection (ASP) using volatile/non-volatile methods. The integrated 1024-byte OTP array includes two separately lockable regions for secure configuration or calibration data storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), enabling full boot image + firmware storage in single chip |
| Random access time | 90 ns at VCC = VIO, meeting real-time XIP latency requirements for MCU boot |
| Page access time | 15 ns, accelerating sequential instruction fetch within same 32-byte page |
| Write buffer size | 512 bytes, allowing single-command programming of up to 256 words for faster firmware updates |
| ECC capability | Hardware single-bit error correction, eliminating need for external ECC logic in safety-critical systems |
| Endurance & retention | 100,000 program/erase cycles and 20-year data retention at 85°C, suitable for long-life deployments |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2), validated for under-hood automotive use |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width), JEDEC MO-141AC compliant, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 32 MB address space (word-aligned) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports Versatile I/O (VIO = 1.65–3.6 V) |
| CE# | Chip enable | Active-low device select; enables internal state machine and power gating |
| OE# | Output enable | Active-low control for data bus drivers during read operations |
| WE# | Write enable | Active-low strobe for latching address/data during program/erase commands |
| RY/BY# | Ready/Busy output | Open-drain status indicator: high = ready, low = active operation in progress |
| WP# | Write protect | Hardware sector protection override; low = disable program/erase to protected sectors |
| VCC | Core supply | 2.7–3.6 V single supply powering core logic, charge pumps, and ECC engine |
| VIO | I/O supply | Independent 1.65–3.6 V supply for interface buffers, decoupled from VCC |
| RESET# | Hardware reset | Active-low asynchronous reset that halts all embedded operations and clears status registers |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse technology | Enables higher density and lower power vs. legacy floating-gate NOR, with improved endurance |
| Asynchronous 32-byte page read | Reduces average instruction fetch latency by >60% compared to full random access in XIP applications |
| 512-byte programming buffer | Increases effective write throughput to 1.5 MBps-critical for fast field firmware updates |
| Hardware ECC engine | Corrects single-bit errors on-the-fly without CPU intervention or software overhead |
| Advanced Sector Protection (ASP) | Allows per-sector locking via volatile (power-cycle reset) or non-volatile (permanent) methods |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated gauge graphics, driver alerts, and real-time CAN message handlers in digital dashboards. IC Role / Device Role / Timing Role: Boot ROM and runtime XIP code storage; executes directly from flash with <90 ns instruction fetch latency. Use Value: AEC-Q100 Grade 2 rating ensures reliable operation at 105°C ambient; 128 kB sector erase enables modular firmware patching without full reflash. | Use Scenario: Holding ladder logic executables, I/O mapping tables, and safety-critical configuration in programmable logic controllers. IC Role / Device Role / Timing Role: Non-volatile firmware repository with hardware ECC to prevent silent corruption in unattended 24/7 operation. Use Value: 100,000 erase cycles and 20-year retention guarantee uptime over 15+ year product lifecycles in factory automation. |
| Medical Imaging Boot Loader | Avionics Display System |
Use Scenario: Hosting secure boot loader and diagnostic self-test routines in MRI/X-ray control units requiring FDA Class II compliance. IC Role / Device Role / Timing Role: Trusted boot source with OTP-locked security keys and CFI-verified parameter table for deterministic initialization. Use Value: Separate 1024-byte OTP array with dual lockable regions stores cryptographic keys and calibration constants immune to field overwrite. | Use Scenario: Storing flight display firmware, font assets, and ARINC 661 widget definitions in cockpit multifunction displays. IC Role / Device Role / Timing Role: High-reliability code storage with suspend/resume capability to avoid interrupt loss during critical flight phases. Use Value: Program/erase suspend allows immediate response to priority interrupts-ensuring deterministic latency under DO-178C Level A timing constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P10TFIV10 | Same density and timing, but 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP option | Preferred for space-constrained PCBs where board area is premium and thermal dissipation is managed via ground plane | Select when footprint reduction and automated assembly compatibility outweigh TSOP's hand-soldering serviceability |
| MX29GL256FHT2I-90G | Macronix part; 90 ns access, but lacks hardware ECC and OTP array; requires external error management | Suitable for cost-sensitive consumer devices where ECC is handled in software or omitted | Choose only if system-level ECC implementation is already in place and AEC-Q100 qualification is not required |
Compared with S29GL256P10TFIV10, this TSOP variant offers easier prototyping and thermal margin in convection-cooled enclosures; versus MX29GL256FHT2I-90G, it delivers certified reliability and built-in data integrity-critical for functional safety applications.
Availability
S29GL256S10DHIV10 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging boot loaders, and avionics display systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29GL256S10DHIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certifications including IATF 16949 and ISO 9001.
The GL-S family targets mission-critical embedded systems demanding deterministic XIP performance, robust data integrity, and AEC-Q100-compliant longevity-especially where firmware must execute reliably across extreme thermal and electrical conditions.
FAQ
What is the purpose of the Versatile I/O (VIO) supply pin?
VIO powers the input/output buffers independently from the core VCC supply, enabling interface voltage flexibility from 1.65 V to 3.6 V. This allows direct connection to 1.8 V, 2.5 V, or 3.3 V host processors without level shifters-reducing BOM count and signal integrity risk in mixed-voltage designs.
Does S29GL256S10DHIV10 support execute-in-place (XIP) operation?
Yes-it is explicitly optimized for XIP with 90 ns random access and 15 ns page-mode read timing. The device delivers full 16-bit instruction words on every bus cycle, and its embedded algorithm controller ensures deterministic latency during program/erase suspend, making it suitable for real-time MCU boot and runtime code execution.
How does the hardware ECC function during normal read operations?
The ECC engine operates transparently on every read access: it calculates syndrome bits, detects single-bit errors, corrects them in real time, and asserts no error flag unless multi-bit corruption occurs. No software intervention or additional read cycles are needed-correction happens within the same tACC window, preserving XIP timing guarantees.
Can the 1024-byte OTP array be used for secure key storage?
Yes-the OTP array is physically one-time-programmable and divided into two independently lockable regions. Once locked, contents cannot be overwritten or read back, making it suitable for storing cryptographic keys, calibration coefficients, or device-specific identifiers in safety- or security-certified systems.
S29GL256S10DHIV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL256S10DHIV10 FAQ
1.How can I place an order for S29GL256S10DHIV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S10DHIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S10DHIV10 reliable?
The price and inventory of S29GL256S10DHIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10DHIV10 is usually 5 days.
3.What payment methods are accepted for S29GL256S10DHIV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10DHIV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S10DHIV10?
S29GL256S10DHIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S10DHIV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S10DHIV10?
For technical support, including S29GL256S10DHIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10DHIV10 requirements.
6.How does Aetrix verify that S29GL256S10DHIV10 is sourced from the original manufacturer or authorized distributors?
All S29GL256S10DHIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10DHIV10 meets industry standards.
7.What is the process for return or replacement of S29GL256S10DHIV10?
All S29GL256S10DHIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10DHIV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S10DHIV10 part is unused and in its original packaging.
Return procedure for S29GL256S10DHIV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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