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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S10DHIV13

Name: S29GL256S10DHIV13
Brand: Infineon Technologies
SKU: S29GL256S10DHIV13
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S10DHIV13

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S10DHIV13.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL256S10DHIV13 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware update storage for industrial microcontroller-based systems.

For engineers reviewing the S29GL256S10DHIV13 datasheet, S29GL256S10DHIV13 pinout, S29GL256S10DHIV13 application, or S29GL256S10DHIV13 equivalent, key selection factors include its 128 kB uniform sector erase granularity, 512-byte write buffer, Versatile I/O support (1.65 V to VCC), AEC-Q100 Grade 3 qualification, and TSOP-56 packaging.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supports page-mode reads (32-byte aligned pages), and uses embedded algorithms for sector erase and buffer programming. Its internal state machine handles command execution without host CPU intervention.

The integrated ECC engine operates transparently during read operations, correcting single-bit errors on-the-fly and reporting uncorrectable multi-bit errors via status register bits. Sector protection includes both volatile (lock-down via command) and non-volatile (hardware write-protect pins + ASP registers) methods.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	256 Mb (32 MB), mapped as 2²³ × 16-bit words-supports full firmware image storage for mid-range MCUs.
Random access time	90 ns at VCC = VIO-enables direct XIP execution from flash with minimal wait states.
Page access time	15 ns-accelerates sequential instruction fetch within 32-byte aligned pages.
Write buffer size	512 bytes-reduces effective programming time by batching up to 256 words per command.
ECC capability	Single-bit error correction with detection of multi-bit errors-ensures data integrity without software overhead.
Sector size	Uniform 128 kB sectors-simplifies firmware partitioning and OTA update management.
Endurance & retention	100,000 program/erase cycles and 20-year data retention-meets long-life industrial deployment requirements.

Pinout & Package

Package: 56-pin Thin Small Outline Package (TSOP-I), 14 mm × 20 mm, standard pitch 0.5 mm, lead-free and RoHS compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address inputs	24-bit address bus supporting full 256 Mb decoding; A23 is MSB for word addressing.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports Versatile I/O voltage range (1.65 V to VCC).
CE#	Chip enable	Active-low chip select; controls device power state and enables internal logic.
OE#	Output enable	Active-low control for data bus drivers; used during read operations only.
WE#	Write enable	Active-low signal initiating write, program, or erase commands.
RY/BY#	Ready/Busy output	Open-drain status indicator: high = ready, low = busy during embedded operations.
WP#	Hardware write protect	Active-low input that disables sector erase and program when asserted.
VCC	Core supply	2.7–3.6 V main supply powering core logic, charge pumps, and I/O buffers.
VIO	I/O supply	Independent 1.65–VCC supply for interface pins-decouples I/O voltage from core rail.
RESET#	Hardware reset	Active-low input forcing device into reset state, clearing status registers and aborting operations.

Key Features

Feature	Design Value
65 nm MIRRORBIT™ Eclipse technology	Enables higher density and lower power vs. older floating-gate NOR, with improved endurance and retention.
Asynchronous 32-byte page read	Reduces average instruction fetch latency in XIP applications by enabling fast intra-page reads after initial 90 ns access.
512-byte programming buffer	Allows host to issue one command for up to 256 words, minimizing bus arbitration overhead and improving effective write throughput to 1.5 MBps.
Advanced sector protection (ASP)	Supports independent lock/unlock of each 128 kB sector via volatile (SRAM-based) and non-volatile (OTP-backed) methods.
Separate 1024-byte OTP array	Provides two lockable regions for secure storage of keys, calibration data, or device-specific configuration without affecting main array.

Applications

Industrial PLC Firmware Storage

Automotive Instrument Cluster Boot Memory

Use Scenario: Storing boot loader and real-time OS kernel in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Non-volatile boot code storage with XIP capability and deterministic 90 ns read latency.

Use Value: Eliminates external RAM copy step during boot, reduces BOM count, and ensures reliable startup after power cycling.

Use Scenario: Holding calibrated display firmware and safety-critical UI assets in automotive digital instrument clusters meeting AEC-Q100 Grade 3.

IC Role / Device Role / Timing Role: AEC-Q100 qualified parallel NOR flash providing verified 20-year data retention at –40°C to +85°C.

Use Value: Enables field-upgradable graphics assets while maintaining ASIL-B compatible failure modes via hardware ECC.

Medical Imaging Device Configuration

Telecom Base Station BIOS Storage

Use Scenario: Retaining calibration profiles, sensor compensation tables, and regulatory compliance metadata across maintenance cycles in portable ultrasound units.

IC Role / Device Role / Timing Role: Secure, sector-protected storage with OTP region for immutable calibration signatures.

Use Value: Prevents accidental overwrite of FDA-required calibration data using hardware WP# and ASP lock bits.

Use Scenario: Hosting BIOS and FPGA configuration bitstreams in carrier-grade 5G baseband units requiring hot-swap resilience and long-term field reliability.

IC Role / Device Role / Timing Role: High-endurance (100K cycles), low-power standby (100 µA) flash for infrequent but critical firmware updates.

Use Value: Supports remote BIOS patching over backhaul links without requiring system reboot or service interruption.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P10TFI010	Same density and architecture, but 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP option.	Targeted at space-constrained PCBs where board area is prioritized over manual reworkability.	Select when footprint reduction and thermal performance outweigh need for socket-based prototyping.
MX29GL256FHT2I-90G	Micron-compatible command set; 90 ns access, but lacks integrated hardware ECC and OTP array.	Requires external ECC handling in host firmware; suitable for cost-sensitive, non-safety-critical designs.	Choose only if host MCU has spare processing bandwidth for software ECC and no secure key storage requirement.

Compared with S29GL256P10TFI010, the S29GL256S10DHIV13 offers easier hand-soldering and test socket compatibility; versus MX29GL256FHT2I-90G, it delivers certified reliability for safety-aware systems via built-in ECC and AEC-Q100 qualification.

Availability

S29GL256S10DHIV13 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical imaging device configuration requiring stable component supply across extended product lifecycles.

Supply support for S29GL256S10DHIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

The GL-S family targets high-reliability embedded systems needing deterministic XIP performance, long data retention, and robust data integrity-designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 or extended temperature operation.

FAQ

What is the maximum operating temperature range for S29GL256S10DHIV13?

This part is rated for Industrial Plus grade: –40°C to +105°C ambient operating temperature. It meets JEDEC JESD47 stress testing requirements and supports continuous operation across this full range without derating. The device uses thermal monitoring circuitry to ensure stable internal voltage generation and ECC functionality under elevated junction temperatures.

Does S29GL256S10DHIV13 support common flash interface (CFI) queries?

Yes, it implements the Common Flash Interface (CFI) parameter table per JEDEC JESD68. Host systems can issue CFI query commands to auto-detect device geometry, timing parameters, and command set version. This enables bootloader portability across different densities in the GL-S family without hard-coded address offsets.

Can S29GL256S10DHIV13 be used with a 1.8 V I/O interface?

Yes, the Versatile I/O feature allows VIO to operate from 1.65 V to VCC. With VCC = 3.3 V, VIO may be set to 1.8 V, enabling direct connection to 1.8 V logic families without level shifters. All input thresholds and output drive strengths are guaranteed across this VIO range per datasheet Section 10.5.

How is sector protection implemented on S29GL256S10DHIV13?

Sector protection uses Advanced Sector Protection (ASP) with both volatile (SRAM-based lock bits cleared on power loss) and non-volatile (OTP-backed lock bits) methods. Hardware WP# pin provides global write disable, while individual 128 kB sectors can be locked/unlocked via command sequences written to specific address locations defined in the datasheet's Section 3.4.

S29GL256S10DHIV13 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL256S10DHIV13 FAQ

1.How can I place an order for S29GL256S10DHIV13 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10DHIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10DHIV13 reliable?

The price and inventory of S29GL256S10DHIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10DHIV13 is usually 5 days.

3.What payment methods are accepted for S29GL256S10DHIV13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10DHIV13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10DHIV13?

S29GL256S10DHIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10DHIV13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10DHIV13?

For technical support, including S29GL256S10DHIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10DHIV13 requirements.

6.How does Aetrix verify that S29GL256S10DHIV13 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10DHIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10DHIV13 meets industry standards.

7.What is the process for return or replacement of S29GL256S10DHIV13?

All S29GL256S10DHIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10DHIV13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10DHIV13 part is unused and in its original packaging.

Return procedure for S29GL256S10DHIV13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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