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Infineon Technologies S29GL256S10DHIV23
- Part No.:
- S29GL256S10DHIV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S10DHIV23.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,434
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Product details
Overview
S29GL256S10DHIV23 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile program retention.
For engineers reviewing the S29GL256S10DHIV23 datasheet, S29GL256S10DHIV23 pinout, S29GL256S10DHIV23 application, or S29GL256S10DHIV23 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant software interface.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supports both standard and page-mode reads, and uses embedded algorithms for sector erase and buffered programming without external timing control. Its internal state machine handles command execution, status reporting via RY/BY#, and automatic ECC generation/correction during read cycles.
The GL-S architecture separates address decoding (X/Y decoders), voltage generation (VPP for erase/program), and protection logic (ASP, OTP lock regions), enabling concurrent suspend/resume of program/erase operations and hardware-based sector locking independent of software control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 2,097,152 × 16-bit words - defines maximum firmware image size and partitioning flexibility |
| Random access time | 90 ns at VCC = VIO - enables direct XIP execution from flash with minimal CPU wait states |
| Page access time | 15 ns - accelerates sequential instruction fetch within 32-byte aligned pages |
| Write buffer size | 512 bytes (256 words) - reduces average programming time per byte by batching writes |
| ECC capability | Single-bit error correction per 512-byte sector - ensures data integrity without host-side correction logic |
| Endurance | 100,000 program/erase cycles per sector - supports field firmware updates over product lifetime |
| Data retention | 20 years at 85°C - guarantees long-term reliability in unpowered industrial environments |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint. Pin-compatible with legacy S29GLxxxS family devices in same package variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit word-aligned address bus; A23 is MSB for 256 Mb density (223 × 16 = 32 MB) |
| DQ0–DQ15 | Data I/O bus | 16-bit bidirectional data path; supports high-speed page reads and buffered writes |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching timing (tCE ≤ 90 ns) |
| OE# | Output enable | Active-low read strobe; gates output drivers during asynchronous read (tOE ≤ 25 ns) |
| WE# | Write enable | Active-low control for write/program commands; initiates command register loading sequence |
| RY/BY# | Ready/Busy indicator | Open-drain status output; low during embedded operations (erase/program), high when idle or ready |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into known state, clears status register and aborts ongoing operations |
| VCC | Core supply | 2.7–3.6 V single supply powering core logic, charge pumps, and internal regulators |
| VIO | I/O supply | 1.65–3.6 V independent I/O rail - enables interfacing with mixed-voltage SoCs without level shifters |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65–3.6 V independently of VCC - eliminates external level-shifting for 1.8 V/3.3 V host interfaces |
| 512-byte write buffer | Enables 1.5 MBps effective programming rate - cuts firmware update time vs. single-word programming by >10× |
| Uniform 128-kB sectors | 256 identical erase blocks simplify BOM management and reduce risk of partial-erase corruption |
| Hardware ECC engine | Corrects single-bit errors on-the-fly during read - removes need for host-side ECC software overhead |
| OTP array with dual lock | 1024-byte one-time-programmable region split into two independently lockable sections - secures bootloader keys and calibration data |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and safety-critical configuration data in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile boot ROM providing XIP-capable instruction fetch with deterministic 90 ns latency under thermal stress. Use Value: 20-year data retention at 85°C and 100,000 erase cycles ensure firmware integrity across extended maintenance intervals without refresh. |
Use Scenario: Hosting boot code and sensor calibration tables for radar/EPS ECUs certified to AEC-Q100 Grade 2 (–40°C to +105°C). IC Role / Device Role / Timing Role: AEC-Q100 qualified parallel NOR flash acting as primary boot device with hardware ECC for ASIL-B functional safety compliance. Use Value: Integrated single-bit ECC and sector-level ASP meet ISO 26262 requirements for fault detection and mitigation without external redundancy. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Storing diagnostic firmware and regulatory-certified boot images in FDA-cleared imaging equipment with strict revision traceability. IC Role / Device Role / Timing Role: Secure, CFI-compliant flash memory supporting field updates via JTAG while maintaining immutable OTP-locked bootloader signature. Use Value: Dual-lock OTP array prevents unauthorized modification of cryptographic keys, satisfying IEC 62304 software lifecycle requirements. |
Use Scenario: Holding FPGA configuration bitstreams and runtime parameter tables in carrier-grade 5G baseband units requiring hot-swap resilience. IC Role / Device Role / Timing Role: High-reliability parallel flash with suspend/resume capability enabling background firmware updates without service interruption. Use Value: Program/erase suspend allows real-time traffic continuity during remote configuration updates, minimizing network downtime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P10TFI020 | Same density and timing, but 64-ball LAE FBGA (9 mm × 9 mm); no Versatile I/O (VIO fixed to VCC) | Preferred for space-constrained PCBs where board area is critical and host I/O voltage matches VCC | Select when footprint reduction outweighs need for mixed-voltage interface flexibility |
| MX29GL256FHT2I-90G | Macronix part; 90 ns access, but lacks hardware ECC and OTP array; requires external error handling | Suitable for cost-sensitive consumer applications where ECC is managed in software or not required | Choose only if system-level ECC implementation is already present and AEC-Q100 qualification is unnecessary |
Compared with S29GL256P10TFI020, this TSOP variant offers superior I/O voltage flexibility and industrial temperature margin; versus MX29GL256FHT2I-90G, it delivers built-in ECC and secure OTP-critical for safety- and security-critical embedded systems.
Availability
S29GL256S10DHIV23 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended product lifecycles.
Supply support for S29GL256S10DHIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-S family targets high-reliability embedded systems needing deterministic XIP performance, robust data retention, and integrated security features - designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 or extended temperature operation.
FAQ
Does S29GL256S10DHIV23 support execute-in-place (XIP) operation?
Yes. The device supports true XIP with 90 ns random access time and 15 ns page-mode reads, enabling CPU instruction fetch directly from flash without copying to RAM. Its architecture includes dedicated address/data paths and internal prefetch logic optimized for sequential instruction flow in microcontroller boot sequences.
What is the function of the Versatile I/O (VIO) pin?
VIO sets the input/output voltage level independently of VCC, ranging from 1.65 V to 3.6 V. This allows direct interfacing with 1.8 V or 2.5 V microcontrollers while maintaining 3.0 V core operation, eliminating external level shifters and reducing BOM count and signal integrity risk in mixed-voltage designs.
How does the hardware ECC work during read operations?
The internal ECC engine automatically calculates and checks Hamming codes on every 512-byte sector read. If a single-bit error is detected, it is corrected transparently before data reaches DQ pins; the status register flags correction events, and no host intervention or additional latency is required.
Can sector protection be configured dynamically during runtime?
Yes. Advanced Sector Protection (ASP) supports both volatile (cleared on power cycle) and non-volatile (persistent) locking modes per 128 kB sector. Locking is controlled via CFI-compliant commands and can be modified in-system using standard write sequences without requiring special voltage conditions or packaging-level fuses.
S29GL256S10DHIV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL256S10DHIV23 FAQ
1.How can I place an order for S29GL256S10DHIV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S10DHIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S10DHIV23 reliable?
The price and inventory of S29GL256S10DHIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10DHIV23 is usually 5 days.
3.What payment methods are accepted for S29GL256S10DHIV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10DHIV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S10DHIV23?
S29GL256S10DHIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S10DHIV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S10DHIV23?
For technical support, including S29GL256S10DHIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10DHIV23 requirements.
6.How does Aetrix verify that S29GL256S10DHIV23 is sourced from the original manufacturer or authorized distributors?
All S29GL256S10DHIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10DHIV23 meets industry standards.
7.What is the process for return or replacement of S29GL256S10DHIV23?
All S29GL256S10DHIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10DHIV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S10DHIV23 part is unused and in its original packaging.
Return procedure for S29GL256S10DHIV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S10DHIV23 Tags
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