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Infineon Technologies S29GL256S10DHSS50

Part No.:
S29GL256S10DHSS50
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL256S10DHSS50.pdf
Description:
IC FLASH 256MBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:841

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Product details

Overview

S29GL256S10DHSS50 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse technology. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction - deployed in automotive instrument clusters requiring fast XIP boot code execution and robust firmware storage.

For engineers reviewing the S29GL256S10DHSS50 datasheet, S29GL256S10DHSS50 pinout, S29GL256S10DHSS50 application, or S29GL256S10DHSS50 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant software interface.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supports page-mode reads (32-byte aligned pages), and uses embedded algorithms for sector erase and buffered programming. Its internal state machine handles command execution, status reporting via RY/BY# pin or status register, and automatic ECC generation/correction during read operations.

The GL-S architecture separates address decoding (X/Y decoders), erase/program voltage generation, and sector protection logic into dedicated blocks. Sector-level lock bits (volatile/non-volatile ASP), OTP array (1024 bytes, two lockable regions), and suspend/resume capability enable deterministic firmware update sequencing in safety-critical automotive ECUs.

Key Specifications

Parameter Value and Actual Design Meaning
Memory density 256 Mb (32 MB), organized as 2,097,152 × 16-bit words - sufficient for full bootloader + dual-application image storage in automotive gateways.
Random access time 90 ns at VCC = VIO - enables sub-11 MHz CPU wait-state-free XIP execution from flash in Cortex-R5-based controllers.
Page access time 15 ns - allows burst reads within 32-byte pages without re-addressing, improving sequential instruction fetch efficiency.
Write buffer size 512 bytes (256 words) - reduces effective programming time by >3× vs. single-word writes, critical for OTA firmware patching.
ECC capability On-the-fly single-bit error correction with detection of multi-bit errors - meets ISO 26262 ASIL-B data integrity requirements.
Endurance & retention 100,000 program/erase cycles and 20-year data retention - validated for 15-year vehicle lifecycle under industrial plus temperature grade.
Operating temperature –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood ECU deployment without derating.

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width). Pinout conforms to standard parallel NOR flash layout with CE#, OE#, WE#, RESET#, RY/BY#, and 16-bit bidirectional DQ bus.

Pin/Terminal Circuit Role Design Meaning
A0–A23 Address inputs Word-aligned address bus; A23 is MSB for 256 Mb density - supports linear mapping without bank switching.
DQ0–DQ15 Data I/O 16-bit bidirectional data bus; compatible with ARM Cortex-M/R and Power Architecture microcontrollers' external memory interfaces.
CE# Chip enable Active-low chip select; controls device power state and enables multi-device memory expansion with address decoding.
OE# Output enable Active-low read strobe; gates output drivers to prevent bus contention during shared-memory multiplexing.
WE# Write enable Active-low write strobe; initiates internal program/erase commands when combined with valid address/data sequences.
RY/BY# Ready/Busy indicator Open-drain status output; low during embedded operations - used for hardware polling instead of software status register reads.
RESET# Hardware reset Active-low asynchronous reset; forces device into known state and aborts ongoing program/erase operations safely.

Key Features

Feature Design Value
Versatile I/O voltage range VIO supports 1.65–3.6 V independently - eliminates level shifters when interfacing with 1.8 V or 3.3 V SoCs.
Uniform 128 kB sectors 256 erasable sectors with individual lock/unlock control - enables fine-grained firmware partitioning (e.g., separate boot/app/parameter sectors).
512-byte write buffer Enables full-page programming in one command - cuts typical OTA firmware update time from ~2.1 s to <700 ms at 1.5 MBps.
Hardware ECC engine Single-bit correction with multi-bit detection built into read path - removes need for external ECC logic or software overhead.
Secure silicon region 1024-byte OTP array with two independent lockable regions - stores cryptographic keys or calibration data that cannot be overwritten.

Applications

Automotive Instrument Cluster Industrial PLC Firmware Storage

Use Scenario: Storing boot code, GUI assets, and real-time gauge rendering firmware in digital dashboards.

IC Role / Device Role / Timing Role: Primary XIP-executable code storage with deterministic 90 ns read latency and AEC-Q100 Grade 2 thermal resilience.

Use Value: Enables zero-wait-state CPU execution and supports over-the-air updates via 512-byte buffered programming without interrupting display refresh.

Use Scenario: Holding field-upgradable ladder logic, I/O configuration tables, and safety monitor firmware in modular controllers.

IC Role / Device Role / Timing Role: Non-volatile program memory with sector-level write protection and 20-year data retention under continuous 85°C operation.

Use Value: Eliminates external backup batteries and guarantees firmware integrity across 100,000+ power cycles in factory automation environments.

Automotive ADAS Camera Module Medical Diagnostic Imaging Bootloader

Use Scenario: Storing camera ISP firmware, lens calibration data, and fail-safe recovery images in front-facing ADAS cameras.

IC Role / Device Role / Timing Role: Dual-image storage with hardware ECC and suspend/resume - ensures safe firmware swap during vehicle ignition cycles.

Use Value: Prevents boot failure due to bit flips; supports concurrent read (active image) and program (update) via buffer and sector isolation.

Use Scenario: Hosting certified bootloader, secure boot keys in OTP, and regulatory-compliant diagnostic firmware in portable ultrasound systems.

IC Role / Device Role / Timing Role: Safety-critical boot memory with ASIL-B compliant ECC, 1024-byte lockable OTP, and CFI-standardized interface for FDA audit traceability.

Use Value: Meets IEC 62304 Class C software requirements by guaranteeing immutable boot code and detectable corruption before system initialization.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29GL256P10TFIR20 Same density and timing, but 64-ball LAE FBGA (9 mm × 9 mm); no Versatile I/O (VIO fixed to VCC) Preferred for space-constrained PCBs where board area is critical and I/O voltage matching is guaranteed Select when footprint reduction outweighs flexibility in mixed-voltage system interfacing
MX29GL256FHT2I-90G Macronix part; 90 ns access, but lacks hardware ECC and OTP array; only 10,000 P/E cycles Suitable for cost-sensitive consumer electronics where ASIL or long-term reliability not required Choose only for non-safety applications with shorter product lifecycles and no ECC dependency

Compared with S29GL256P10TFIR20, this TSOP-packaged variant offers superior I/O voltage flexibility and automotive qualification; versus MX29GL256FHT2I-90G, it delivers certified ECC, higher endurance, and secure OTP - essential for functional safety and long-lifecycle deployments.

Availability

S29GL256S10DHSS50 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, ADAS camera modules, and medical diagnostic imaging systems requiring stable component supply across extended product lifecycles.

Supply support for S29GL256S10DHSS50 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D infrastructure.

The GL-S family targets high-reliability embedded systems needing fast XIP execution and robust firmware storage - specifically engineered for automotive, industrial, and medical applications demanding AEC-Q100 qualification and 20-year data retention.

FAQ

Is S29GL256S10DHSS50 pin-compatible with earlier S29GL256N or S29GL256P variants?

No. While functionally similar, S29GL256S introduces revised timing parameters, enhanced ECC handling, and updated command set compatibility. Pinout remains identical for the 56-pin TSOP package, but firmware must be validated against the S29GL256S-specific command table and status register definitions in Rev. *U datasheet.

Does this device support synchronous read mode or DDR interface?

No. S29GL256S10DHSS50 is strictly asynchronous and uses standard parallel NOR timing - no clock input, no DDR capability. It supports only asynchronous read, page-mode read, and command-defined program/erase operations per the CFI specification.

Can the 1024-byte OTP array be reprogrammed after locking?

No. Once a region of the OTP array is locked (via dedicated command sequence), it becomes permanently read-only. The lock is enforced by fuse-based hardware; no unlock command exists, and attempts to rewrite yield status register error flags.

What is the maximum sustained write throughput using the 512-byte buffer?

At rated 1.5 MBps, the device achieves ~333 µs per 512-byte buffer write, including command overhead and internal verification. Real-world throughput drops to ~1.2 MBps under worst-case conditions (e.g., high temperature, marginal VCC), as confirmed in Section 5.7 of the datasheet.

S29GL256S10DHSS50 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
64-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
16M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
100 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
0°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (9x9)

S29GL256S10DHSS50 FAQ

1.How can I place an order for S29GL256S10DHSS50 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10DHSS50 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10DHSS50 reliable?

The price and inventory of S29GL256S10DHSS50 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10DHSS50 is usually 5 days.

3.What payment methods are accepted for S29GL256S10DHSS50?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10DHSS50 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10DHSS50?

S29GL256S10DHSS50 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10DHSS50 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10DHSS50?

For technical support, including S29GL256S10DHSS50 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10DHSS50 requirements.

6.How does Aetrix verify that S29GL256S10DHSS50 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10DHSS50 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10DHSS50 meets industry standards.

7.What is the process for return or replacement of S29GL256S10DHSS50?

All S29GL256S10DHSS50 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10DHSS50, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10DHSS50 part is unused and in its original packaging.

Return procedure for S29GL256S10DHSS50:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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