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Infineon Technologies S29GL256S10DHV010

Part No.:
S29GL256S10DHV010
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL256S10DHV010.pdf
Description:
IC FLASH 256MBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,762

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Product details

Overview

S29GL256S10DHV010 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, and 15 ns page access time. It integrates hardware ECC for single-bit error correction, 128-kB uniform sector erase, and a 512-byte write buffer-enabling fast embedded code storage and execution in automotive instrument clusters, industrial PLC firmware, and network router boot memory.

For engineers reviewing the S29GL256S10DHV010 datasheet, S29GL256S10DHV010 pinout, S29GL256S10DHV010 application, or S29GL256S10DHV010 equivalent, this device supports asynchronous XIP-capable read, Versatile I/O (1.65–VCC), AEC-Q100 Grade 2 (–40°C to +105°C), and CFI-compliant software interface for reliable firmware update and boot code integrity in safety-critical systems.

Technical Context

This GL-S family device implements a 65 nm MIRRORBIT™ Eclipse architecture with dual-bit-per-cell storage, enabling high density without sacrificing endurance. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, suspend/resume capability, and status reporting via ready/busy# pin, status register, or data polling.

The device uses word-aligned addressing (A0–A22), supports 32-byte page reads, and features separate 1024-byte OTP array with two lockable regions. Sector protection includes volatile (SRAM-based) and non-volatile (flash-based) methods per 128-kB sector, plus hardware reset and WP#-controlled write protection.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256 Mb (32 MB), organized as 2,097,152 × 16-bit words - sufficient for full boot firmware + configuration data in mid-tier embedded controllers.
Access Time 90 ns random access, 15 ns page access - enables real-time XIP execution with minimal CPU stall cycles in ARM Cortex-M7/M4 systems.
Write Buffer 512-byte (256-word) buffer - reduces effective programming time by >3× vs. single-word writes, critical for field firmware updates.
ECC Support On-die hardware single-bit error correction - eliminates need for external ECC logic and ensures data integrity over 20-year retention.
Endurance & Retention 100,000 program/erase cycles and 20 years data retention - validated for automotive ECU logging and industrial control firmware storage.
Operating Voltage VCC = 2.7–3.6 V; VIO = 1.65–VCC - allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V I/O domains without level shifters.
Temperature Grade AEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood automotive applications including ADAS domain controllers.

Pinout & Package

Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.65 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal Circuit Role Design Meaning
A0–A22 Address Inputs Word-aligned address lines (23 bits); A22 selects highest 128-kB sector - supports full 32 MB address space with no bank switching.
DQ0–DQ15 Data I/O 16-bit bidirectional data bus; operates at VIO voltage - enables mixed-voltage system integration without external translators.
CE# Chip Enable Active-low chip select; tCE = 90 ns (VCC = VIO) - defines minimum enable-to-access latency for multi-device memory buses.
OE# Output Enable Active-low output control; tOE = 25 ns - determines read data valid window timing relative to address setup.
WE# Write Enable Active-low write strobe; initiates program/erase commands when CE# and OE# are inactive - essential for command sequence execution.
RY/BY# Ready/Busy Output Open-drain status indicator; low during embedded operations - provides hardware handshaking for interrupt-driven firmware updates.
WP# Write Protect Hardware sector lock override; active-low - enables permanent or temporary protection of critical boot sectors against accidental overwrite.
RESET# Hardware Reset Asynchronous reset input; forces device into reading state - used for recovery after power brownout or invalid command sequences.

Key Features

Feature Design Value
65 nm MIRRORBIT™ Eclipse technology Dual-bit-per-cell storage increases density while maintaining 100K cycle endurance - reduces PCB footprint vs. legacy 90 nm NOR flash.
Asynchronous 32-byte page read Enables burst-like sequential access within page boundaries with 15 ns cycle time - improves instruction fetch throughput in XIP mode.
Automatic ECC with single-bit correction Corrects bit errors on-the-fly during read; no software overhead or latency penalty - required for ASIL-B functional safety compliance.
Advanced Sector Protection (ASP) Per-sector volatile/non-volatile locking via status register or CFI commands - prevents unauthorized firmware modification in secure boot chains.
1024-byte OTP array with dual lock regions Stores immutable keys, calibration data, or serial numbers; each region independently lockable - supports cryptographic root-of-trust implementation.

Applications

Automotive Instrument Cluster Industrial PLC Firmware Storage

Use Scenario: Storing calibrated gauge graphics, driver alert logic, and CAN message lookup tables in digital dashboards.

IC Role / Device Role / Timing Role: Boot-time XIP code execution and runtime parameter storage with AEC-Q100 Grade 2 thermal reliability.

Use Value: 90 ns random access ensures <50 µs GUI frame load latency; hardware ECC guarantees display integrity over 15-year vehicle life.

Use Scenario: Holding ladder logic firmware, I/O mapping tables, and real-time OS kernel in modular programmable logic controllers.

IC Role / Device Role / Timing Role: Non-volatile firmware repository with sector-level write protection and 100K-cycle endurance for frequent field updates.

Use Value: 512-byte write buffer cuts firmware upload time by 70% vs. byte-programming; OTP stores unique device identifiers for traceability.

Network Router Boot Memory Medical Imaging System Configuration

Use Scenario: Hosting U-Boot bootloader, Linux kernel image, and device tree binaries in enterprise-grade edge routers.

IC Role / Device Role / Timing Role: Parallel NOR flash providing deterministic boot timing and CFI-compliant firmware upgrade interface.

Use Value: CFI parameter table enables auto-detection by bootloader; 20-year data retention ensures unattended operation in remote deployments.

Use Scenario: Storing DICOM protocol profiles, sensor calibration coefficients, and regulatory compliance flags in portable ultrasound units.

IC Role / Device Role / Timing Role: Secure, tamper-resistant configuration store with OTP-locked calibration data and ASP-protected operational modes.

Use Value: Dual-lock OTP prevents recalibration drift; ASP allows clinical staff to lock diagnostic modes while permitting service-mode updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29GL256P10TFV010 Same density and core voltage, but 64-ball LAE BGA (9 mm × 9 mm); lacks OTP array and ASP non-volatile lock mode. Targeted at cost-sensitive consumer gateways where OTP security and permanent sector locking are not required. Select when board space permits larger BGA and firmware security requirements are limited to volatile protection only.
MX29GL256FHT2I-90G 256 Mb, 90 ns access, but 3.3 V only (no Versatile I/O); no on-die ECC; 50K endurance cycles; different CFI layout. Suitable for legacy industrial HMIs with fixed 3.3 V I/O and simpler update workflows lacking ECC dependency. Choose only if existing design already uses Macronix toolchain and does not require AEC-Q100 qualification or hardware ECC.

Compared with S29GL256P10TFV010 and MX29GL256FHT2I-90G, the S29GL256S10DHV010 uniquely delivers AEC-Q100 Grade 2 qualification, integrated ECC, OTP with dual lock, and Versatile I/O - making it the sole option for automotive and safety-certified medical firmware storage requiring guaranteed data integrity and flexible voltage interfacing.

Availability

S29GL256S10DHV010 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, and network router boot memory requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL256S10DHV010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive microcontrollers, and trusted security solutions, with global manufacturing and automotive qualification expertise.

The GL-S family targets high-reliability embedded systems requiring deterministic boot performance, firmware security, and long-term data retention - specifically engineered for automotive ECUs, industrial controllers, and networking infrastructure.

FAQ

Does S29GL256S10DHV010 support execute-in-place (XIP) operation?

Yes. The device supports true asynchronous XIP with 90 ns random access and 15 ns page-mode read, enabling CPU instruction fetch directly from flash without RAM loading. Its 32-byte page alignment and deterministic timing meet ARM Cortex-M and Power Architecture XIP requirements for real-time boot and firmware execution.

What is the function of the RY/BY# pin during programming?

RY/BY# is an open-drain output that goes low during embedded program or erase operations and returns high when complete. It provides hardware handshaking for interrupt-driven firmware updates and can be polled alongside status register bits to avoid busy-wait loops, reducing CPU utilization during flash operations.

How does the Versatile I/O feature simplify system design?

Versatile I/O allows independent VIO supply (1.65 V to VCC) for the DQ[15:0] bus, enabling direct connection to 1.8 V, 2.5 V, or 3.3 V logic without level shifters. This reduces BOM count, PCB area, and signal integrity risk in mixed-voltage SoC interfaces such as NXP S32K or Renesas RH850 designs.

Can the OTP array be reprogrammed after locking?

No. Once either of the two 512-byte OTP lock bits is set (via CFI command), that region becomes permanently read-only. The lock is irreversible and enforced by on-die fuse logic - ensuring cryptographic keys or calibration data remain tamper-proof throughout the device's lifetime, meeting ISO 26262 ASIL-B requirements.

S29GL256S10DHV010 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
64-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
16M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
100 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (9x9)

S29GL256S10DHV010 FAQ

1.How can I place an order for S29GL256S10DHV010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10DHV010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10DHV010 reliable?

The price and inventory of S29GL256S10DHV010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10DHV010 is usually 5 days.

3.What payment methods are accepted for S29GL256S10DHV010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10DHV010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10DHV010?

S29GL256S10DHV010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10DHV010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10DHV010?

For technical support, including S29GL256S10DHV010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10DHV010 requirements.

6.How does Aetrix verify that S29GL256S10DHV010 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10DHV010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10DHV010 meets industry standards.

7.What is the process for return or replacement of S29GL256S10DHV010?

All S29GL256S10DHV010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10DHV010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10DHV010 part is unused and in its original packaging.

Return procedure for S29GL256S10DHV010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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