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Infineon Technologies S29GL256S10DHV013
- Part No.:
- S29GL256S10DHV013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S10DHV013.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,584
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Product details
Overview
S29GL256S10DHV013 from Infineon is a 256 Mb (32 MB), 16-bit parallel NOR flash memory using 65 nm MIRRORBIT™ Eclipse technology, with 90 ns random access time, 15 ns page access time, and single 3.0 V supply (2.7–3.6 V) for read/program/erase - deployed in industrial embedded systems for firmware storage and boot code execution.
For engineers reviewing the S29GL256S10DHV013 datasheet, S29GL256S10DHV013 pinout, S29GL256S10DHV013 application, or S29GL256S10DHV013 equivalent, this device supports asynchronous XIP-capable reads, 512-byte buffer programming, hardware ECC, uniform 128-kB sector erase, and versatile I/O (1.65–3.6 V), critical for reliable boot memory in automotive ECUs and industrial controllers.
Technical Context
This device implements an asynchronous parallel interface with ×16 data bus, 23-bit address space (A0–A22), and supports page-mode reads (32-byte aligned pages) with 15 ns intra-page access. It integrates an embedded algorithm controller (EAC) to manage program/erase operations without external timing control.
Hardware ECC provides single-bit error correction per 512-byte sector; status monitoring uses ready/busy# pin, data polling, and status register. Sector protection includes volatile/non-volatile lock bits and a separate 1024-byte OTP array with two lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 2,097,152 × 16-bit words - sufficient for full firmware images in mid-tier microcontrollers. |
| Random access time (tACC) | 90 ns at VCC = VIO - enables fast instruction fetch in XIP configurations without external cache. |
| Page access time (tPACC) | 15 ns - allows rapid sequential reads within 32-byte aligned pages during code execution. |
| Programming buffer size | 512 bytes (256 words) - reduces effective programming time by >3× vs. single-word writes. |
| Erase block size | Uniform 128 kB sectors (128 sectors total) - simplifies wear leveling and firmware update partitioning. |
| Endurance & retention | 100,000 program/erase cycles and 20-year data retention - meets long-life requirements in industrial gateways. |
| Operating temperature | –40°C to +105°C (Industrial Plus grade) - qualified for under-hood automotive and factory-floor applications. |
Pinout & Package
Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit address bus supporting full 256 Mb addressing; A22 is MSB for word-aligned access. |
| DQ0–DQ15 | Data I/O (bidirectional) | 16-bit parallel data path; supports both read and write transfers on same pins with direction controlled by WE# and OE#. |
| CE# | Chip enable | Active-low chip select; device enters low-power standby when high; tCE = 90 ns max. |
| OE# | Output enable | Active-low output control; enables data drivers during read; tOE = 25 ns max. |
| WE# | Write enable | Active-low write strobe; initiates command latching and embedded program/erase sequences. |
| RY/BY# | Ready/Busy indicator | Open-drain output; low during active program/erase; used for hardware flow control without polling. |
| VCC | Core power supply | Single 2.7–3.6 V supply powers core logic, charge pumps, and internal ECC engine. |
| VIO | I/O voltage supply | Independent 1.65–3.6 V supply for DQ and control pins - enables interfacing with 1.8 V or 3.3 V host processors. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page-mode read | 32-byte aligned page access with 15 ns intra-page cycle time - accelerates linear code execution in XIP mode. |
| Hardware ECC engine | On-die single-bit error correction per 512-byte sector - eliminates need for external ECC logic in safety-critical firmware storage. |
| Versatile I/O (VIO) | Independent 1.65–3.6 V I/O rail - allows direct connection to 1.8 V FPGA I/O banks or 3.3 V MCU buses without level shifters. |
| Advanced sector protection (ASP) | Volatile and non-volatile lock bits per 128 kB sector - enables secure bootloader partitioning and field-upgrade-safe application zones. |
| OTP array | 1024-byte one-time-programmable region with two independently lockable 512-byte blocks - stores cryptographic keys or calibration data irreversibly. |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps and real-time control algorithms in AEC-Q100 Grade 2 (–40°C to +105°C) ECU modules. IC Role / Device Role / Timing Role: Boot ROM and persistent firmware store; executes code in-place via parallel bus with <90 ns latency. Use Value: Hardware ECC ensures bit-error resilience over 15+ years of thermal cycling; ASP prevents accidental overwrite of safety-critical calibration sectors. |
Use Scenario: Holding firmware and configuration data for programmable logic controllers operating continuously in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile program memory with deterministic read latency and field-upgradable sector erase. Use Value: 128 kB uniform sectors simplify firmware delta updates; 512-byte buffer programming cuts reflash time by 70% vs. byte-wise writes. |
| Medical Imaging System Boot Memory | Telecom Base Station Configuration Store |
Use Scenario: Secure boot image storage in FDA-cleared diagnostic imaging equipment requiring data integrity certification. IC Role / Device Role / Timing Role: Trusted boot ROM with OTP-locked security keys and CFI-compliant identification for BIOS validation. Use Value: Separate 1024-byte OTP array enables permanent key binding; CFI table allows runtime compatibility verification during system startup. |
Use Scenario: Storing FPGA configuration bitstreams and radio parameter tables in outdoor 5G base station remote radio units (RRUs). IC Role / Device Role / Timing Role: High-reliability configuration store interfacing with 1.8 V FPGA configuration interfaces via VIO. Use Value: Versatile I/O supports direct 1.8 V FPGA I/O without level shifters; 20-year retention guarantees parameter persistence across 10+ year deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S10TFI010 | Same die, 56-pin TSOP-56 package (vs. VBU BGA); no VIO support - fixed 3.0 V I/O. | Limited to PCBs with legacy TSOP footprints; incompatible with high-density BGA layouts. | Select for cost-sensitive, space-tolerant designs where board real estate permits TSOP. |
| MX29GL256FPTI-90G | Macronix 256 Mb parallel NOR; 90 ns tACC but no hardware ECC or OTP array; CFI-compatible but lacks ASP granularity. | Suitable for non-safety firmware where ECC is handled externally; no secure key storage capability. | Choose only if ECC and OTP are not required, and lower unit cost outweighs reliability trade-offs. |
Compared with S29GL256S10TFI010 and MX29GL256FPTI-90G, the S29GL256S10DHV013 uniquely combines BGA miniaturization, independent VIO, on-die ECC, and OTP - making it the only option meeting AEC-Q100 Grade 2 + secure boot + compact layout requirements simultaneously.
Availability
S29GL256S10DHV013 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC firmware updates, and medical imaging boot memory applications requiring stable component supply across extended product lifecycles.
Supply support for S29GL256S10DHV013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and secure embedded solutions, with global manufacturing and quality certifications including IATF 16949 and ISO 9001.
The GL-S family targets high-reliability embedded systems needing XIP-capable NOR flash with integrated data integrity features - designed specifically for automotive, industrial, and medical applications demanding long-term firmware stability and security.
FAQ
Does S29GL256S10DHV013 support execute-in-place (XIP) operation?
Yes, it supports true XIP operation via its asynchronous parallel interface and fast 90 ns random access time. The device delivers 16-bit words on DQ0–DQ15 without external wait states, enabling direct CPU instruction fetch from flash memory in microcontroller-based systems.
What is the function of the VIO pin, and can it be tied to VCC?
VIO supplies power to the I/O buffers independently of VCC and must be set between 1.65 V and VCC. It can be tied to VCC only if the host interface operates at the same voltage; otherwise, it enables mixed-voltage interfacing - e.g., 3.3 V VCC core with 1.8 V FPGA I/O.
How does the hardware ECC work, and is it configurable?
The ECC engine automatically corrects single-bit errors per 512-byte sector during read operations and reports uncorrectable multi-bit errors via the status register. It is always enabled and non-configurable - no software initialization or register setting is required.
Is the 1024-byte OTP array truly one-time programmable?
Yes - each of the two 512-byte OTP regions can be permanently locked after programming using dedicated CFI commands. Once locked, bits cannot be altered or erased, providing tamper-resistant storage for cryptographic keys or calibration constants.
S29GL256S10DHV013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL256S10DHV013 FAQ
1.How can I place an order for S29GL256S10DHV013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S10DHV013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S10DHV013 reliable?
The price and inventory of S29GL256S10DHV013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10DHV013 is usually 5 days.
3.What payment methods are accepted for S29GL256S10DHV013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10DHV013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S10DHV013?
S29GL256S10DHV013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S10DHV013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S10DHV013?
For technical support, including S29GL256S10DHV013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10DHV013 requirements.
6.How does Aetrix verify that S29GL256S10DHV013 is sourced from the original manufacturer or authorized distributors?
All S29GL256S10DHV013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10DHV013 meets industry standards.
7.What is the process for return or replacement of S29GL256S10DHV013?
All S29GL256S10DHV013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10DHV013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S10DHV013 part is unused and in its original packaging.
Return procedure for S29GL256S10DHV013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S10DHV013 Tags
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M24C02-WMN6TP
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M24C02-FMC6TG
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Microchip Technology
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