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Infineon Technologies S29GL256S10DHV023
- Part No.:
- S29GL256S10DHV023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S10DHV023.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,487
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Product details
Overview
S29GL256S10DHV023 from Infineon is a 256 Mb (32 MB), 16-bit parallel NOR flash memory using 65 nm MIRRORBIT™ Eclipse technology, operating from a single 2.7–3.6 V supply with 90 ns random access time and 15 ns page access time. It integrates hardware ECC for single-bit correction, 128 kB uniform sector erase, and a 512-byte write buffer-enabling fast in-system programming for boot code storage in industrial microcontroller-based systems.
For engineers reviewing the S29GL256S10DHV023 datasheet, S29GL256S10DHV023 pinout, S29GL256S10DHV023 application, or S29GL256S10DHV023 equivalent, key selection criteria include its asynchronous 16-bit interface, Versatile I/O (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), 100,000 program/erase cycles, and OTP array support for secure configuration storage.
Technical Context
This device implements an embedded algorithm controller (EAC) that executes autonomous program and erase operations without external timing control. Its architecture supports page-mode read (32-byte aligned, 15 ns subsequent access) and buffer programming (up to 512 bytes per command), reducing host CPU overhead during firmware updates.
The flash uses a dual-plane cell structure with on-die ECC logic, status register polling, RY/BY# pin signaling, and Advanced Sector Protection (ASP) with volatile/non-volatile lock bits per 128 kB sector-enabling selective write protection for bootloader and application partitions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 2,097,152 × 16-bit words |
| Access time (random) | 90 ns at VCC = VIO = 3.0 V - enables direct XIP execution from flash in real-time MCU applications |
| Page access time | 15 ns - allows rapid sequential reads within 32-byte pages for instruction fetch bursts |
| Write buffer size | 512 bytes - reduces average programming time by batching writes, critical for OTA firmware patching |
| ECC capability | On-die single-bit error correction - maintains data integrity over 20-year retention without host software intervention |
| Endurance | 100,000 program/erase cycles per sector - supports field-upgradable industrial controllers with frequent firmware revisions |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive ECUs and high-ambient industrial gateways |
Pinout & Package
Supplied in a 56-ball VBU Fortified BGA package (9 mm × 7 mm, 0.8 mm pitch), compatible with standard reflow profiles and offering improved thermal and mechanical reliability versus TSOP.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit address bus supporting full 256 Mb addressing (AMAX = A23); word-aligned only |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports Versatile I/O (VIO = 1.65–3.6 V) for mixed-voltage system interfacing |
| CE# | Chip enable | Active-low chip select; controls device power state and enables multi-chip addressing in parallel configurations |
| OE# | Output enable | Active-low read strobe; gates output drivers to prevent bus contention during shared-memory access |
| WE# | Write enable | Active-low write strobe; initiates internal program/erase algorithms when combined with command sequences |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation; eliminates need for constant polling in interrupt-driven systems |
| WP# | Write protect | Hardware sector lock override; disables program/erase when asserted, independent of software protection settings |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page-mode read | 32-byte aligned access with 15 ns subsequent cycle time - accelerates instruction fetch in XIP-capable MCUs |
| 512-byte write buffer | Enables single-command programming of up to 512 bytes - cuts firmware update time vs. byte-by-byte writes |
| Hardware ECC engine | Single-bit correction with automatic detection - ensures boot image integrity without host CPU overhead |
| Advanced sector protection (ASP) | Volatile and non-volatile lock per 128 kB sector - allows runtime unlock of application sectors while keeping bootloader permanently protected |
| 1024-byte OTP array | Two independently lockable regions - stores cryptographic keys or calibration data immune to field reprogramming |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps and diagnostic firmware in AEC-Q100 Grade 2 ECU modules exposed to under-hood temperatures up to +105°C. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with 90 ns random access and hardware ECC for ASIL-B compliance. Use Value: Ensures deterministic boot timing and long-term data integrity across 15+ year vehicle lifecycles without requiring periodic refresh or external error-handling logic. | Use Scenario: Holding firmware images and configuration tables for modular programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Parallel NOR flash serving as primary code storage with sector-level protection to isolate bootloader from user-programmable application zones. Use Value: Enables safe field updates via isolated 128 kB sectors and prevents accidental corruption of critical startup routines using ASP and WP# hardware lock. |
| Medical Imaging System Boot ROM | Telecom Base Station Configuration Memory |
Use Scenario: Hosting boot loader and safety-critical initialization code for FPGA-based ultrasound processing boards requiring FDA Class II compliance. IC Role / Device Role / Timing Role: Secure, high-reliability flash with OTP region for storing device-specific calibration coefficients and cryptographic keys. Use Value: Meets IEC 62304 traceability requirements through immutable OTP storage and 20-year data retention verified per JEDEC JESD22-A117. | Use Scenario: Storing FPGA bitstreams and radio parameter tables in outdoor 5G small-cell base stations operating continuously at –40°C to +85°C ambient. IC Role / Device Role / Timing Role: High-endurance (100K cycles) flash supporting frequent remote firmware upgrades via buffered programming and suspend/resume capability. Use Value: Reduces maintenance downtime by enabling background programming with suspend/resume during live traffic, minimizing service interruption windows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P10TFV020 | Same density and core voltage, but uses 64-ball LAE BGA (9 mm × 9 mm); lacks AEC-Q100 qualification | Targeted at commercial-grade industrial systems where extended temperature range is not required | Select when footprint compatibility with LAE package is prioritized and automotive qualification is unnecessary |
| MX29GL256FHT2I-90G | Macronix part with identical 256 Mb density, 90 ns access, and 128 kB sectors-but no integrated ECC or OTP array | Requires external ECC handling and lacks secure key storage, limiting use in safety-critical designs | Choose for cost-sensitive applications where host processor can manage error correction and security separately |
Compared with S29GL256P10TFV020 and MX29GL256FHT2I-90G, the S29GL256S10DHV023 uniquely combines AEC-Q100 Grade 2 qualification, on-die ECC, and OTP security in a compact VBU BGA-making it the only option meeting functional safety and long-term reliability requirements for automotive and medical edge devices.
Availability
S29GL256S10DHV023 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLCs, medical imaging boot systems, and telecom base station configuration storage requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL256S10DHV023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with leadership in automotive-grade flash memory and industrial reliability standards.
The GL-S family targets high-reliability embedded systems requiring XIP-capable NOR flash with enhanced endurance, ECC, and security features-designed specifically for automotive ECUs, industrial controllers, and medical devices demanding AEC-Q100 or extended-temperature operation.
FAQ
What is the purpose of the Versatile I/O (VIO) feature?
The Versatile I/O feature allows the S29GL256S10DHV023 to operate with VIO voltages from 1.65 V to VCC (3.6 V), enabling direct interfacing with mixed-voltage SoCs and FPGAs without level shifters. This simplifies board design in heterogeneous systems where core logic runs at 1.8 V or 2.5 V while maintaining full 16-bit parallel bandwidth and timing compliance.
How does the 512-byte write buffer improve programming efficiency?
The 512-byte write buffer allows up to 512 bytes to be loaded into an internal latch before initiating a single embedded program operation, reducing total programming time by up to 7× compared to single-word programming. This is especially beneficial during firmware updates where large contiguous blocks must be written with minimal host CPU intervention and deterministic latency.
Can the OTP array be reprogrammed after initial programming?
No-the 1024-byte OTP (One-Time Programmable) array consists of two lockable regions that can be permanently secured after initial programming. Once locked, neither region can be erased or rewritten, ensuring cryptographic keys or calibration data remain tamper-proof throughout the device's lifetime, satisfying secure boot and regulatory traceability requirements.
What is the significance of AEC-Q100 Grade 2 qualification for this part?
AEC-Q100 Grade 2 qualification certifies that the S29GL256S10DHV023 operates reliably from –40°C to +105°C and has passed stress tests including HTOL, TC, and ESD per automotive standards. This makes it suitable for under-hood applications such as transmission control modules and ADAS domain controllers where ambient temperatures exceed commercial-grade limits.
S29GL256S10DHV023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL256S10DHV023 FAQ
1.How can I place an order for S29GL256S10DHV023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S10DHV023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S10DHV023 reliable?
The price and inventory of S29GL256S10DHV023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10DHV023 is usually 5 days.
3.What payment methods are accepted for S29GL256S10DHV023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10DHV023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S10DHV023?
S29GL256S10DHV023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S10DHV023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S10DHV023?
For technical support, including S29GL256S10DHV023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10DHV023 requirements.
6.How does Aetrix verify that S29GL256S10DHV023 is sourced from the original manufacturer or authorized distributors?
All S29GL256S10DHV023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10DHV023 meets industry standards.
7.What is the process for return or replacement of S29GL256S10DHV023?
All S29GL256S10DHV023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10DHV023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S10DHV023 part is unused and in its original packaging.
Return procedure for S29GL256S10DHV023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S10DHV023 Tags
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