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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S10FAIV10

Name: S29GL256S10FAIV10
Brand: Infineon Technologies
SKU: S29GL256S10FAIV10
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S10FAIV10

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S10FAIV10.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

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Inventory:2,349

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Product details

Overview

S29GL256S10FAIV10 from Spansion is a 256-Mbit (32 MB) 3.0 V-only page-mode NOR Flash memory IC fabricated on 65 nm MirrorBit Eclipse process technology, featuring 100 ns random access time, industrial temperature range (–40°C to +85°C), and Fortified BGA package (LAA064, 11 mm × 13 mm). It supports sector protection, password-protected boot-block locking, and is used in firmware storage for network routers and industrial PLCs.

For engineers reviewing the S29GL256S10FAIV10 datasheet, S29GL256S10FAIV10 pinout, S29GL256S10FAIV10 application, or S29GL256S10FAIV10 equivalent, key selection criteria include VIO/VCC voltage flexibility (1.65–3.6 V I/O with 2.7–3.6 V core), sector protection granularity, embedded erase/program algorithms, and industrial-grade reliability under extended thermal cycling.

Technical Context

This device implements a synchronous/asynchronous dual-mode interface with address/data multiplexing, supporting standard CFI-compliant command sets for read, program, and block erase operations. It integrates hardware-based sector protection (top/bottom configuration), persistent DYB (Device-Protect Bit) state control, and optional Read/PPB Password Mode for secure firmware update paths.

The 65 nm MirrorBit Eclipse architecture enables single-bit-per-cell storage with two-bit-per-cell capability via charge-trap technology, delivering higher density and improved endurance over planar floating-gate NOR. Embedded algorithms execute erase suspend/resume and program suspend/resume without external controller intervention.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	256 Mbit (32 MB) organized as 4,194,304 × 64 bits; supports byte/word addressing in 16-bit bus mode.
Access Time	100 ns max at VCC = 2.7–3.6 V, TA = –40°C to +85°C; determines minimum instruction fetch latency in boot code execution.
Voltage Range	VIO = 1.65–VCC, VCC = 2.7–3.6 V; enables interoperability with 1.8 V or 3.3 V logic domains without level shifters.
Package	LAA064 Fortified BGA (11 mm × 13 mm, 64-ball); qualified for industrial reflow profiles and board-level reliability testing.
Temperature Range	Industrial: –40°C to +85°C; validated for continuous operation in enclosed control cabinets and outdoor telecom enclosures.
Protection Scheme	Hardware sector protection (top/bottom), DYB power-up state configurable (protected/unprotected), Read/PPB Password Mode support.

Pinout & Package

Package: Fortified Ball-Grid Array (LAA064), 64-ball, 11 mm × 13 mm body, 0.8 mm ball pitch, Pb-free, RoHS-compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A20	Address Inputs	21-bit address bus supporting full 32 MB address space; A0 selects byte within 16-bit word.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; operates in multiplexed or non-multiplexed mode per configuration.
CE#	Chip Enable	Active-low chip select; controls device power-down and output high-impedance state during deselect.
OE#	Output Enable	Active-low control for data bus drivers; allows read data gating independent of CE#.
WE#	Write Enable	Active-low signal initiating internal program/erase cycles when combined with valid command sequences.
RY/BY#	Ready/Busy Output	Open-drain status indicator: low = operation in progress, high = ready; used for polling or interrupt-driven flow control.
VIO	I/O Supply	Separate 1.65–VCC supply for interface pins; decouples I/O voltage from core VCC for mixed-voltage system integration.
VCC	Core Supply	2.7–3.6 V core voltage; powers internal charge pumps, state machines, and memory array bias circuits.

Key Features

Feature	Design Value
MirrorBit Eclipse Technology	65 nm charge-trap flash cell enabling 256 Mbit density with >100K program/erase cycles and 20-year data retention at 85°C.
Flexible VIO/VCC Operation	Independent I/O supply (1.65–VCC) allows direct interfacing with 1.8 V microcontrollers while maintaining 3.3 V core performance.
Secure Sector Protection	Hardware-based top/bottom sector lock with DYB persistence and optional password modes (Read/PPB) prevent unauthorized firmware overwrite.
Embedded Algorithms	On-chip erase suspend/resume and program suspend/resume enable real-time task preemption during flash updates without data corruption.

Applications

Network Router Firmware Storage

Industrial PLC Boot Code Memory

Use Scenario: Stores boot loader, OS kernel, and configuration images in carrier-grade edge routers requiring field-upgradable firmware.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with deterministic 100 ns read access for fast boot sequence execution.

Use Value: Sector protection prevents accidental corruption of critical boot sectors during remote firmware updates over IP networks.

Use Scenario: Holds firmware and motion-control algorithms in programmable logic controllers deployed in factory automation systems.

IC Role / Device Role / Timing Role: Standalone NOR Flash providing XIP (eXecute-In-Place) capability for deterministic real-time task scheduling.

Use Value: Industrial temperature rating (–40°C to +85°C) ensures reliable operation inside sealed control panels with no active cooling.

Medical Diagnostic Imaging Boot ROM

Automotive ADAS Camera Module Storage

Use Scenario: Stores initialization routines and calibration data for MRI and CT scanner subsystems where firmware integrity is safety-critical.

IC Role / Device Role / Timing Role: Secure boot ROM with password-protected write access to prevent tampering with diagnostic calibration parameters.

Use Value: PPB Password Mode enforces multi-step authentication before modifying protected sectors containing FDA-approved firmware.

Use Scenario: Retains camera firmware and lens calibration tables in automotive surround-view systems operating in engine bay environments.

IC Role / Device Role / Timing Role: High-reliability code storage interfaced directly to ARM Cortex-A53 SoC via 16-bit parallel bus.

Use Value: Fortified BGA package resists mechanical shock and thermal stress during vehicle vibration and thermal cycling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR Flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256S90FAIV10	90 ns access time (vs. 100 ns); otherwise identical voltage, package, and feature set.	Preferred where boot latency must be minimized in time-critical embedded boot paths.	Select for faster read throughput when system timing margin is constrained.
S29GL256S10FAIV20	Same speed and package, but uses Model Number V2 (lowest-address sector protected) instead of V1 (highest-address protected).	Required when legacy firmware layout mandates protection of lower boot sectors rather than upper parameter blocks.	Choose when matching existing PCB layout and firmware partitioning scheme that assumes bottom-sector lock.

Compared with S29GL256S90FAIV10, this part trades 10 ns read speed for broader compatibility with legacy timing budgets; compared with S29GL256S10FAIV20, it provides top-sector protection alignment essential for newer boot-loader architectures using upper-sector reserved regions.

Availability

S29GL256S10FAIV10 is available at Aetrix Electronics and suitable for network infrastructure, industrial control, medical imaging, and automotive ADAS applications requiring stable component supply across long product lifecycles.

Supply support for S29GL256S10FAIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Spansion (now part of Cypress Semiconductor, acquired by Infineon in 2019) was a fabless semiconductor company specializing in flash memory and microcontrollers, headquartered in Sunnyvale, CA.

The S29GL-S series targets high-reliability embedded systems requiring deterministic NOR Flash performance, emphasizing sector security, industrial temperature resilience, and long-term data retention in mission-critical firmware storage.

FAQ

What is the VIO voltage range supported by S29GL256S10FAIV10?

The device supports VIO from 1.65 V up to VCC, with VCC specified from 2.7 V to 3.6 V. This allows direct interfacing with 1.8 V logic families while maintaining full 3.3 V core functionality. The VIO pin must be powered independently and cannot float or be tied to ground. Valid operation requires VIO ≥ 1.65 V and VIO ≤ VCC at all times.

Does S29GL256S10FAIV10 support CFI (Common Flash Interface)?

Yes, it fully complies with the JEDEC JESD68-A CFI specification. The device responds to CFI query commands at address 0x55, returning standardized parameter tables including geometry, command set, and timing information. This enables automatic detection and configuration by bootloader software and flash programming tools without hard-coded assumptions.

How many program/erase cycles is S29GL256S10FAIV10 rated for?

The device is rated for a minimum of 100,000 program/erase cycles per sector, verified across the full industrial temperature range (–40°C to +85°C). Endurance is maintained with proper command sequencing and adherence to datasheet-specified voltage and timing margins; no external wear-leveling controller is required due to on-chip algorithmic optimization.

Is the LAA064 package lead-free and RoHS-compliant?

Yes, the LAA064 Fortified BGA package is Pb-free and fully compliant with EU RoHS Directive 2011/65/EU and China RoHS. All solder balls use SnAgCu (SAC305) alloy, and the substrate meets halogen-free requirements (<900 ppm Cl + Br). Certificate of Compliance is available upon request from Aetrix Electronics.

S29GL256S10FAIV10 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL256S10FAIV10 FAQ

1.How can I place an order for S29GL256S10FAIV10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10FAIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10FAIV10 reliable?

The price and inventory of S29GL256S10FAIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10FAIV10 is usually 5 days.

3.What payment methods are accepted for S29GL256S10FAIV10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10FAIV10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10FAIV10?

S29GL256S10FAIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10FAIV10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10FAIV10?

For technical support, including S29GL256S10FAIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10FAIV10 requirements.

6.How does Aetrix verify that S29GL256S10FAIV10 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10FAIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10FAIV10 meets industry standards.

7.What is the process for return or replacement of S29GL256S10FAIV10?

All S29GL256S10FAIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10FAIV10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10FAIV10 part is unused and in its original packaging.

Return procedure for S29GL256S10FAIV10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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