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Infineon Technologies S29GL256S10FAIV13
- Part No.:
- S29GL256S10FAIV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S10FAIV13.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,730
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Product details
Overview
S29GL256S10FAIV13 from Spansion is a 256-Mbit (32 MB) 3.0 V-only page-mode NOR Flash memory IC fabricated on 65 nm MirrorBit Eclipse process technology, featuring 100 ns random access time, industrial temperature range (–40°C to +85°C), and Fortified BGA package (LAA064, 11 mm × 13 mm). It supports sector protection, password-protected boot-block locking, and is used in embedded firmware storage for industrial controllers and network edge devices.
For engineers reviewing the S29GL256S10FAIV13 datasheet, S29GL256S10FAIV13 pinout, S29GL256S10FAIV13 application, or S29GL256S10FAIV13 equivalent, key selection considerations include VIO/VCC voltage flexibility (1.65 V to 3.6 V), sector protection configuration (lowest-address protected), DYB power-up state (unprotected), and Read Password Mode operation.
Technical Context
This device implements a parallel asynchronous interface with address/data multiplexing support, compatible with standard x16 bus configurations. It uses a two-transistor MirrorBit Eclipse cell architecture enabling high-density, single-bit-per-cell storage with enhanced data retention and endurance.
Embedded erase and program algorithms are executed internally without external timing control; command sequences initiate block/sector erase (typ. 100 ms) and byte/word programming (typ. 10 µs). The device supports CFI (Common Flash Interface) query mode for automatic software identification and configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MB), organized as 2,097,152 × 16-bit words for direct microcontroller code execution |
| Access Time | 100 ns max random access - enables real-time instruction fetch in 80 MHz CPU systems |
| Voltage Range | VIO = 1.65 V to VCC; VCC = 2.7 V to 3.6 V - supports mixed-voltage I/O interfacing |
| Temperature Range | Industrial: –40°C to +85°C - qualified for uncontrolled ambient environments in factory automation |
| Package | LAA064 Fortified BGA, 11 mm × 13 mm, 64-ball grid - optimized for thermal reliability and board-level shock resistance |
| Protection Mode | Lowest-address sector protected, DYB power-up unprotected, Read Password Mode enabled - allows secure bootloader access control |
Pinout & Package
Package: LAA064 Fortified Ball-Grid Array (64-ball, 0.8 mm pitch, 11 mm × 13 mm body, RoHS-compliant).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus supporting full 32 MB addressing with A0 LSB for word selection |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports x16 configuration without byte-lane splitting |
| CE# | Chip Enable | Active-low enable controlling device selection in multi-chip memory maps |
| OE# | Output Enable | Active-low control for data bus tristate; critical for read timing synchronization |
| WE# | Write Enable | Active-low signal initiating internal program/erase cycles upon valid command sequence |
| RY/BY# | Ready/Busy Output | Open-drain status indicator signaling ongoing erase/program operations |
| VCC, VIO, VSS | Power/Termination | Separate core (VCC) and I/O (VIO) supplies allow voltage translation; multiple VSS pins reduce ground bounce |
Key Features
| Feature | Design Value |
|---|---|
| MirrorBit Eclipse Technology | 65 nm two-transistor cell enabling 256 Mbit density with >100K program/erase cycles and 20-year data retention |
| Flexible VIO Support | VIO independently configurable from 1.65 V to VCC - eliminates level shifters in mixed-voltage SoC interfaces |
| Password-Protected Boot Block | Read Password Mode with lowest-sector protection prevents unauthorized firmware modification during boot initialization |
| CFI Compliance | Standard Common Flash Interface implementation enables auto-detection and driver portability across toolchains |
Applications
| Industrial PLC Firmware Storage | Network Edge Router Boot Memory |
|---|---|
Use Scenario: Storing firmware images and configuration tables in programmable logic controllers deployed in factory-floor environments with wide temperature swings. IC Role / Device Role / Timing Role: Nonvolatile code storage executing directly from XIP (execute-in-place) mode with deterministic 100 ns access latency. Use Value: Sector protection prevents accidental overwrites of safety-critical boot code; industrial temp rating ensures reliability at –40°C cold start. | Use Scenario: Holding bootloader and OS kernel images in carrier-grade Ethernet routers requiring field-upgradable firmware with tamper resistance. IC Role / Device Role / Timing Role: Secure boot memory with Read Password Mode enabling authenticated firmware loading before main CPU initialization. Use Value: Lowest-address sector protection isolates bootloader region; unprotected DYB state allows dynamic password setup during provisioning. |
| Medical Diagnostic Equipment BIOS | Automotive ADAS Camera Module |
Use Scenario: Storing BIOS and calibration data in portable ultrasound and imaging systems requiring long-term data integrity and regulatory compliance. IC Role / Device Role / Timing Role: High-reliability nonvolatile storage with >20-year data retention and CFI-based firmware update compatibility. Use Value: MirrorBit Eclipse process delivers low bit-error rate under EMI-rich medical environments; RoHS-compliant package meets IEC 60601-1. | Use Scenario: Firmware storage in surround-view camera ECUs operating near engine compartments with thermal cycling and vibration exposure. IC Role / Device Role / Timing Role: Shock-resistant Fortified BGA package with industrial temp support ensures stable boot memory under mechanical stress. Use Value: LAA064 package reduces solder joint fatigue; 100 ns access supports real-time image pipeline initialization within 50 ms cold boot window. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S10FAIV12 | VIO = VCC = 2.7–3.6 V; lowest-sector protected; DYB power-up unprotected; Read Password Mode - lacks VIO/VCC separation | Requires matched I/O and core voltage rails; unsuitable for mixed-voltage SoCs with 1.8 V I/O | Select when system uses single 3.3 V supply and simplified power design is prioritized over voltage flexibility |
| S29GL256S90FAIV13 | 90 ns access time; otherwise identical electrical and functional specification - faster timing but higher power during active read | Enables tighter timing margins in high-clock-rate microcontrollers; increases dynamic power by ~12% at 10 MHz bus frequency | Select when application demands sub-100 ns latency for real-time interrupt response, and thermal budget permits higher active current |
Compared with S29GL256S10FAIV12 and S29GL256S90FAIV13, the S29GL256S10FAIV13 uniquely balances VIO/VCC flexibility and industrial-grade timing-making it optimal for mixed-voltage embedded systems where power efficiency and thermal robustness outweigh marginal speed gains.
Availability
S29GL256S10FAIV13 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, network edge router boot memory, and medical diagnostic equipment BIOS requiring stable component supply across extended product lifecycles.
Supply support for S29GL256S10FAIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Spansion (now part of Cypress Semiconductor, acquired by Infineon in 2019) was a fabless semiconductor company specializing in flash memory and microcontrollers, headquartered in Sunnyvale, CA.
The S29GL-S family targets high-reliability embedded systems requiring deterministic NOR Flash performance, emphasizing sector protection, long data retention, and industrial environmental resilience.
FAQ
What is the VIO voltage range supported by S29GL256S10FAIV13?
The S29GL256S10FAIV13 supports VIO from 1.65 V up to VCC, with VCC specified from 2.7 V to 3.6 V. This allows independent scaling of I/O voltage for compatibility with 1.8 V or 3.3 V microcontroller buses while maintaining core logic integrity. No external level shifters are required when interfacing with mixed-voltage SoCs.
Does this device support Common Flash Interface (CFI)?
Yes, the S29GL256S10FAIV13 fully complies with JEDEC Standard JESD68-A for Common Flash Interface. It provides CFI query mode via standard command sequences, returning vendor ID, device geometry, timing parameters, and protection features - enabling automated driver initialization in Linux MTD and U-Boot environments.
How is sector protection configured in this specific ordering option?
This part (V13 suffix) configures the lowest-address sector for protection, with Dynamic Protection Bit (DYB) initialized to unprotected state at power-up and Read Password Mode enabled. Protection is enforced via hardware lock bits and requires password entry before modifying protected sectors - preventing accidental or malicious firmware corruption during field updates.
What package type and ball count does S29GL256S10FAIV13 use?
S29GL256S10FAIV13 uses the LAA064 Fortified Ball-Grid Array package: 64-ball, 0.8 mm pitch, 11 mm × 13 mm body size. It features reinforced solder joints and enhanced thermal dissipation for industrial applications subject to thermal cycling and mechanical shock - distinct from standard BGA packages in reliability qualification.
S29GL256S10FAIV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL256S10FAIV13 FAQ
1.How can I place an order for S29GL256S10FAIV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S10FAIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S10FAIV13 reliable?
The price and inventory of S29GL256S10FAIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10FAIV13 is usually 5 days.
3.What payment methods are accepted for S29GL256S10FAIV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10FAIV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S10FAIV13?
S29GL256S10FAIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S10FAIV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S10FAIV13?
For technical support, including S29GL256S10FAIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10FAIV13 requirements.
6.How does Aetrix verify that S29GL256S10FAIV13 is sourced from the original manufacturer or authorized distributors?
All S29GL256S10FAIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10FAIV13 meets industry standards.
7.What is the process for return or replacement of S29GL256S10FAIV13?
All S29GL256S10FAIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10FAIV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S10FAIV13 part is unused and in its original packaging.
Return procedure for S29GL256S10FAIV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S10FAIV13 Tags
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M24C02-WMN6TP
STMicroelectronics
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M24C02-FMC6TG
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Microchip Technology
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