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Infineon Technologies S29GL256S10FAIV23

Part No.:
S29GL256S10FAIV23
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL256S10FAIV23.pdf
Description:
IC FLASH 256MBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,397

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Product details

Overview

S29GL256S10FAIV23 from Spansion is a 256 Mbit (32 MB) 3.0 V-only page-mode NOR Flash memory IC fabricated on 65 nm MirrorBit Eclipse process technology, featuring 100 ns random access time, industrial temperature range (–40°C to +85°C), and Fortified BGA package (LAA064, 11 mm × 13 mm). It supports sector protection, password-protected boot-block locking, and is used in embedded firmware storage for industrial controllers and network edge devices.

For engineers reviewing the S29GL256S10FAIV23 datasheet, S29GL256S10FAIV23 pinout, S29GL256S10FAIV23 application, or S29GL256S10FAIV23 equivalent, key selection criteria include VIO/VCC voltage flexibility (1.65 V to 3.6 V), DYB power-up state configuration (V2 = lowest-sector protected), and compatibility with legacy 3.0 V NOR Flash interfaces in boot code and BIOS storage designs.

Technical Context

This device implements a synchronous/asynchronous dual-mode interface with page-mode read capability, supporting both standard and enhanced command sets for erase, program, and lock/unlock operations. It integrates hardware-based sector protection logic and supports two VIO configurations: either VIO = VCC (2.7–3.6 V) or VIO = 1.65 V to VCC (with VCC = 2.7–3.6 V).

The LAA064 Fortified BGA package enables high-density PCB layout while maintaining signal integrity for address/data bus timing. The V2 model variant configures the Device Protection Bit (DYB) to power up in the lowest-address-sector-protected state, enabling secure boot initialization without software intervention.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density256 Mbit (32 MB) organized as 4,194,304 × 64-bit; supports full parallel addressing for firmware image storage.
Access Time100 ns max random access; ensures sub-100 ns instruction fetch latency in microcontroller boot sequences.
Voltage RangeVCC = 2.7–3.6 V, VIO = 1.65 V to VCC; allows I/O interfacing with 1.8 V or 3.3 V logic while core runs at 3.0 V.
Temperature RangeIndustrial: –40°C to +85°C; qualified for operation in uncontrolled ambient environments like factory automation panels.
PackageLAA064 Fortified BGA, 11 mm × 13 mm, 64-ball grid; provides mechanical robustness and thermal performance for reflow-soldered industrial modules.
Protection ModeV2 configuration: DYB powers up in lowest-address-sector-protected state; prevents accidental overwrite of boot code during power-on reset.
Process Technology65 nm MirrorBit Eclipse; enables higher density and lower power consumption vs. prior 90 nm generation, with improved data retention (>20 years).

Pinout & Package

LAA064 Fortified Ball-Grid Array (64-ball, 0.8 mm pitch, 11 mm × 13 mm body), RoHS-compliant, Pb-free, moisture-sensitive level 3 per J-STD-020.

Pin/TerminalCircuit RoleDesign Meaning
A0–A22Address Inputs23-bit address bus supporting full 32 MB linear addressing; A0 selects byte within 16-bit word.
DQ0–DQ15Data I/O16-bit bidirectional data bus; supports x16 mode only; no x8/x32 configuration.
CE#Chip EnableActive-low enable controlling device selection; must be asserted before OE#/WE# for valid access.
OE#Output EnableActive-low control for data output buffer; used during read cycles to gate DQ outputs.
WE#Write EnableActive-low control for write/erase/lock commands; latches command sequences on rising edge.
RY/BY#Ready/Busy OutputOpen-drain status indicator: low = operation in progress, high = ready; used for polling or interrupt-driven timing.
VCC, VIO, VSSPower SuppliesVCC (2.7–3.6 V) powers core; VIO (1.65–VCC) powers I/O drivers; separate VSS pins reduce noise coupling.

Key Features

FeatureDesign Value
Password-Protected Boot BlockHardware-enforced locking of lowest 64 KB sector using PPB/Read Password modes; prevents unauthorized firmware modification.
Dual-Voltage I/O InterfaceVIO configurable from 1.65 V to VCC, enabling direct connection to 1.8 V FPGAs or 3.3 V microcontrollers without level shifters.
MirrorBit Eclipse ArchitectureTwo-bit-per-cell storage on 65 nm process; doubles effective density without increasing die size or power draw.
Extended Temperature OperationValidated operation from –40°C to +85°C with full timing compliance; eliminates need for derating in industrial enclosures.
Page-Mode Read AccelerationConsecutive reads within same page (128-word burst) achieve effective throughput >20 MB/s; reduces boot time in embedded systems.

Applications

Industrial PLC Firmware StorageTelecom Edge Router Boot Memory

Use Scenario: Storing firmware images and configuration tables in programmable logic controllers deployed in factory-floor environments with wide ambient temperature swings.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing deterministic 100 ns instruction fetch timing during cold-start and watchdog-triggered resets.

Use Value: V2 configuration ensures boot sector remains locked at power-up, preventing corruption from brown-out events or ESD-induced glitches.

Use Scenario: Holding bootloader and OS kernel for carrier-grade Ethernet routers operating in telecom central offices with strict uptime requirements.

IC Role / Device Role / Timing Role: Primary NOR Flash for XIP (eXecute-In-Place) execution of boot code; supports fast page-mode reads for rapid kernel decompression.

Use Value: 65 nm MirrorBit Eclipse process delivers >20-year data retention, meeting 15-year equipment lifecycle mandates without refresh.

Medical Diagnostic Imaging ControlAutomotive ADAS Camera Module

Use Scenario: Storing calibration data and safety-critical firmware in ultrasound and MRI control units requiring traceable, tamper-resistant memory.

IC Role / Device Role / Timing Role: Secure firmware repository with hardware password protection; supports PPB mode for field-upgrade authorization.

Use Value: Dual-voltage I/O allows direct interface with 1.8 V imaging SoCs, eliminating external level translators and reducing BOM count.

Use Scenario: Hosting camera sensor initialization firmware and real-time vision algorithm parameters in automotive surround-view systems.

IC Role / Device Role / Timing Role: Boot memory for ARM Cortex-R5-based vision processors; operates reliably across –40°C to +85°C under hood conditions.

Use Value: Industrial temperature rating and fortified BGA package withstand thermal cycling and vibration stress in engine bay mounting locations.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR Flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL256S90FAI01090 ns access time; VIO = VCC = 2.7–3.6 V; highest-sector protection (01); tray packing.Higher speed but lacks VIO flexibility and DYB power-up control; suited for cost-sensitive consumer designs.Select when faster access is required and VIO/VCC decoupling is unnecessary.
S29GL256S10FAIV11Same 100 ns speed and VIO range, but V1 = highest-sector protected; tape-and-reel packing (1).Identical electrical specs but different sector-lock default; requires firmware update to match V2's lowest-sector behavior.Choose for automated assembly lines needing tape-and-reel, provided boot code handles alternate protection mapping.

Compared with S29GL256S10FAIV23, the 90 ns variant trades VIO flexibility for speed, while the V11 alternative matches timing and voltage but requires software adaptation for sector protection defaults-making V2 optimal for secure, drop-in industrial boot memory replacement.

Availability

S29GL256S10FAIV23 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, telecom edge router boot memory, and medical diagnostic imaging control requiring stable component supply over extended product lifecycles.

Supply support for S29GL256S10FAIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Spansion Inc. was a leading semiconductor company specializing in flash memory and microcontrollers, later acquired by Cypress Semiconductor in 2015 and integrated into Infineon Technologies.

The S29GL-S series targets high-reliability embedded systems requiring long-term firmware storage with hardware security features, emphasizing industrial temperature operation and flexible I/O voltage support.

FAQ

What does the 'V2' suffix indicate in S29GL256S10FAIV23?

The 'V2' denotes the voltage I/O configuration and protection mode: VIO = 1.65 V to VCC, with Device Protection Bit (DYB) powering up in the lowest-address-sector-protected state. This ensures the boot block remains locked immediately after power-on, preventing accidental writes during system initialization or brown-out recovery.

Is S29GL256S10FAIV23 compatible with legacy S29GL-S footprint designs?

Yes-it uses the LAA064 Fortified BGA package identical to other S29GL-S devices in the same density class. Pinout, thermal pad layout, and solder mask specifications match Spansion's documented LAA064 mechanical drawing, enabling direct PCB reuse without redesign.

Does this device support x8 or x32 data bus widths?

No-S29GL256S10FAIV23 is strictly x16 configuration. Its DQ0–DQ15 pins implement a 16-bit bidirectional data bus only; there is no x8 mode or x32 expansion capability. System design must allocate two consecutive address lines for byte-level access within each 16-bit word.

How is password protection implemented in this Flash memory?

Password protection operates via hardware registers: Read Password Mode uses a 16-byte password stored in dedicated lock bits, while PPB (Persistent Protection Bits) mode stores a 16-byte password in nonvolatile memory that persists across power cycles. Both require exact password match before unlocking protected sectors, with no software bypass possible.

S29GL256S10FAIV23 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
64-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
16M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
100 ns
Voltage - Supply:
1.65V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (13x11)

S29GL256S10FAIV23 FAQ

1.How can I place an order for S29GL256S10FAIV23 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10FAIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10FAIV23 reliable?

The price and inventory of S29GL256S10FAIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10FAIV23 is usually 5 days.

3.What payment methods are accepted for S29GL256S10FAIV23?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10FAIV23 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10FAIV23?

S29GL256S10FAIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10FAIV23 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10FAIV23?

For technical support, including S29GL256S10FAIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10FAIV23 requirements.

6.How does Aetrix verify that S29GL256S10FAIV23 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10FAIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10FAIV23 meets industry standards.

7.What is the process for return or replacement of S29GL256S10FAIV23?

All S29GL256S10FAIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10FAIV23, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10FAIV23 part is unused and in its original packaging.

Return procedure for S29GL256S10FAIV23:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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