Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S10FHB020

Name: S29GL256S10FHB020
Brand: Infineon Technologies
SKU: S29GL256S10FHB020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: S29GL256S10FHB020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S10FHB020.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:2,993

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

S29GL256S10FHB020 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware execution in industrial control systems.

For engineers reviewing the S29GL256S10FHB020 datasheet, S29GL256S10FHB020 pinout, S29GL256S10FHB020 application, or S29GL256S10FHB020 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer, Versatile I/O (1.65–VCC), OTP array, and AEC-Q100 Grade 2 qualification.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.

The flash uses a 65 nm MIRRORBIT™ Eclipse cell architecture enabling high density and reliability. It features dual-voltage I/O (VIO = 1.65–VCC), internal hardware ECC, and advanced sector protection with volatile/non-volatile lock options per 128 kB sector.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mb (32 MB); supports full firmware image storage for mid-complexity microcontrollers
Interface	Parallel ×16 asynchronous; enables XIP (execute-in-place) without external RAM buffering
Access Time	90 ns random / 15 ns page; meets real-time boot latency requirements in industrial PLCs
Write Buffer	512-byte (256-word); reduces effective programming time by batching writes within one command sequence
ECC	Internal hardware single-bit correction; eliminates need for external ECC logic in safety-critical boot paths
Endurance	100,000 program/erase cycles; suitable for field-upgradable firmware with infrequent updates
Data Retention	20 years at +85°C; ensures long-term reliability in unattended embedded deployments

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address inputs	24-bit word address bus; A23 is MSB for 256 Mb (2²⁴ × 16-bit = 32 MB)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes and reads per JEDEC standards
CE#	Chip enable	Active-low chip select; controls device power state and bus contention during multi-device configurations
OE#	Output enable	Active-low read strobe; gates output drivers to prevent bus conflicts during shared-memory access
WE#	Write enable	Active-low write strobe; initiates internal program/erase commands when combined with address/data sequences
RY/BY#	Ready/Busy indicator	Open-drain status pin; low during embedded operations, used for hardware flow control without polling
RESET#	Hardware reset	Active-low asynchronous reset; aborts ongoing program/erase and returns device to read mode
VCC	Core supply	2.7–3.6 V single supply for core logic, programming, and erase; no separate VPP required
VIO	I/O supply	1.65–VCC; allows interfacing with 1.8 V, 2.5 V, or 3.3 V host controllers independently of core voltage

Key Features

Feature	Design Value
Page-mode read (32-byte aligned)	15 ns subsequent access time enables fast sequential instruction fetch in XIP applications
512-byte write buffer	Reduces average programming time by >60% vs. single-word writes, critical for OTA firmware updates
Uniform 128 kB sectors	Simplifies partitioning of boot loader, application, and configuration regions with deterministic erase boundaries
Separate 1024-byte OTP array	Provides secure storage for keys, calibration data, or device-specific identifiers with two independent lock bits
CFI-compliant parameter table	Enables automatic driver detection and configuration in Linux MTD and U-Boot environments

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers operating continuously at 85°C ambient.

IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 90 ns read latency and 100,000-cycle endurance.

Use Value: Eliminates external SRAM buffering and supports hot firmware patching via sector-protected update partitions.

Use Scenario: Holding boot code and sensor calibration data in front-camera ECU requiring AEC-Q100 Grade 2 compliance (–40°C to +105°C).

IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash with hardware ECC and OTP lock for ASIL-B functional safety support.

Use Value: Ensures integrity of boot sequence under voltage transients and thermal stress without software ECC overhead.

Medical Imaging System BIOS

Telecom Base Station Configuration

Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound devices with strict 20-year data retention requirement.

IC Role / Device Role / Timing Role: High-reliability firmware storage with 20-year data retention at +85°C and sector-level write protection.

Use Value: Meets FDA-regulated lifecycle validation for Class II medical equipment without periodic refresh cycles.

Use Scenario: Storing FPGA configuration, DSP firmware, and network protocol stacks in carrier-grade baseband units deployed in outdoor cabinets.

IC Role / Device Role / Timing Role: Parallel interface flash with Versatile I/O (1.8 V host compatibility) and CFI auto-detection for multi-vendor board reuse.

Use Value: Enables seamless migration between ASIC/FPGA platforms while maintaining identical flash driver abstraction layer.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P10TFB020	Same density and timing, but uses 64-ball LAE FBGA (9 mm × 9 mm); no TSOP option	Preferred for space-constrained PCBs where footprint reduction outweighs manual rework feasibility	Select when board layout prioritizes BGA miniaturization and automated assembly over field serviceability
MX29GL256FHT2I-90G	Macronix part; 90 ns access, but lacks integrated ECC and OTP array; requires external error handling	Suitable for cost-sensitive consumer applications where firmware integrity is managed in software	Choose only if ECC and OTP are handled externally and AEC-Q100 qualification is not required

Compared with S29GL256P10TFB020, this TSOP variant offers easier prototyping and rework; versus MX29GL256FHT2I-90G, it provides hardware ECC and automotive qualification at higher unit cost but lower system-level validation effort.

Availability

S29GL256S10FHB020 is available at Aetrix Electronics and suitable for industrial control, automotive ADAS, medical imaging, and telecom infrastructure applications requiring stable component supply, long-life availability, and AEC-Q100 Grade 2 compliance.

Supply support for S29GL256S10FHB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

The GL-S family targets high-reliability embedded systems needing XIP-capable flash with integrated ECC, sector protection, and extended temperature operation-designed specifically for automotive, industrial, and medical firmware storage.

FAQ

What is the maximum operating temperature range for S29GL256S10FHB020?

This part is qualified to AEC-Q100 Grade 2, supporting continuous operation from –40°C to +105°C. The datasheet specifies full electrical performance across this range, including 90 ns random access time and 100,000 program/erase cycles at maximum temperature. Thermal derating is not required up to +105°C ambient.

Does S29GL256S10FHB020 require an external VPP voltage for programming?

No. It uses a single 2.7–3.6 V VCC supply for all operations-read, program, and erase-eliminating the need for external high-voltage generators or charge pumps. Internal voltage regulation and pump circuits generate required programming/erase voltages, simplifying power design and reducing BOM count.

How is the 1024-byte OTP array structured and protected?

The OTP array consists of 64 words (1024 bytes) divided into two 512-byte lockable regions. Each region has an independent non-volatile lock bit; once set, the corresponding region becomes permanently read-only. Locking is irreversible and performed via dedicated CFI commands, providing tamper-resistant storage for cryptographic keys or calibration data.

Can S29GL256S10FHB020 be used in a 1.8 V I/O system?

Yes. Its Versatile I/O feature supports VIO from 1.65 V to VCC, so with VCC = 3.0 V, VIO can be set to 1.8 V. This allows direct interfacing with 1.8 V microcontrollers or FPGAs without level shifters, while maintaining full 90 ns access timing and all embedded functions including ECC and sector protection.

S29GL256S10FHB020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL256S10FHB020 FAQ

1.How can I place an order for S29GL256S10FHB020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10FHB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10FHB020 reliable?

The price and inventory of S29GL256S10FHB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10FHB020 is usually 5 days.

3.What payment methods are accepted for S29GL256S10FHB020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10FHB020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10FHB020?

S29GL256S10FHB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10FHB020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10FHB020?

For technical support, including S29GL256S10FHB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10FHB020 requirements.

6.How does Aetrix verify that S29GL256S10FHB020 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10FHB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10FHB020 meets industry standards.

7.What is the process for return or replacement of S29GL256S10FHB020?

All S29GL256S10FHB020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10FHB020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10FHB020 part is unused and in its original packaging.

Return procedure for S29GL256S10FHB020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

2026-06-30 Amplifiers Explained: Types, Circuits, Gain, Classes and Applications

Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

2026-06-27 Machine Vision System: Components, Inspection Applications and Integration Guide

Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

2026-06-23 Electronic Devices and Circuits: Fundamentals, Components and Applications

Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…