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Infineon Technologies S29GL256S10FHB023
- Part No.:
- S29GL256S10FHB023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S10FHB023.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,226
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Product details
Overview
S29GL256S10FHB023 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 3.0 V core supply, 16-bit data bus, and MIRRORBIT™ Eclipse 65 nm technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial controllers requiring high reliability and fast XIP execution.
For engineers reviewing the S29GL256S10FHB023 datasheet, S29GL256S10FHB023 pinout, S29GL256S10FHB023 application, or S29GL256S10FHB023 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65 V to VCC), and AEC-Q100 Grade 2 qualification (–40°C to +105°C).
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.
The flash integrates on-die ECC logic that corrects single-bit errors in real time during read operations and reports uncorrectable multi-bit errors. Sector protection includes volatile (via status register) and non-volatile (via ASP bits) locking, plus a dedicated 1024-byte OTP array with two independently lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (32 MB); supports full boot image storage for mid-range microcontrollers |
| Random Access Time | 90 ns at VCC = VIO; enables deterministic XIP execution latency |
| Page Access Time | 15 ns; allows rapid sequential reads within 32-byte aligned pages |
| Write Buffer Size | 512 bytes; reduces effective programming time by batching up to 256 words per command |
| Erase Granularity | Uniform 128 kB sectors; simplifies firmware update partitioning and wear leveling |
| Endurance & Retention | 100,000 program/erase cycles; 20-year data retention at 85°C |
| I/O Voltage Range | VIO = 1.65 V to VCC; supports mixed-voltage system interfacing without level shifters |
Pinout & Package
Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.5 mm pitch) - confirmed per Infineon datasheet section 12.1 and ordering code suffix "FHB".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit word address bus; A23 is MSB for 256 Mb density (2²⁴ × 16-bit = 32 MB) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes and reads per CE#/OE#/WE# timing |
| CE# | Chip Enable | Active-low device select; controls power state entry and read/write initiation |
| OE# | Output Enable | Active-low read control; gates output drivers without affecting internal state |
| WE# | Write Enable | Active-low write strobe; latches address/data for program/erase command sequences |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations, high when idle or completed |
| RESET# | Hardware Reset | Active-low asynchronous reset; aborts ongoing operations and returns to read mode |
| VCC | Core Supply | 3.0 V ±0.3 V supply for core logic and flash array; powers all internal voltage generators |
| VIO | I/O Supply | Independent 1.65 V to VCC supply for interface buffers; enables mixed-signal SoC interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | On-the-fly single-bit error correction with automatic detection and flagging of uncorrectable errors |
| Page Mode Read | 32-byte aligned page access with 15 ns cycle time for intra-page reads, improving sequential throughput |
| Buffer Programming | 512-byte write buffer enables burst programming at 1.5 MBps, reducing host CPU overhead |
| Advanced Sector Protection | Volatile and non-volatile locking per 128 kB sector, preventing accidental firmware overwrite |
| Secure OTP Region | 1024-byte one-time-programmable array with dual lockable zones for keys or calibration data |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and configuration parameters in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile boot code storage with XIP-capable random access for deterministic startup and runtime code fetch. Use Value: 90 ns random access and 20-year data retention ensure reliable operation across thermal cycling and long service life. | Use Scenario: Holding safety-critical boot loader and sensor calibration data in automotive camera ECU modules certified to AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Primary boot memory with hardware ECC and sector protection to meet ASIL-B functional safety requirements. Use Value: Integrated ECC and 100,000 erase cycles support robust field updates while maintaining integrity under vibration and temperature extremes. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound devices requiring zero-failure field reliability. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage for critical initialization code with OTP-locked calibration constants. Use Value: Dual-lock OTP region and non-volatile sector protection prevent unauthorized modification of regulatory-compliant firmware. | Use Scenario: Storing field-upgradable protocol stacks and hardware configuration tables in 5G remote radio units deployed outdoors. IC Role / Device Role / Timing Role: High-density, thermally stable configuration memory supporting frequent over-the-air updates. Use Value: Versatile I/O (1.65 V to 3.6 V) interfaces directly with 1.8 V or 3.3 V baseband processors without external level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P10TFB020 | Same density and timing, but uses 64-ball LAE FBGA (9 mm × 9 mm); no TSOP option | Preferred for space-constrained PCBs where footprint reduction outweighs TSOP rework compatibility | Select when board layout prioritizes BGA miniaturization and thermal performance over hand-solderability |
| MX29GL256FHTI-90G | Micron part with identical 256 Mb density, 90 ns access, and CFI compliance; lacks integrated ECC and OTP array | Suitable for cost-sensitive designs where external ECC or software-based error handling is acceptable | Choose only if system-level ECC is already implemented and OTP security is not required |
Compared with S29GL256P10TFB020, this TSOP variant offers easier prototyping and thermal management; versus MX29GL256FHTI-90G, it provides hardware ECC and secure OTP-critical for safety- or security-critical boot paths.
Availability
S29GL256S10FHB023 is available at Aetrix Electronics and suitable for industrial automation, automotive electronics, and medical device applications requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified flash memory.
Supply support for S29GL256S10FHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-S family targets high-reliability embedded systems needing fast XIP-capable flash with integrated data integrity features-designed specifically for automotive, industrial, and medical boot memory applications.
FAQ
What is the maximum operating temperature range for S29GL256S10FHB023?
This part is rated for Industrial Plus grade: –40°C to +105°C ambient temperature, verified per Infineon's datasheet Rev. *U section 10.4. It meets AEC-Q100 Grade 2 requirements and is qualified for under-hood automotive use with sustained thermal cycling.
Does S29GL256S10FHB023 support Common Flash Interface (CFI)?
Yes, it implements the Common Flash Interface specification with a standardized parameter table accessible via command sequence. This enables automatic detection of geometry, timing, and protection features by host bootloaders and flash programmers without hard-coded assumptions.
Can the 1024-byte OTP array be reprogrammed after locking?
No-once either of the two OTP lock bits is set, the corresponding 512-byte region becomes permanently read-only. The locking is irreversible and enforced by on-chip fuse logic; no command or voltage sequence can unlock or rewrite a locked region.
Is hardware reset (RESET#) required before power-up?
No-power-on reset (POR) circuitry ensures proper initialization at VCC ramp-up. However, asserting RESET# after power stabilization guarantees return to known read mode and aborts any pending embedded operation, making it essential for recovery from unexpected bus contention or timeout conditions.
S29GL256S10FHB023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL256S10FHB023 FAQ
1.How can I place an order for S29GL256S10FHB023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S10FHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S10FHB023 reliable?
The price and inventory of S29GL256S10FHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10FHB023 is usually 5 days.
3.What payment methods are accepted for S29GL256S10FHB023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10FHB023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S10FHB023?
S29GL256S10FHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S10FHB023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S10FHB023?
For technical support, including S29GL256S10FHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10FHB023 requirements.
6.How does Aetrix verify that S29GL256S10FHB023 is sourced from the original manufacturer or authorized distributors?
All S29GL256S10FHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10FHB023 meets industry standards.
7.What is the process for return or replacement of S29GL256S10FHB023?
All S29GL256S10FHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10FHB023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S10FHB023 part is unused and in its original packaging.
Return procedure for S29GL256S10FHB023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S10FHB023 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
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Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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Microchip Technology
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Microchip Technology
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Microchip Technology
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Microchip Technology
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