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Infineon Technologies S29GL256S10FHI010

Name: S29GL256S10FHI010
Brand: Infineon Technologies
SKU: S29GL256S10FHI010
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S10FHI010

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S10FHI010.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL256S10FHI010 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with MIRRORBIT™ Eclipse 65 nm technology, 3.0 V core supply (2.7–3.6 V), 16-bit data bus, and industrial temperature grade (–40°C to +85°C). It delivers 90 ns random access time, 15 ns page access time, 512-byte write buffer, and on-die ECC for single-bit error correction - deployed in boot code storage for industrial HMIs and firmware update partitions in network edge routers.

For engineers reviewing the S29GL256S10FHI010 datasheet, S29GL256S10FHI010 pinout, S29GL256S10FHI010 application, or S29GL256S10FHI010 equivalent, key selection criteria include asynchronous 16-bit parallel interface timing, sector-erase granularity (128 kB), OTP array support, Versatile I/O voltage range (1.65 V to VCC), and AEC-Q100 grade compatibility options.

Technical Context

This device implements an embedded algorithm controller (EAC) that executes autonomous program/erase operations without host CPU intervention. Its architecture supports page-mode read (32-byte aligned, 15 ns subsequent access) and buffer programming of up to 512 bytes per command, reducing effective write latency by >3× versus byte-by-byte programming.

The flash uses uniform 128-kbyte sectors with advanced sector protection (ASP), supporting both volatile and non-volatile lock bits per sector. Internal hardware ECC operates transparently during read cycles, correcting single-bit errors and flagging uncorrectable multi-bit errors via status register bit 15.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mb (32 MB); supports full firmware image storage for mid-tier microcontrollers
Random Access Time	90 ns at VCC = VIO; enables direct XIP execution from flash in real-time control loops
Page Access Time	15 ns; allows rapid sequential reads within 32-byte pages for instruction prefetching
Write Buffer Size	512 bytes; reduces average programming time per sector by batching writes
ECC Capability	Single-bit correction / double-bit detection; eliminates need for external ECC logic in safety-critical boot memory
Endurance	100,000 program/erase cycles; suitable for field-updatable firmware with infrequent rewrites
Data Retention	20 years at 85°C; meets long-life requirements for industrial infrastructure equipment

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address Inputs	23-bit address bus; A22 selects highest 128 kB sector (AMAX = A23 for 256 Mb)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports word-aligned reads/writes only
CE#	Chip Enable	Active-low enable; controls device power state and bus contention
OE#	Output Enable	Active-low read strobe; gates output drivers during read cycles
WE#	Write Enable	Active-low write strobe; initiates internal program/erase algorithms
RY/BY#	Ready/Busy Output	Open-drain status indicator; low = operation in progress, high = ready
VCC	Core Supply	3.0 V ±0.3 V; powers core logic, charge pumps, and EAC
VIO	I/O Supply	1.65 V to VCC; decouples I/O voltage from core for mixed-voltage system interfacing

Key Features

Feature	Design Value
Asynchronous Page Read	32-byte aligned access with 15 ns subsequent cycle time - accelerates instruction fetch in XIP configurations
512-Byte Write Buffer	Enables single-command programming of up to 512 bytes - cuts buffer-programming time to ~340 µs vs. 1.2 ms for discrete writes
Hardware ECC Engine	Corrects single-bit errors on-the-fly during read; eliminates software overhead and improves boot reliability
Uniform 128-kB Sectors	Enables precise firmware partitioning (e.g., bootloader, app, config) with independent erase control
OTP Array (1024 B)	Two lockable regions for secure storage of keys, calibration data, or device-specific identifiers

Applications

Industrial HMI Boot Memory

Network Edge Router Firmware

Use Scenario: Storing boot loader and kernel image for ARM Cortex-A series SoCs in factory-floor HMIs with no external RAM for initial execution.

IC Role / Device Role / Timing Role: Primary XIP-capable boot memory providing deterministic 90 ns random access for first-stage initialization.

Use Value: Eliminates need for SRAM shadow copy; reduces BOM count and power-on latency by enabling direct execution from flash.

Use Scenario: Holding upgradable firmware images and configuration tables in carrier-grade Ethernet switches operating at –40°C to +85°C.

IC Role / Device Role / Timing Role: Non-volatile firmware repository with sector-level erase isolation for safe dual-image updates.

Use Value: 128 kB uniform sectors allow atomic swap between active/inactive firmware partitions without partial erase risk.

Automotive ADAS Camera Module

Medical Imaging Control Board

Use Scenario: Storing camera sensor calibration data and firmware patches in AEC-Q100 Grade 3 compliant ADAS front cameras.

IC Role / Device Role / Timing Role: Secure, high-reliability storage for mission-critical parameters using OTP lockable regions and ECC.

Use Value: OTP array prevents accidental overwrites of calibration coefficients; ECC ensures integrity across thermal cycling.

Use Scenario: Hosting FPGA configuration bitstreams and diagnostic firmware in portable ultrasound systems requiring 20-year data retention.

IC Role / Device Role / Timing Role: High-density, long-life non-volatile memory for static configuration storage with zero refresh overhead.

Use Value: 20-year retention at 85°C exceeds IEC 62304 Class C lifetime requirements for Class II medical devices.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P10TFI010	Same density and timing, but uses 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP option	Preferred for space-constrained PCBs where board area is prioritized over manual assembly or socketing	Select when footprint miniaturization outweighs need for through-hole or hand-solderable packages
MX29GL256FHT2I-90G	Macronix part with identical 256 Mb density, 90 ns access, and 16-bit bus; lacks integrated ECC and OTP array	Requires external ECC logic or software mitigation; unsuitable for safety-critical boot paths without added validation	Choose only if cost sensitivity dominates and ECC can be handled externally or omitted

Compared with S29GL256P10TFI010, this TSOP variant offers easier prototyping and thermal management; versus MX29GL256FHT2I-90G, it provides built-in ECC and OTP - critical for functional safety and secure boot in regulated environments.

Availability

S29GL256S10FHI010 is available at Aetrix Electronics and suitable for industrial HMIs, network edge routers, automotive ADAS modules, and medical imaging control boards requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL256S10FHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and automotive markets.

The GL-S family targets embedded systems needing robust, high-speed parallel NOR flash with XIP capability, ECC, and long-term data integrity - especially where firmware security, field upgradability, and AEC-Q100 compliance are mandatory.

FAQ

What is the maximum operating temperature range for S29GL256S10FHI010?

This part is rated for industrial temperature range: –40°C to +85°C. It is not the automotive-grade variant (which carries suffix 'A' or 'B' and meets AEC-Q100 Grade 2/3), nor the industrial-plus version (–40°C to +105°C). The 'I' in the part number explicitly denotes industrial grade.

Does S29GL256S10FHI010 support Common Flash Interface (CFI)?

Yes - it implements a full CFI parameter table accessible via standard command sequences (e.g., 98h/00h read mode entry). This enables automatic detection of geometry, timing, and command set by BIOS/bootloader firmware without hard-coded assumptions.

Can S29GL256S10FHI010 operate with VIO = 1.8 V while VCC = 3.3 V?

Yes - its Versatile I/O feature supports VIO from 1.65 V to VCC. At VCC = 3.3 V, VIO may be independently set to 1.8 V, allowing seamless interfacing with 1.8 V logic families while maintaining full 3.3 V core performance and timing specifications.

How is sector protection configured on this device?

Sector protection is implemented via Advanced Sector Protection (ASP), offering both volatile (cleared on power cycle) and non-volatile (persistent) lock bits per 128 kB sector. Configuration uses standard CFI-compliant commands (e.g., 60h/01h) and is controlled through status register bits SR[2:0] and ASP register locations.

S29GL256S10FHI010 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL256S10FHI010 FAQ

1.How can I place an order for S29GL256S10FHI010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10FHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10FHI010 reliable?

The price and inventory of S29GL256S10FHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10FHI010 is usually 5 days.

3.What payment methods are accepted for S29GL256S10FHI010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10FHI010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10FHI010?

S29GL256S10FHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10FHI010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10FHI010?

For technical support, including S29GL256S10FHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10FHI010 requirements.

6.How does Aetrix verify that S29GL256S10FHI010 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10FHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10FHI010 meets industry standards.

7.What is the process for return or replacement of S29GL256S10FHI010?

All S29GL256S10FHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10FHI010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10FHI010 part is unused and in its original packaging.

Return procedure for S29GL256S10FHI010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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