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Infineon Technologies S29GL256S10FHI013
- Part No.:
- S29GL256S10FHI013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S10FHI013.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,144
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Product details
Overview
S29GL256S10FHI013 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware execution in industrial control systems.
For engineers reviewing the S29GL256S10FHI013 datasheet, S29GL256S10FHI013 pinout, S29GL256S10FHI013 application, or S29GL256S10FHI013 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer, Versatile I/O (1.65–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and TSOP-56/LAA/LAE/VBU package compatibility.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting XIP-capable read operations via 32-byte page mode (15 ns intra-page access) and full random access (90 ns). Its embedded algorithm controller handles program/erase commands autonomously, with status reporting via RY/BY# pin, data polling, and status register reads.
The flash array is organized into uniform 128 kB sectors, each individually erasable. Sector protection includes volatile (via command) and non-volatile (via ASP bits) methods, plus a dedicated 1024-byte OTP array with two lockable regions-enabling secure boot configuration and device identity storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 2,097,152 × 16-bit words |
| Random access time | 90 ns at VCC = VIO, enabling fast instruction fetch in microcontroller boot ROM |
| Page access time | 15 ns, allowing rapid sequential reads within 32-byte aligned pages |
| Write buffer size | 512 bytes (256 words), reducing effective programming time vs. byte-by-byte writes |
| ECC capability | Internal hardware single-bit error correction, eliminating need for external ECC logic |
| Endurance & retention | 100,000 program/erase cycles and 20-year data retention at 85°C |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2), validated for under-hood automotive ECUs |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP-I, Type I), 14 mm × 20 mm body, 0.5 mm pitch, JEDEC MO-141AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus; A23 is MSB for 256 Mb density (223 × 16 = 32 MB) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports word-wide reads/writes only |
| CE# | Chip enable | Active-low chip select; controls device power state and command recognition |
| OE# | Output enable | Active-low control for data output drivers during read operations |
| WE# | Write enable | Active-low strobe for latching address/data during program/erase commands |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation (low = busy) |
| VCC | Core supply | 2.7–3.6 V single supply powering core logic, array, and charge pumps |
| VIO | I/O supply | 1.65–VCC versatile I/O voltage, decoupled from core for mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse technology | Enables higher density and lower power vs. legacy 90 nm NOR, with improved reliability |
| Asynchronous 32-byte page read | Reduces average read latency in burst instruction fetch scenarios without clock dependency |
| Automatic hardware ECC | Corrects single-bit errors on-the-fly during read, preserving data integrity without software overhead |
| Advanced sector protection (ASP) | Allows per-sector locking via volatile (power-on reset) or non-volatile (permanent) methods |
| Secure OTP array | 1024-byte one-time-programmable region with dual lock bits for secure key or calibration storage |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps and boot firmware in AEC-Q100 Grade 2 qualified ECU modules. IC Role / Device Role / Timing Role: Non-volatile boot ROM and runtime parameter storage with XIP support. Use Value: 90 ns random access enables deterministic startup timing; 105°C rating ensures reliability in under-hood thermal environments. | Use Scenario: Holding ladder logic firmware and configuration data in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Primary firmware image storage with field-upgradable capability via sector erase. Use Value: 128 kB uniform sectors allow atomic firmware updates without disrupting operational memory regions. |
| Medical Diagnostic Imaging Boot Memory | Avionics Display System Code Storage |
Use Scenario: Hosting boot loader and safety-critical initialization routines in FDA-regulated imaging equipment. IC Role / Device Role / Timing Role: Secure, ECC-protected boot memory with OTP-locked calibration constants. Use Value: Hardware ECC and 20-year data retention meet IEC 62304 long-term reliability requirements. | Use Scenario: Storing display controller firmware and font assets in DO-178C-certified cockpit displays. IC Role / Device Role / Timing Role: High-reliability code storage with suspend/resume during power transitions. Use Value: Program/erase suspend capability prevents corruption during aircraft power cycling events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P10TFI010 | Same density and timing, but uses 64-ball LAA BGA (13×11 mm); no TSOP option | Preferred for space-constrained PCBs where board area is critical | Select when footprint reduction outweighs TSOP rework compatibility needs |
| MX29GL256FHT2I-90G | Macronix part; 90 ns access, but lacks integrated ECC and OTP array | Requires external ECC handling and separate secure storage solution | Choose only if cost sensitivity overrides built-in reliability features |
Compared with S29GL256P10TFI010, this TSOP-56 variant offers direct drop-in replacement in legacy designs; versus MX29GL256FHT2I-90G, it delivers superior data integrity through on-die ECC and secure OTP-critical for safety-certified systems.
Availability
S29GL256S10FHI013 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLCs, medical diagnostic devices, and avionics display systems requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL256S10FHI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.
The GL-S family targets high-reliability embedded systems requiring XIP-capable, high-density NOR flash with automotive-grade qualification, ECC, and flexible I/O voltage operation.
FAQ
Is S29GL256S10FHI013 pin-compatible with earlier S29GL256N or S29GL256P variants?
No. While functionally similar, S29GL256S uses updated command sets and timing parameters. Pinout matches S29GL256P in TSOP-56, but CE#/OE#/WE# setup/hold times differ. Migration requires validation of timing margins and firmware command sequence updates per Rev. *U datasheet Section 11.4.
Does this device support synchronous read modes or DDR interface?
No. S29GL256S10FHI013 is strictly asynchronous-no clock input, no DDR capability. All reads use CE#, OE#, and address setup/hold timing per AC specifications. Page mode relies on address bit toggling, not clocked bursts.
Can the 1024-byte OTP array be reprogrammed after initial lock?
No. Once either OTP lock bit is set (via specific unlock-bypass-lock command sequence), that 512-byte region becomes permanently read-only. The second region remains programmable until its lock bit is also set-enabling staged secure provisioning.
What is the minimum VIO voltage required for reliable operation with VCC = 3.3 V?
VIO must be ≥1.65 V per datasheet Section 10.4. At VCC = 3.3 V and VIO = 1.8 V, all DC and AC specs remain valid-including 90 ns random access and 512-byte buffer programming-but output drive strength is reduced versus VIO = VCC.
S29GL256S10FHI013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL256S10FHI013 FAQ
1.How can I place an order for S29GL256S10FHI013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S10FHI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S10FHI013 reliable?
The price and inventory of S29GL256S10FHI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10FHI013 is usually 5 days.
3.What payment methods are accepted for S29GL256S10FHI013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10FHI013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S10FHI013?
S29GL256S10FHI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S10FHI013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S10FHI013?
For technical support, including S29GL256S10FHI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10FHI013 requirements.
6.How does Aetrix verify that S29GL256S10FHI013 is sourced from the original manufacturer or authorized distributors?
All S29GL256S10FHI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10FHI013 meets industry standards.
7.What is the process for return or replacement of S29GL256S10FHI013?
All S29GL256S10FHI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10FHI013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S10FHI013 part is unused and in its original packaging.
Return procedure for S29GL256S10FHI013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S10FHI013 Tags
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