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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S10FHI020

Name: S29GL256S10FHI020
Brand: Infineon Technologies
SKU: S29GL256S10FHI020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S10FHI020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S10FHI020.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

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Inventory:3,586

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Product details

Overview

S29GL256S10FHI020 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile program retention.

For engineers reviewing the S29GL256S10FHI020 datasheet, S29GL256S10FHI020 pinout, S29GL256S10FHI020 application, or S29GL256S10FHI020 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), OTP array for secure configuration, and AEC-Q100 Grade 2 qualification (–40°C to +105°C).

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard read and 32-byte page mode reads. Its embedded algorithm controller (EAC) manages all program/erase operations-including suspend/resume-and enforces automatic ECC during read cycles.

The flash array is organized into uniform 128 kB sectors, each individually lockable via Advanced Sector Protection (ASP) using volatile or non-volatile methods. The integrated 1024-byte OTP array contains two separately lockable regions for immutable firmware keys or calibration data.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	256 Mb (32 MB), enabling full boot image storage for mid-range MCUs
Random access time	90 ns at VCC = VIO, meeting real-time XIP latency requirements
Page access time	15 ns, accelerating sequential instruction fetch within same 32-byte page
Write buffer size	512 bytes, reducing effective programming time by batching writes
ECC capability	Hardware single-bit error correction, eliminating need for external ECC logic
Endurance	100,000 program/erase cycles per sector, supporting field firmware updates
Data retention	20 years at +85°C, ensuring long-term reliability in unpowered storage

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width), JEDEC standard footprint compatible with legacy board layouts.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address inputs	24-bit word address bus (A23 = MSB); supports 32 MB addressing space
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; operates at VIO voltage (1.65–3.6 V)
CE#	Chip enable	Active-low device select; controls power-down entry when deasserted
OE#	Output enable	Active-low read strobe; gates output drivers without affecting internal state
WE#	Write enable	Active-low control for write/program/erase command latching
RY/BY#	Ready/Busy indicator	Open-drain status pin signaling active embedded operation
RESET#	Hardware reset	Asynchronous active-low reset that halts ongoing operations and clears status
WP#	Write protect	Hardware sector protection override; disables program/erase when asserted

Key Features

Feature	Design Value
Versatile I/O voltage range	VIO supports 1.65–3.6 V, enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers
Uniform 128 kB sector architecture	Enables precise firmware partitioning and independent update of bootloader vs. application sections
Embedded suspend/resume	Allows interruption of long erase cycles (e.g., during system diagnostics) without data loss
Common Flash Interface (CFI)	Standardized parameter table enables automatic driver detection and configuration in BSPs
OTP array with dual lock regions	Secures immutable keys or calibration data against accidental overwrite or malicious tampering

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing boot firmware and safety-critical control logic in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with deterministic 90 ns latency.

Use Value: 20-year data retention and 100,000-cycle endurance ensure firmware integrity over extended maintenance intervals without refresh.

Use Scenario: Holding boot code and sensor calibration data for radar/EPS ECUs certified to AEC-Q100 Grade 2 (–40°C to +105°C).

IC Role / Device Role / Timing Role: Qualified flash memory delivering guaranteed timing and ECC-protected reads under automotive thermal stress.

Use Value: Hardware ECC and OTP lock regions prevent runtime corruption and unauthorized reprogramming of safety-critical parameters.

Medical Imaging System BIOS

Telecom Base Station Configuration

Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound and MRI subsystems requiring high reliability.

IC Role / Device Role / Timing Role: Non-volatile storage with page-mode read acceleration for rapid initialization sequences.

Use Value: 15 ns page access time reduces system boot latency; 128 kB sector erase allows safe field updates without full reflash.

Use Scenario: Storing protocol stacks and hardware configuration profiles in 5G remote radio units exposed to wide temperature swings.

IC Role / Device Role / Timing Role: Parallel NOR flash supporting hot-swap-aware firmware recovery via CFI-identified sector layout.

Use Value: CFI compliance enables automatic driver adaptation across multiple baseband SoCs; ASP supports selective lockdown of carrier-specific settings.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256S10TFI020	Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm) package instead of 56-pin TSOP	Preferred for space-constrained PCBs where board area is critical and BGA assembly is available	Select for high-density routing or thermal performance needs; requires BGA rework capability
MX29GL256FHTI-90G	Micron device; 90 ns access, 128 kB sectors, but no integrated hardware ECC or OTP array	Lacks ECC and OTP-requires external error handling and secure provisioning infrastructure	Choose only if cost sensitivity outweighs ECC/OTP benefits and system-level ECC is already implemented

Compared with S29GL256S10FHI020, the TSOP variant offers drop-in compatibility with legacy designs, while the BGA alternative trades package flexibility for footprint reduction; the Micron part omits hardware ECC and OTP, increasing software validation burden in safety-critical use cases.

Availability

S29GL256S10FHI020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across multi-year production cycles.

Supply support for S29GL256S10FHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.

The GL-S family targets high-reliability embedded systems needing deterministic XIP performance, robust data retention, and hardware-assisted security features-specifically for industrial automation, automotive, and medical equipment.

FAQ

What is the maximum operating temperature range for S29GL256S10FHI020?

This part is qualified to Industrial Plus grade (–40°C to +105°C), verified per Infineon's internal qualification test plan and documented in the 001-98285 Rev. *U datasheet Section 10.4. It meets AEC-Q100 Grade 2 requirements for automotive applications, including thermal cycling and high-temperature operating life testing.

Does S29GL256S10FHI020 support byte-level writes?

No. The device only supports word-level (16-bit) writes. All program operations require aligned 16-bit data transfers on DQ0–DQ15, and the internal write buffer accepts up to 512 bytes in multiples of 16-bit words. Byte masking or partial-word programming is not supported.

How is the 1024-byte OTP array protected from accidental overwrite?

The OTP array is divided into two independently lockable regions. Once locked via dedicated CFI commands (0x60 followed by 0xD0), the lock becomes permanent and irreversible-even after power cycle or reset. Lock status is readable through the CFI query mode and reflected in the status register.

Can S29GL256S10FHI020 be used with a 1.8 V I/O interface?

Yes. Its Versatile I/O feature supports VIO from 1.65 V to 3.6 V. When VIO = 1.8 V, all input thresholds and output drive levels comply with 1.8 V logic families, and timing parameters (e.g., tCE, tOE) are guaranteed per the "VersatileIO" column in the Performance Summary table (Datasheet p.2).

S29GL256S10FHI020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL256S10FHI020 FAQ

1.How can I place an order for S29GL256S10FHI020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10FHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10FHI020 reliable?

The price and inventory of S29GL256S10FHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10FHI020 is usually 5 days.

3.What payment methods are accepted for S29GL256S10FHI020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10FHI020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10FHI020?

S29GL256S10FHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10FHI020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10FHI020?

For technical support, including S29GL256S10FHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10FHI020 requirements.

6.How does Aetrix verify that S29GL256S10FHI020 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10FHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10FHI020 meets industry standards.

7.What is the process for return or replacement of S29GL256S10FHI020?

All S29GL256S10FHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10FHI020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10FHI020 part is unused and in its original packaging.

Return procedure for S29GL256S10FHI020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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