Infineon Technologies S29GL256S10FHIV10
- Part No.:
- S29GL256S10FHIV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S10FHIV10.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:898
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Product details
Overview
S29GL256S10FHIV10 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile firmware retention.
For engineers reviewing the S29GL256S10FHIV10 datasheet, S29GL256S10FHIV10 pinout, S29GL256S10FHIV10 application, or S29GL256S10FHIV10 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte programming buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), and AEC-Q100 Grade 2 qualification (–40°C to +105°C).
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status reporting via RY/BY# pin or status register, and suspend/resume capability during active operations.
The internal architecture includes separate secure silicon region (1024-byte OTP with dual lockable sectors), advanced sector protection (volatile/non-volatile), and CFI-compliant parameter table for host software identification. ECC logic operates transparently during read cycles without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (32 MB), mapped as 223 × 16-bit words - supports full firmware image storage for mid-range MCUs. |
| Random Access Time | 90 ns at VCC = VIO - enables direct XIP execution from flash with minimal wait states. |
| Page Access Time | 15 ns - allows rapid sequential reads within 32-byte aligned pages, improving code fetch efficiency. |
| Programming Buffer | 512 bytes - reduces effective programming time by batching up to 256 words per command, accelerating firmware updates. |
| Erase Granularity | Uniform 128 kB sectors - simplifies wear leveling and field firmware patching without cross-sector dependencies. |
| Data Retention | 20 years - ensures long-term reliability in unpowered industrial deployments without refresh. |
| Endurance | 100,000 program/erase cycles - supports frequent over-the-air (OTA) update cycles in connected edge devices. |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, JEDEC MO-141AC compliant, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit address bus; A23 is MSB for 256 Mb density (223 words), enabling full memory mapping. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes and reads; compatible with 16-bit microcontroller interfaces. |
| CE# | Chip Enable | Active-low chip select; controls device power state and enables read/write operations when asserted. |
| OE# | Output Enable | Active-low control for data output drivers; used to gate read data onto DQ bus without affecting internal state. |
| WE# | Write Enable | Active-low signal initiating write/program/erase commands; latches address/data on rising edge. |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations (program/erase), high when ready for next command. |
| VCC | Core Supply | 2.7–3.6 V main supply powering core logic, array, and EAC - eliminates need for separate I/O rail. |
| VIO | I/O Supply | 1.65–3.6 V flexible I/O voltage - allows interfacing with 1.8 V, 2.5 V, or 3.3 V controllers without level shifters. |
| WP# | Write Protect | Hardware sector protection enable; when low, locks protected sectors against accidental program/erase. |
| RESET# | Hardware Reset | Active-low asynchronous reset; forces device into standby and clears internal command registers. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | On-the-fly single-bit error correction during read cycles - eliminates need for external error-handling firmware overhead. |
| Versatile I/O | Independent VIO supply (1.65–3.6 V) - enables direct connection to mixed-voltage SoCs without external level translation. |
| Suspend/Resume | Interruptible program/erase operations - allows high-priority read access during background writes, critical for real-time systems. |
| Secure Silicon Region | 1024-byte OTP array with two independently lockable sectors - stores cryptographic keys or calibration data with irreversible write protection. |
| CFI Compliance | Standard Common Flash Interface parameter table - enables automatic detection and configuration by bootloader or flash utility software. |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with deterministic 90 ns latency. Use Value: 20-year data retention and 100K erase cycles ensure firmware integrity across extended maintenance intervals without replacement. | Use Scenario: Holding safety-critical boot code and sensor calibration data in automotive camera modules certified to AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: AEC-Q100 qualified parallel NOR flash serving as primary boot device for SoC initialization at –40°C to +105°C. Use Value: Hardware ECC and OTP secure silicon region protect against bit flips and unauthorized firmware modification in safety-critical paths. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound machines requiring zero-failure firmware reliability. IC Role / Device Role / Timing Role: High-reliability boot memory with 128 kB uniform sector erase enabling safe field updates of diagnostic firmware. Use Value: Sector protection and suspend/resume allow atomic firmware upgrades without interrupting live imaging sessions. | Use Scenario: Storing configuration profiles and protocol stacks in 5G remote radio units deployed in outdoor cabinets with wide thermal swings. IC Role / Device Role / Timing Role: Industrial-grade parallel flash providing fast read access for baseband processor initialization and runtime parameter loading. Use Value: Versatile I/O (1.65–3.6 V) accommodates mixed-signal ASICs while 512-byte buffer accelerates configuration reload after power cycling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P10TFIV10 | Same density and timing, but uses 64-ball LAE Fortified BGA (9 mm × 9 mm) instead of TSOP. | Targeted at space-constrained PCB layouts where footprint reduction outweighs manual soldering complexity. | Select when board area is constrained and reflow assembly is available. |
| MX29GL256FHT2I-90G | Macronix part with identical 256 Mb density, 90 ns access, and 128 kB sectors, but lacks integrated hardware ECC and OTP region. | Requires external ECC handling and software-based sector locking - increases firmware complexity and reduces security assurance. | Select only if cost sensitivity outweighs ECC and secure silicon requirements. |
Compared with S29GL256P10TFIV10, this TSOP variant offers easier prototyping and rework; compared with MX29GL256FHT2I-90G, it delivers stronger data integrity and tamper resistance via on-die ECC and OTP - critical for safety- and security-sensitive deployments.
Availability
S29GL256S10FHIV10 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended product lifecycles.
Supply support for S29GL256S10FHIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-S family targets high-reliability embedded systems needing fast, secure, and long-life parallel NOR flash - optimized for boot code storage, firmware updates, and configuration retention in harsh thermal and electrical environments.
FAQ
Is S29GL256S10FHIV10 pin-compatible with earlier S29GL256N or S29GL256P variants?
No. While functionally similar, S29GL256S introduces updated command set enhancements, revised timing parameters (e.g., tPACC = 15 ns vs. 25 ns), and added features like enhanced OTP locking. Pinout remains identical for same package type (e.g., 56-pin TSOP), but firmware must be validated against the S revision command table and timing specifications.
Does the hardware ECC correct errors during program or erase operations?
No. Hardware ECC operates exclusively during read operations to detect and correct single-bit errors in retrieved data. It does not apply to programming or erasing - those operations rely on internal verify algorithms and status flag reporting (e.g., P/E failure bits in status register) rather than ECC correction.
Can the Versatile I/O feature support mixed-voltage operation where VCC = 3.3 V and VIO = 1.8 V simultaneously?
Yes. The device explicitly supports independent VCC (2.7–3.6 V) and VIO (1.65–3.6 V) supplies. With VCC = 3.3 V and VIO = 1.8 V, input thresholds adapt to 1.8 V logic levels while core logic runs at 3.3 V, enabling direct interface with 1.8 V FPGAs or application processors without external level shifters.
What happens to the RY/BY# pin during a suspended erase operation?
During suspension, RY/BY# transitions high to indicate readiness for read commands, but the internal erase operation remains paused. After resuming, RY/BY# goes low again until completion. This behavior enables time-critical reads (e.g., sensor polling) without aborting or restarting the erase cycle - confirmed in Section 5.5 of the datasheet.
S29GL256S10FHIV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL256S10FHIV10 FAQ
1.How can I place an order for S29GL256S10FHIV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S10FHIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S10FHIV10 reliable?
The price and inventory of S29GL256S10FHIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10FHIV10 is usually 5 days.
3.What payment methods are accepted for S29GL256S10FHIV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10FHIV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S10FHIV10?
S29GL256S10FHIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S10FHIV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S10FHIV10?
For technical support, including S29GL256S10FHIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10FHIV10 requirements.
6.How does Aetrix verify that S29GL256S10FHIV10 is sourced from the original manufacturer or authorized distributors?
All S29GL256S10FHIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10FHIV10 meets industry standards.
7.What is the process for return or replacement of S29GL256S10FHIV10?
All S29GL256S10FHIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10FHIV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S10FHIV10 part is unused and in its original packaging.
Return procedure for S29GL256S10FHIV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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