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Infineon Technologies S29GL256S10FHIV20

Name: S29GL256S10FHIV20
Brand: Infineon Technologies
SKU: S29GL256S10FHIV20
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S10FHIV20

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S10FHIV20.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL256S10FHIV20 from Infineon is a 256 Mb (32 MB), 16-bit parallel NOR flash memory IC using 65 nm MIRRORBIT™ Eclipse technology, with 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports asynchronous read, buffered programming (512-byte max), and uniform 128 kB sector erase - deployed in automotive instrument clusters for firmware storage and boot code execution.

For engineers reviewing the S29GL256S10FHIV20 datasheet, S29GL256S10FHIV20 pinout, S29GL256S10FHIV20 application, or S29GL256S10FHIV20 equivalent, key selection criteria include verified 16-bit parallel interface timing compliance, OTP array support for secure configuration, ASP-based sector protection granularity, and AEC-Q100 Grade 3 qualification for automotive embedded systems.

Technical Context

This device implements an asynchronous parallel interface with dedicated CE#, OE#, and WE# control lines, supporting word-aligned addressing (A0–A23) and 32-byte page-aligned reads. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and suspend/resume capability during active operations.

The internal architecture integrates a 1024-byte one-time-programmable (OTP) array with two lockable regions, Common Flash Interface (CFI) parameter table for host auto-configuration, and advanced sector protection (ASP) enabling independent volatile/non-volatile locking per 128 kB sector - critical for firmware partitioning and secure boot enforcement.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mb (32 MB); supports full firmware image storage for mid-tier automotive ECUs
Interface	Asynchronous 16-bit parallel; requires no clock signal, simplifies legacy microcontroller integration
Access Time	90 ns random / 15 ns page; enables fast XIP execution without external cache
Programming Buffer	512 bytes; reduces average programming time by >60% vs. single-word writes
Erase Unit	Uniform 128 kB sectors; allows precise firmware update partitioning without disturbing adjacent code
Data Retention	20 years at 85°C; meets long-life requirements for automotive infotainment and ADAS modules
Endurance	100,000 program/erase cycles; sufficient for over-the-air (OTA) update logging and calibration storage
Temperature Grade	AEC-Q100 Grade 3 (–40°C to +85°C); qualified for passenger compartment electronics

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address inputs	24-bit word address bus; A23 is MSB for 256 Mb density (32 MB × 16-bit)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes via BE# control (not present on this variant)
CE#	Chip enable	Active-low device select; controls power state and command latching timing window
OE#	Output enable	Active-low read strobe; gates output drivers during asynchronous read cycles
WE#	Write enable	Active-low write strobe; initiates command sequences and data latching for program/erase
RY/BY#	Ready/Busy indicator	Open-drain output; low during embedded operations, used for polling or interrupt-driven status handling
RESET#	Hardware reset	Active-low asynchronous reset; forces device into reading state and clears internal state machines
VCC	Core supply	3.0 V ±0.3 V supply; powers logic, array, and EAC; supports 2.7–3.6 V operation
VIO	I/O supply	1.65–VCC V; decouples I/O voltage from core, enabling mixed-voltage system interfacing
WP#	Write protect	Active-low hardware sector protection enable; overrides software-based ASP when asserted

Key Features

Feature	Design Value
Hardware ECC	Single-bit error correction with automatic detection; eliminates need for external error-handling firmware overhead
512-byte programming buffer	Enables burst programming of up to 512 bytes per command; cuts typical firmware update time by 3× vs. standard algorithms
Uniform 128 kB sectors	Provides deterministic erase boundaries for OTA update rollback and dual-bank firmware switching
Advanced Sector Protection (ASP)	Per-sector volatile/non-volatile lock control; prevents accidental overwrite of bootloader or calibration data
1024-byte OTP array	Two independently lockable regions for secure key storage and device-specific configuration binding
CFI-compliant interface	Enables automatic host detection of geometry, timing, and command set - simplifies driver portability across GL-S family

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing and executing boot code, GUI assets, and real-time gauge rendering logic in digital dashboards.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability; delivers sub-100 ns instruction fetch latency to MCU.

Use Value: Eliminates external SRAM caching; reduces BOM count and PCB area while meeting AEC-Q100 Grade 3 thermal reliability.

Use Scenario: Holding firmware images, configuration tables, and field-updatable logic programs in programmable logic controllers.

IC Role / Device Role / Timing Role: Asynchronous parallel boot memory mapped to microcontroller address space; supports hot firmware swap via sector erase isolation.

Use Value: 128 kB uniform sectors allow atomic replacement of control logic blocks without disrupting I/O runtime execution.

Medical Diagnostic Imaging Bootloader

Avionics Display System Code Storage

Use Scenario: Securing certified bootloader and safety-critical initialization routines in portable ultrasound and MRI control units.

IC Role / Device Role / Timing Role: Trusted firmware root-of-trust storage; leverages OTP array for cryptographic key binding and ASP for immutable bootloader region.

Use Value: Hardware-enforced write protection prevents unauthorized modification; 20-year data retention ensures long-term regulatory compliance.

Use Scenario: Hosting display firmware, font libraries, and graphics acceleration microcode in cockpit multifunction displays.

IC Role / Device Role / Timing Role: High-reliability parallel flash for deterministic boot sequence; uses RY/BY# pin for interrupt-driven status reporting in DO-254 compliant designs.

Use Value: 90 ns random access enables direct execution of display initialization routines, reducing boot time by ≥120 ms vs. serial flash alternatives.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P10TFIV20	Same density and timing, but 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP option	Preferred for space-constrained automotive modules where board-level routing density outweighs ease of rework	Select when footprint miniaturization and thermal performance supersede manual soldering accessibility
MX29GL256FHT2I-90G	Macronix part; 90 ns access, same 56-pin TSOP, but lacks OTP array and ASP granularity (only block protection)	Suitable for cost-sensitive industrial control where secure key storage and fine-grained sector locking are not required	Select only if CFI compatibility and basic sector erase meet functional needs and security is handled externally

Compared with S29GL256P10TFIV20, the TSOP package offers superior reworkability and thermal dissipation in convection-cooled environments; versus MX29GL256FHT2I-90G, the Infineon part provides hardware ECC and OTP - essential for safety-certified firmware integrity.

Availability

S29GL256S10FHIV20 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical diagnostic boot systems, and avionics display modules requiring stable component supply, long-lifecycle support, and AEC-Q100-compliant flash memory.

Supply support for S29GL256S10FHIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certification aligned to ISO/TS 16949 and IATF 16949.

The GL-S family targets automotive and industrial embedded systems requiring deterministic boot performance, firmware security, and extended temperature operation - designed specifically to replace legacy parallel NOR flash in safety-critical XIP applications.

FAQ

What is the maximum operating frequency supported by S29GL256S10FHIV20?

This device is asynchronous and does not use a clock signal; its performance is defined by access times, not frequency. The 90 ns random access time corresponds to effective operation at up to ~11 MHz for worst-case sequential reads, but actual throughput depends on bus protocol timing margins and host controller setup/hold requirements per datasheet AC specifications.

Does S29GL256S10FHIV20 support both 1.8 V and 3.3 V I/O interfaces?

Yes - the versatile I/O feature supports VIO from 1.65 V to VCC, enabling direct connection to 1.8 V or 3.3 V microcontrollers without level shifters. When VCC = 3.0 V, VIO may be independently set to 1.8 V or 3.3 V, and all I/O pins (DQ0–DQ15, CE#, OE#, WE#, etc.) comply with respective voltage thresholds.

How is the 1024-byte OTP array organized and accessed?

The OTP array occupies a dedicated address space (0x0000_0000–0x0000_03FF) and is divided into two 512-byte lockable regions. Access requires issuing the CFI query command followed by specific unlock-bypass sequences; once locked (via dedicated OTP lock command), a region becomes permanently read-only and immune to erase or program commands.

Can S29GL256S10FHIV20 be used in systems requiring data encryption at rest?

No - this device provides hardware ECC for bit-error correction and ASP/OTP for write protection, but it does not implement cryptographic engines, AES acceleration, or secure key storage beyond the OTP array. Encryption must be handled externally by the host MCU or dedicated security IC before writing data to flash.

S29GL256S10FHIV20 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL256S10FHIV20 FAQ

1.How can I place an order for S29GL256S10FHIV20 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10FHIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10FHIV20 reliable?

The price and inventory of S29GL256S10FHIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10FHIV20 is usually 5 days.

3.What payment methods are accepted for S29GL256S10FHIV20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10FHIV20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10FHIV20?

S29GL256S10FHIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10FHIV20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10FHIV20?

For technical support, including S29GL256S10FHIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10FHIV20 requirements.

6.How does Aetrix verify that S29GL256S10FHIV20 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10FHIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10FHIV20 meets industry standards.

7.What is the process for return or replacement of S29GL256S10FHIV20?

All S29GL256S10FHIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10FHIV20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10FHIV20 part is unused and in its original packaging.

Return procedure for S29GL256S10FHIV20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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