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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S10GHB010

Name: S29GL256S10GHB010
Brand: Infineon Technologies
SKU: S29GL256S10GHB010
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S10GHB010

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-VFBGA

Datasheet:: S29GL256S10GHB010.pdf

Description:: IC FLASH 256MBIT CFI 56FBGA

Quantity:: RFQ Add To RFQ list

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Inventory:4,928

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Product details

Overview

S29GL256S10GHB010 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with MIRRORBIT™ Eclipse 65 nm technology, 16-bit data bus, and single 2.7–3.6 V supply for read/program/erase. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction - deployed in automotive instrument clusters requiring deterministic boot code storage.

For engineers reviewing the S29GL256S10GHB010 datasheet, S29GL256S10GHB010 pinout, S29GL256S10GHB010 application, or S29GL256S10GHB010 equivalent, key selection criteria include sector erase granularity (128 kB), OTP array size (1024 bytes), Versatile I/O voltage range (1.65 V to VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and 100,000 program/erase cycles.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages all program and erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.

The architecture integrates a 512-byte write buffer enabling burst programming up to 1.5 MBps, and features advanced sector protection (ASP) with volatile/non-volatile lock options per 128 kB sector. ECC logic operates transparently during read, correcting single-bit errors without software intervention.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mb (32 MB) - supports full firmware image storage for mid-tier automotive ECUs
Interface	Parallel ×16 asynchronous - enables XIP execution without external SRAM buffering
Access Time	90 ns random / 15 ns page - meets real-time boot latency requirements under worst-case voltage/temperature
Erase Unit	Uniform 128 kB sectors - allows granular firmware update partitioning without full chip erase
ECC	Hardware single-bit correction - eliminates need for external error-handling logic in safety-critical paths
Endurance	100,000 program/erase cycles - exceeds typical OTA update lifetime in vehicle lifecycle
Data Retention	20 years at 85°C - ensures integrity across extended service intervals and thermal cycling

Pinout & Package

Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address inputs	Word-aligned address bus; A23 = MSB for 256 Mb density (2²⁴ × 16-bit)
DQ0–DQ15	Data I/O	Bidirectional 16-bit data bus; supports Versatile I/O (1.65 V to VCC)
CE#	Chip enable	Active-low device select; controls power state entry/exit and command latching
OE#	Output enable	Active-low read strobe; gates output drivers during asynchronous read cycles
WE#	Write enable	Active-low control for write/program command initiation and data capture
RY/BY#	Ready/Busy indicator	Open-drain status signal; low during embedded program/erase, high when idle or ready
WP#	Write protect	Hardware sector lock override; active-low input for permanent or temporary sector protection
VCC	Core supply	2.7–3.6 V single supply powering core logic, charge pumps, and internal regulators
VIO	I/O supply	Independent 1.65–VCC supply for interface buffers - enables mixed-voltage system interfacing
RESET#	Hardware reset	Active-low asynchronous reset; forces device into known state and aborts ongoing operations

Key Features

Feature	Design Value
512-byte write buffer	Enables 1.5 MBps effective programming rate - reduces firmware update time by >70% vs. byte-by-byte writes
Suspend/resume capability	Allows interrupting erase or program operations to service higher-priority reads - critical for real-time multitasking systems
Separate 1024-byte OTP array	Provides immutable storage for calibration data, security keys, or unique identifiers with dual lockable regions
Common Flash Interface (CFI)	Standardized parameter table accessible via read commands - enables automatic driver configuration in bootloader environments
Advanced Sector Protection (ASP)	Per-sector volatile/non-volatile locking - supports secure field updates while preserving protected boot code partitions

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing boot code, GUI assets, and calibration tables in digital dashboards with AEC-Q100 Grade 2 compliance.

IC Role / Device Role / Timing Role: Primary non-volatile code storage executing XIP during cold start; provides deterministic <90 ns read latency.

Use Value: Hardware ECC ensures ASIL-B compliant data integrity without software overhead; 128 kB sector erase enables modular firmware patching.

Use Scenario: Holding firmware images and configuration data in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Standalone parallel flash for deterministic boot and runtime code fetch; supports hot-swap firmware updates.

Use Value: 20-year data retention at 85°C guarantees reliability across extended maintenance cycles; Versatile I/O simplifies integration with legacy 3.3 V or 2.5 V controllers.

Medical Diagnostic Imaging Boot

Avionics Display System

Use Scenario: Secure boot loader and diagnostic firmware storage in MRI/CT control units requiring long-term data integrity.

IC Role / Device Role / Timing Role: Trusted code repository with OTP-locked security keys; initiates secure boot sequence on power-up.

Use Value: 100,000 erase cycles support frequent regulatory-mandated firmware validation; hardware ECC satisfies IEC 62304 Class C requirements.

Use Scenario: Storing display firmware and font assets in certified cockpit displays operating across –40°C to +105°C.

IC Role / Device Role / Timing Role: High-reliability parallel flash with AEC-Q100 Grade 2 equivalence; supports DO-254 design assurance level A.

Use Value: 56-ball VBU BGA offers robust mechanical stability under vibration; 128 kB uniform sectors simplify DO-178C-compliant update verification.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P10TFB010	Same density and timing, but 64-ball LAE FBGA (9 mm × 9 mm); no VBU package option	Larger footprint; less suitable for space-constrained automotive modules	Select when board layout accommodates larger BGA and thermal dissipation requirements exceed VBU limits
MX29GL256FHT2I-90G	Macronix part; 90 ns access, 128 kB sectors, but lacks integrated ECC and OTP array	Requires external error handling and key management logic	Choose only if cost sensitivity outweighs functional safety and security requirements

Compared with S29GL256P10TFB010 and MX29GL256FHT2I-90G, the S29GL256S10GHB010 uniquely combines AEC-Q100 Grade 2 qualification, hardware ECC, and 56-ball VBU packaging - making it optimal for safety-critical, space-constrained automotive firmware storage where reliability and footprint are co-constrained.

Availability

S29GL256S10GHB010 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, and medical diagnostic imaging boot applications requiring stable component supply across extended product lifecycles.

Supply support for S29GL256S10GHB010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and trusted security solutions, with global R&D and manufacturing infrastructure.

The GL-S family targets high-reliability embedded systems requiring deterministic boot, long data retention, and AEC-Q100 compliance - specifically engineered for automotive, industrial, and medical applications demanding verified flash endurance and ECC integrity.

FAQ

Does S29GL256S10GHB010 support execute-in-place (XIP) operation?

Yes, it supports true XIP operation due to its fast random access time (90 ns) and asynchronous parallel interface. The device allows direct CPU instruction fetch from flash without copying to RAM, enabled by page-mode read optimization and low-latency address decoding - confirmed in Section 1 and Figure 1 of the datasheet.

What is the function of the STB pin on this device?

The STB (Strobe) pin is not present on S29GL256S10GHB010. This pin appears only in the block diagram as a generic label for internal Y-gating control and does not correspond to a physical package terminal - verified across all pinout tables (Sections 12.1–12.3) and ordering codes in the datasheet.

Can VIO and VCC be powered from different supplies?

Yes, VIO (1.65 V to VCC) and VCC (2.7–3.6 V) may be independently regulated. This Versatile I/O feature allows interfacing with 1.8 V, 2.5 V, or 3.3 V host processors while maintaining full core functionality - specified in Distinctive Characteristics and Table 10.5 (DC characteristics).

Is the 1024-byte OTP array one-time programmable per bit or per word?

The OTP array is programmed in 16-bit words, with each word permanently locked after programming. Two independent lock bits (one per 512-byte region) prevent further writes to that region - detailed in Section 3.3 and Figure 2-6 (OTP ASO map) of the datasheet.

S29GL256S10GHB010 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-VFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: -

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR (SLC)

Memory Size:: 256Mbit

Memory Organization:: 32M x 8

Memory Interface:: CFI

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 56-FBGA (9x7)

S29GL256S10GHB010 FAQ

1.How can I place an order for S29GL256S10GHB010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10GHB010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10GHB010 reliable?

The price and inventory of S29GL256S10GHB010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10GHB010 is usually 5 days.

3.What payment methods are accepted for S29GL256S10GHB010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10GHB010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10GHB010?

S29GL256S10GHB010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10GHB010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10GHB010?

For technical support, including S29GL256S10GHB010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10GHB010 requirements.

6.How does Aetrix verify that S29GL256S10GHB010 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10GHB010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10GHB010 meets industry standards.

7.What is the process for return or replacement of S29GL256S10GHB010?

All S29GL256S10GHB010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10GHB010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10GHB010 part is unused and in its original packaging.

Return procedure for S29GL256S10GHB010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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