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Infineon Technologies S29GL256S10GHB013

Name: S29GL256S10GHB013
Brand: Infineon Technologies
SKU: S29GL256S10GHB013
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S10GHB013

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-VFBGA

Datasheet:: S29GL256S10GHB013.pdf

Description:: IC FLASH 256MBIT CFI 56FBGA

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Product details

Overview

S29GL256S10GHB013 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-enabling reliable code storage in automotive instrument clusters and industrial HMI boot memory.

For engineers reviewing the S29GL256S10GHB013 datasheet, S29GL256S10GHB013 pinout, S29GL256S10GHB013 application, or S29GL256S10GHB013 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte programming buffer throughput (1.5 MBps), Versatile I/O support (1.65–VCC), and AEC-Q100 Grade 2 qualification (–40°C to +105°C).

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.

The flash array is organized into uniform 128 kB sectors, each individually erasable, and includes a dedicated 1024-byte OTP array with two lockable regions. Internal hardware ECC performs real-time single-bit correction during read cycles without software intervention.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mb (32 MB); supports full firmware image storage for mid-tier microcontrollers.
Random Access Time	90 ns at VCC = VIO; enables direct XIP execution from flash in real-time control loops.
Page Access Time	15 ns; allows rapid sequential reads within 32-byte aligned pages for burst instruction fetch.
Programming Buffer	512 bytes; reduces effective programming time by batching up to 256 words per command.
ECC Support	Internal hardware single-bit error correction; eliminates need for external ECC logic or software overhead.
Endurance	100,000 program/erase cycles per sector; suitable for field-upgradable firmware with frequent OTA updates.
Data Retention	20 years at +85°C; ensures long-term reliability in automotive under-hood and industrial edge deployments.

Pinout & Package

Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.55 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address Inputs	24-bit word address bus; A23 is MSB for 256 Mb density (2²⁴ × 16 bits = 256 Mb).
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes and reads with no external data-width translation.
CE#	Chip Enable	Active-low enable controlling device selection; tCE = 90 ns max defines minimum chip select assertion window.
OE#	Output Enable	Active-low read strobe; tOE = 25 ns max governs output valid timing relative to OE# assertion.
WE#	Write Enable	Active-low write strobe; initiates internal program/erase algorithms when combined with command sequences.
RY/BY#	Ready/Busy Output	Open-drain status indicator; low during active program/erase, high when operation complete or idle.
RESET#	Hardware Reset	Active-low asynchronous reset; forces device into reading state and aborts ongoing embedded operations.
VCC	Core Supply	2.7–3.6 V single supply powering core logic, array, and EAC; no separate VPP required.
VIO	I/O Supply	1.65–VCC versatile I/O voltage; decouples interface level from core voltage for mixed-voltage system integration.

Key Features

Feature	Design Value
Uniform 128 kB Sector Erase	Enables precise firmware partitioning-e.g., separate bootloader, application, and parameter sectors-with deterministic erase time per region.
512-Byte Programming Buffer	Reduces average programming latency by >60% vs. single-word writes, critical for fast factory programming and field updates.
Hardware ECC Engine	Corrects single-bit errors on-the-fly during read; eliminates uncorrectable errors in systems lacking software ECC layers.
Suspend/Resume Capability	Allows interrupting long erase operations (e.g., 477 kBps sector erase) to service high-priority reads-essential for real-time responsiveness.
OTP Array with Dual Lock Regions	Provides secure storage for calibration data and cryptographic keys; each 512-byte region independently lockable via hardware fuse.

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing boot code and GUI assets for digital dashboards operating across –40°C to +105°C ambient.

IC Role / Device Role / Timing Role: Primary non-volatile XIP code memory interfaced directly to ARM Cortex-M7 MCU via parallel bus.

Use Value: 90 ns random access enables sub-100 µs interrupt response; AEC-Q100 Grade 2 rating guarantees operation under thermal cycling stress.

Use Scenario: Holding firmware and configuration tables in programmable logic controllers deployed in factory automation cabinets.

IC Role / Device Role / Timing Role: Standalone boot memory with sector protection preventing accidental overwrite of safety-critical runtime code.

Use Value: Uniform 128 kB sectors allow independent locking of bootloader and application partitions; 20-year retention ensures 15+ year product lifecycle support.

Medical Imaging Control Panel

Avionics Display Boot Memory

Use Scenario: Hosting UI firmware and diagnostic routines in portable ultrasound and MRI control interfaces requiring high reliability.

IC Role / Device Role / Timing Role: Code-execution flash with hardware ECC ensuring bit-error-free instruction fetch during critical imaging sessions.

Use Value: Internal ECC eliminates silent data corruption risk; 100,000-cycle endurance supports frequent regulatory-mandated firmware validation updates.

Use Scenario: Storing certified boot images and display drivers in DO-178C-compliant cockpit displays with strict data integrity requirements.

IC Role / Device Role / Timing Role: Certified non-volatile memory providing deterministic read timing and verified erase behavior for safety-critical boot path.

Use Value: CFI-compliant interface enables automated flash verification during production test; RY/BY# pin supports real-time status monitoring in dual-CPU watchdog schemes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P10TFI010	Same density and architecture but 64-ball LAE FBGA (9 mm × 9 mm); lacks Versatile I/O (VIO fixed to VCC).	Preferred for space-constrained PCBs where BGA routing is feasible; not suitable for mixed-voltage host interfaces.	Select when board layout favors BGA and I/O voltage matching is guaranteed.
MX29GL256FHT2I-90G	Micron 256 Mb parallel NOR; 90 ns access, but no integrated hardware ECC and only 10,000 erase cycles.	Acceptable for cost-sensitive consumer HMI where ECC is handled in software and update frequency is low.	Choose only if ECC and endurance requirements are relaxed and total BOM cost is primary driver.

Compared with S29GL256P10TFI010, this TSOP-packaged variant offers superior I/O flexibility and identical performance; versus MX29GL256FHT2I-90G, it delivers 10× higher endurance and autonomous ECC-critical for safety-certified and field-upgradable systems.

Availability

S29GL256S10GHB013 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, and medical imaging control panels requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL256S10GHB013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and trusted security solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

The GL-S family targets high-reliability embedded systems needing deterministic XIP performance and robust data integrity-designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 qualification and 20-year data retention.

FAQ

Does S29GL256S10GHB013 support execute-in-place (XIP) operation?

Yes. The device supports true XIP operation with 90 ns random access time and 15 ns page-mode reads, enabling direct instruction fetch by compatible microcontrollers without copying to RAM. Its asynchronous interface and deterministic timing meet real-time OS requirements for automotive and industrial control applications.

What is the function of the Versatile I/O (VIO) feature?

VIO allows independent supply voltage (1.65 V to VCC) for the DQ pins, enabling seamless interfacing with hosts operating at lower I/O voltages (e.g., 1.8 V or 2.5 V) while maintaining full 3.0 V core functionality. This eliminates level-shifter components in mixed-voltage designs.

How does the hardware ECC engine operate during read cycles?

The ECC engine automatically checks every 16-bit word during read access and corrects single-bit errors in real time using internal syndrome calculation. No software intervention or additional latency is required-the corrected data appears on DQ lines transparently, and uncorrectable multi-bit errors trigger status flag assertion.

Can sector protection be configured dynamically during runtime?

Yes. Advanced Sector Protection (ASP) supports both volatile (register-based) and non-volatile (lock-bit) methods. Volatile protection can be enabled/disabled via command sequences during operation, while non-volatile locking persists through power cycles-ideal for securing bootloader sectors against accidental reprogramming.

S29GL256S10GHB013 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-VFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: -

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR (SLC)

Memory Size:: 256Mbit

Memory Organization:: 32M x 8

Memory Interface:: CFI

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 56-FBGA (9x7)

S29GL256S10GHB013 FAQ

1.How can I place an order for S29GL256S10GHB013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10GHB013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10GHB013 reliable?

The price and inventory of S29GL256S10GHB013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10GHB013 is usually 5 days.

3.What payment methods are accepted for S29GL256S10GHB013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10GHB013 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10GHB013?

S29GL256S10GHB013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10GHB013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10GHB013?

For technical support, including S29GL256S10GHB013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10GHB013 requirements.

6.How does Aetrix verify that S29GL256S10GHB013 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10GHB013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10GHB013 meets industry standards.

7.What is the process for return or replacement of S29GL256S10GHB013?

All S29GL256S10GHB013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10GHB013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10GHB013 part is unused and in its original packaging.

Return procedure for S29GL256S10GHB013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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