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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S10GHIV20

Name: S29GL256S10GHIV20
Brand: Infineon Technologies
SKU: S29GL256S10GHIV20
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S10GHIV20

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-VFBGA

Datasheet:: S29GL256S10GHIV20.pdf

Description:: IC FLASH 256MBIT PARALLEL 56FBGA

Quantity:: RFQ Add To RFQ list

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Inventory:3,990

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Product details

Overview

S29GL256S10GHIV20 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware update storage in industrial control systems.

For engineers reviewing the S29GL256S10GHIV20 datasheet, S29GL256S10GHIV20 pinout, S29GL256S10GHIV20 application, or S29GL256S10GHIV20 equivalent, key selection criteria include its uniform 128 kB sector erase architecture, 512-byte write buffer, Versatile I/O (1.65–VCC), AEC-Q100 Grade 2 qualification, and support for suspend/resume during program/erase operations.

Technical Context

This device implements asynchronous parallel interface logic with word-aligned addressing (A0–A23), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages all program/erase sequences-including sector erase, buffer programming, and automatic ECC generation-without external microcontroller intervention.

The internal architecture includes dedicated voltage generators for programming (VPP) and erase (VEH), status register monitoring, ready/busy# (RY/BY#) signaling, and dual protection mechanisms: volatile Advanced Sector Protection (ASP) and non-volatile OTP lockable regions. CFI-compliant parameter tables enable host system auto-configuration.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	256 Mb (32 MB), organized as 2,097,152 × 16-bit words
Random access time	90 ns at VCC = VIO, enabling fast XIP execution from flash
Page access time	15 ns for subsequent 32-byte aligned reads within same page
Write buffer size	512 bytes (256 words), reducing effective programming time vs. byte-by-byte writes
ECC capability	On-die hardware single-bit error correction with automatic detection and correction
Endurance & retention	100,000 program/erase cycles; 20 years data retention at 85°C
Operating temperature	Industrial plus grade: –40°C to +105°C, qualified per AEC-Q100 Grade 2

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width), JEDEC MO-141AC compliant. Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address inputs	Word-aligned address bus; A23 is MSB for 256 Mb density
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports Versatile I/O (1.65 V to VCC)
CE#	Chip enable	Active-low device select; controls power-down and command latching
OE#	Output enable	Active-low read strobe; gates output drivers during read cycles
WE#	Write enable	Active-low control for write/program/erase command initiation
RY/BY#	Ready/Busy indicator	Open-drain active-low signal indicating ongoing embedded operation
RESET#	Hardware reset	Active-low asynchronous reset that halts all operations and clears status register
VCC	Core supply	2.7–3.6 V single supply for core logic, programming, and erase
VIO	I/O supply	1.65–VCC independent I/O voltage for interfacing with diverse host logic levels

Key Features

Feature	Design Value
65 nm MIRRORBIT™ Eclipse technology	Enables higher density and lower power vs. older floating-gate NOR, with improved reliability
Uniform 128 kB sectors	256 individually erasable sectors simplify firmware partitioning and field updates
Suspend/resume for program & erase	Allows temporary interruption of long erase (up to 1 s) or program operations for high-priority reads
Separate 1024-byte OTP array	Two lockable regions store immutable keys, calibration data, or secure boot configuration
Common Flash Interface (CFI)	Standardized parameter table enables automatic driver initialization without hard-coded timing constants

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing boot loader, real-time OS kernel, and GUI assets in digital dashboard systems.

IC Role / Device Role / Timing Role: Non-volatile code storage with XIP-capable random access and AEC-Q100 Grade 2 reliability.

Use Value: 90 ns read access enables deterministic boot timing; 105°C rating ensures operation under hood-adjacent thermal stress.

Use Scenario: Holding firmware images and configuration parameters in programmable logic controllers deployed in factory automation.

IC Role / Device Role / Timing Role: Field-upgradable firmware repository with sector-level erase granularity and hardware ECC.

Use Value: Uniform 128 kB sectors allow atomic firmware swaps; 100,000-cycle endurance supports decades of over-the-air updates.

Medical Imaging Boot Memory

Avionics Data Logger

Use Scenario: Hosting secure boot ROM and diagnostic firmware in MRI/X-ray control units requiring traceable data integrity.

IC Role / Device Role / Timing Role: Trusted boot source with on-die ECC and OTP-locked security keys.

Use Value: Hardware ECC prevents silent corruption of critical boot code; OTP regions ensure cryptographic keys remain immutable.

Use Scenario: Recording flight-critical sensor logs and configuration snapshots in airborne data acquisition modules.

IC Role / Device Role / Timing Role: High-reliability non-volatile storage with suspend-capable erase for real-time logging continuity.

Use Value: Suspend/resume allows uninterrupted logging during background sector erases; 20-year retention meets DO-160 environmental compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P10TFIV10	Same density and timing, but 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP option	Preferred for space-constrained PCBs where board area is critical	Select when footprint reduction outweighs TSOP's ease of rework and test probe access
N25Q256A13ESE40F	256 Mb Quad SPI interface; 133 MHz clock, no parallel bus or RY/BY# pin	Requires SPI host controller; incompatible with legacy parallel-addressed boot ROM interfaces	Choose only if migrating to serial flash architecture and redesigning boot loader interface logic

Compared with S29GL256P10TFIV10, the S29GL256S10GHIV20 offers direct TSOP compatibility and simplified layout; versus N25Q256A13ESE40F, it retains full parallel bus timing control and deterministic XIP latency essential for hard real-time boot paths.

Availability

S29GL256S10GHIV20 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, medical imaging boot memory, and avionics data loggers requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL256S10GHIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions.

The GL-S family targets mission-critical embedded systems needing deterministic boot performance, long-term data integrity, and AEC-Q100-compliant flash storage for automotive, industrial, and medical applications.

FAQ

What is the maximum operating frequency supported by S29GL256S10GHIV20?

The device does not use a clock input-it is fully asynchronous. Its performance is defined by access times: 90 ns random access and 15 ns page access. These values are guaranteed across the full industrial-plus temperature range (–40°C to +105°C) and 2.7–3.6 V supply, with no frequency specification required for interface timing.

Does S29GL256S10GHIV20 support hardware write protection?

Yes. It implements Advanced Sector Protection (ASP) with both volatile (via status register bits) and non-volatile (via permanent lock bits) methods. Additionally, the separate 1024-byte OTP array has two independently lockable regions, providing hardware-enforced immutability for security keys or calibration data.

Can S29GL256S10GHIV20 be used in place of older S29GL256N devices?

No. While both are 256 Mb parallel NOR flashes, the S29GL256S uses 65 nm MIRRORBIT™ Eclipse technology with different command sets, timing parameters, and ECC behavior. Migration requires validation of read/write/erase sequences, status register interpretation, and CFI table parsing per datasheet Rev. *U.

Is the 512-byte write buffer mandatory for programming operations?

No. The device supports both single-word programming and multi-word buffer programming. Buffer mode is optional but recommended for throughput: up to 256 words (512 bytes) can be loaded before issuing the final program command, achieving 1.5 MBps effective write speed versus ~120 kBps for single-word writes.

S29GL256S10GHIV20 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-VFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-FBGA (9x7)

S29GL256S10GHIV20 FAQ

1.How can I place an order for S29GL256S10GHIV20 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10GHIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10GHIV20 reliable?

The price and inventory of S29GL256S10GHIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10GHIV20 is usually 5 days.

3.What payment methods are accepted for S29GL256S10GHIV20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10GHIV20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10GHIV20?

S29GL256S10GHIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10GHIV20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10GHIV20?

For technical support, including S29GL256S10GHIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10GHIV20 requirements.

6.How does Aetrix verify that S29GL256S10GHIV20 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10GHIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10GHIV20 meets industry standards.

7.What is the process for return or replacement of S29GL256S10GHIV20?

All S29GL256S10GHIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10GHIV20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10GHIV20 part is unused and in its original packaging.

Return procedure for S29GL256S10GHIV20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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