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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S10TFA020

Name: S29GL256S10TFA020
Brand: Infineon Technologies
SKU: S29GL256S10TFA020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S10TFA020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL256S10TFA020.pdf

Description:: IC FLASH 256MBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

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Inventory:4,249

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Product details

Overview

S29GL256S10TFA020 from Infineon is a 256 Mb (32 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sector erase, and a 512-byte programming buffer-enabling fast embedded code storage and firmware updates in automotive instrument clusters.

For engineers reviewing the S29GL256S10TFA020 datasheet, S29GL256S10TFA020 pinout, S29GL256S10TFA020 application, or S29GL256S10TFA020 equivalent, key selection criteria include its Versatile I/O support (1.65 V to VCC), AEC-Q100 Grade 3 qualification, 100,000 program/erase cycles, and CFI-compliant interface for bootloader compatibility.

Technical Context

This device implements an asynchronous parallel flash architecture with dual-mode read capability: initial random access retrieves a full 32-byte aligned page in 90 ns, while subsequent intra-page reads complete in 15 ns via address bit toggling on A3–A0. The embedded algorithm controller (EAC) manages all program/erase operations-including suspend/resume-and enforces command-set locking to prevent accidental writes.

Hardware ECC operates transparently during read cycles, correcting single-bit errors without software intervention; status is reported via dedicated ECC status ASO register and RY/BY# pin. Sector protection uses both volatile (via status register) and non-volatile (via ASP bits) methods, with separate 1024-byte OTP array split into two lockable regions for secure boot code storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mb (32 MB); supports full firmware images for mid-tier automotive ECUs
Interface	Asynchronous ×16 parallel bus; no clock required, compatible with legacy microcontroller memory controllers
Access Time	90 ns random / 15 ns page; enables XIP execution with sub-100 ns instruction fetch latency
Programming Buffer	512 bytes; reduces effective programming time by >3× vs. single-word writes
ECC	On-the-fly single-bit correction; eliminates need for external error-handling logic in safety-critical systems
Endurance	100,000 program/erase cycles; meets AEC-Q100 Grade 3 lifetime requirements for infotainment modules
Data Retention	20 years at +85°C; validated for long-term deployment in sealed automotive environments

Pinout & Package

Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, lead-free.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address inputs	23-bit word address bus; A22 = MSB for 256 Mb (max address = 0x1FFFFF)
DQ0–DQ15	Data I/O	16-bit bidirectional bus; supports byte/word writes per JEDEC standard
CE#	Chip enable	Active-low device select; controls power state and enables multi-chip addressing
OE#	Output enable	Active-low read strobe; gates output drivers without affecting internal state
WE#	Write enable	Active-low write strobe; initiates command sequences and data latching
RY/BY#	Ready/busy indicator	Open-drain output; low during program/erase, high when operation complete or ready for next command
RESET#	Hardware reset	Active-low asynchronous reset; forces device into reading state and clears internal state machines
VCC	Core supply	3.0 V ±0.3 V; powers logic, array, and charge pumps for all operations
VIO	I/O supply	1.65 V to VCC; decouples I/O voltage from core, enabling mixed-voltage system interfacing

Key Features

Feature	Design Value
Versatile I/O (VIO)	Independent 1.65–3.6 V I/O rail allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers without level shifters
Page Mode Read	32-byte aligned page access with 15 ns intra-page timing improves sequential code fetch throughput by 4× vs. random access
Embedded Algorithm Controller	Hardware-managed program/erase with suspend/resume enables real-time task preemption during firmware updates
Advanced Sector Protection	Volatile and non-volatile lock bits per 128-kB sector prevent unauthorized reprogramming of boot or calibration sectors
CFI Compliance	Standardized parameter table enables automatic detection and configuration by U-Boot, BIOS, and flash utilities

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated gauge graphics, driver alert logic, and over-the-air update partitions in a sealed dashboard module.

IC Role / Device Role / Timing Role: Non-volatile code storage with XIP-capable read performance and AEC-Q100 Grade 3 reliability.

Use Value: 90 ns random access enables real-time rendering of analog-style speedometer sweeps without frame stutter.

Use Scenario: Holding ladder logic firmware, I/O mapping tables, and safety shutdown routines in DIN-rail mounted controllers.

IC Role / Device Role / Timing Role: Field-upgradable program memory with sector-level write protection against EMI-induced corruption.

Use Value: 128-kB uniform sectors allow independent update of motion control vs. communication firmware modules.

Medical Diagnostic Display Bootloader

Avionics Data Logger Configuration

Use Scenario: Securing primary bootloader and cryptographic keys in a Class IIa ultrasound display unit.

IC Role / Device Role / Timing Role: Trusted boot source with OTP lockable regions and hardware ECC for integrity verification.

Use Value: Dedicated 1024-byte OTP array ensures immutable root-of-trust for FDA-required audit trails.

Use Scenario: Storing flight parameter lookup tables, sensor calibration coefficients, and fault history logs in DO-160G-compliant recorders.

IC Role / Device Role / Timing Role: High-reliability configuration memory with 20-year data retention at +85°C ambient.

Use Value: 100,000 erase cycles support 10+ years of daily mission logging without wear-out risk.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P10TFI010	Same density and timing, but 64-ball LAE BGA (9 mm × 9 mm); no TSOP option	Preferred for space-constrained PCBs where board area is prioritized over manual rework accessibility	Select when footprint miniaturization outweighs through-hole prototyping needs
MX29GL256ELXGI-90G	Macronix part; 90 ns access, but lacks hardware ECC and OTP array; requires external error handling	Suitable for cost-sensitive industrial HMI where ECC is managed in software	Choose only if firmware stack includes robust SW ECC and no secure boot requirement

Compared with S29GL256P10TFI010, this TSOP variant offers easier hand-soldering and test probe access; versus MX29GL256ELXGI-90G, it delivers certified ECC and OTP security out-of-box-critical for ISO 26262 ASIL-B systems.

Availability

S29GL256S10TFA020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, and medical diagnostic display bootloaders requiring stable component supply across extended product lifecycles.

Supply support for S29GL256S10TFA020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and trusted security solutions, with global manufacturing and quality certification to IATF 16949 and ISO 9001.

The GL-S family targets high-reliability embedded systems needing deterministic flash performance-designed specifically for automotive cockpit electronics, industrial control firmware, and safety-critical boot storage where data integrity and long-term endurance are mandatory.

FAQ

Does S29GL256S10TFA020 support execute-in-place (XIP) operation?

Yes, it supports true XIP operation due to its 90 ns random access time and asynchronous interface. Code stored in its memory can be fetched and executed directly by a compatible microcontroller without copying to RAM, reducing boot latency and SRAM usage in resource-constrained automotive ECUs.

What is the function of the VIO pin, and can it be tied to VCC?

VIO sets the I/O voltage level independently from VCC, supporting 1.65 V to VCC. It may be tied to VCC for 3.0 V I/O operation, but must be decoupled separately. Using lower VIO (e.g., 1.8 V) enables direct interfacing with low-voltage controllers without external level shifters-verified in Infineon's application note AN220777.

How is sector protection configured, and is it persistent after power loss?

Sector protection is configured via status register bits (volatile) or non-volatile ASP bits programmed using unlock-bypass commands. Non-volatile protection persists across power cycles and reset events, ensuring boot sectors remain locked even after unexpected power-down-critical for preventing field corruption in deployed systems.

Can the 512-byte programming buffer be used for partial-page writes?

No-the buffer requires full 512-byte alignment and must be filled contiguously before issuing the buffer-program command. Partial writes trigger automatic padding or abort; successful programming requires exactly 512 bytes written to consecutive addresses within the same page boundary, as defined in Section 5.2 of the datasheet.

S29GL256S10TFA020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL256S10TFA020 FAQ

1.How can I place an order for S29GL256S10TFA020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10TFA020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10TFA020 reliable?

The price and inventory of S29GL256S10TFA020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10TFA020 is usually 5 days.

3.What payment methods are accepted for S29GL256S10TFA020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10TFA020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10TFA020?

S29GL256S10TFA020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10TFA020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10TFA020?

For technical support, including S29GL256S10TFA020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10TFA020 requirements.

6.How does Aetrix verify that S29GL256S10TFA020 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10TFA020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10TFA020 meets industry standards.

7.What is the process for return or replacement of S29GL256S10TFA020?

All S29GL256S10TFA020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10TFA020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10TFA020 part is unused and in its original packaging.

Return procedure for S29GL256S10TFA020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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