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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S10TFA023

Name: S29GL256S10TFA023
Brand: Infineon Technologies
SKU: S29GL256S10TFA023
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S10TFA023

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL256S10TFA023.pdf

Description:: IC FLASH 256MBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL256S10TFA023 from Infineon is a 256 Mb (32 MB), 16-bit parallel, 3.0 V core MIRRORBIT™ Eclipse flash memory with 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across –40°C to +105°C (Industrial Plus grade), supports 128-kbyte uniform sector erase, and features a 512-byte programming buffer for accelerated write throughput in embedded boot code storage.

For engineers reviewing the S29GL256S10TFA023 datasheet, S29GL256S10TFA023 pinout, S29GL256S10TFA023 application, or S29GL256S10TFA023 equivalent, key selection criteria include its Versatile I/O (1.65 V–V_CC), asynchronous page-mode read capability, OTP array with dual lockable regions, AEC-Q100 Grade 2 qualification, and support for suspend/resume during program/erase operations.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), requiring no clock signal. Its embedded algorithm controller (EAC) handles all program/erase sequences autonomously, including automatic ECC generation and verification on every write/erase cycle.

The architecture uses 65-nm MIRRORBIT™ Eclipse technology with a 32-byte page-aligned read path and 128-kbyte uniform sector organization. Status monitoring is supported via status register, data polling, and RY/BY# pin - enabling deterministic host-side operation control without timing dependency on internal flash latency.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mb (32 MB); supports full firmware image storage for mid-complexity microcontrollers.
Random Access Time	90 ns at V_CC = V_IO; enables direct XIP execution from flash with minimal CPU stall cycles.
Page Access Time	15 ns; allows rapid sequential reads within same 32-byte aligned page for instruction fetch bursts.
Programming Buffer	512 bytes; reduces effective programming time by batching up to 256 words per command, minimizing bus arbitration overhead.
ECC Support	On-die hardware single-bit error correction; eliminates need for external ECC logic or software overhead in safety-critical systems.
Endurance & Retention	100,000 program/erase cycles and 20-year data retention; validated for long-lifecycle industrial and automotive deployments.
Operating Temperature	–40°C to +105°C (Industrial Plus grade); qualified per AEC-Q100 Grade 2 for under-hood automotive ECUs.

Pinout & Package

Package: 56-pin TSOP (Type I, standard thin small outline package) with 0.5 mm pitch, JEDEC MO-141AC compliant. Pin layout optimized for high-speed parallel bus routing with dedicated CE#, OE#, WE#, and RY/BY# control signals.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address Inputs	24-bit word-aligned address bus; A23 is MSB for 256 Mb density (32 MB × 16-bit).
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports both read and write transfers on same pins.
CE#	Chip Enable	Active-low chip select; controls device power state and enables internal logic only when asserted.
OE#	Output Enable	Active-low read strobe; gates output drivers without affecting internal state or timing.
WE#	Write Enable	Active-low write strobe; initiates internal program/erase commands when combined with address/data setup.
RY/BY#	Ready/Busy Output	Open-drain status indicator; low = device busy, high = ready for next command or read.
V_CC	Core Supply	3.0 V ±0.3 V supply for core logic and memory array; supports single-supply operation.
V_IO	I/O Supply	1.65 V to V_CC; enables interoperability with 1.8 V, 2.5 V, or 3.3 V host interfaces without level shifters.

Key Features

Feature	Design Value
Versatile I/O voltage range	V_IO from 1.65 V to V_CC allows direct connection to mixed-voltage SoCs without external level translation.
512-byte programming buffer	Enables burst programming of up to 256 words per command, reducing host-side command overhead by >70% vs. single-word writes.
Hardware ECC engine	Single-bit error correction performed entirely in hardware during read/write, eliminating software ECC latency and memory footprint.
OTP array with dual lockable regions	1024-byte one-time-programmable space segmented into two independently lockable sectors for secure key or calibration storage.
Suspend/resume for program & erase	Allows host to pause long-running erase (up to 1 s) or program (up to 1.2 ms) operations to service higher-priority interrupts.

Applications

Automotive Engine Control Unit (ECU)

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated engine maps, diagnostic routines, and bootloader code in an AEC-Q100 Grade 2 ECU operating at 105°C under hood.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤90 ns latency and guaranteed 20-year data retention.

Use Value: Eliminates need for external ECC IC or redundant flash mirroring while meeting ASIL-B functional safety requirements via hardware ECC and sector protection.

Use Scenario: Holding firmware, configuration tables, and real-time OS kernel for programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: High-reliability parallel flash acting as primary code storage with suspend/resume support for deterministic interrupt response during field updates.

Use Value: Enables safe in-field firmware upgrades without system downtime using sector-level erase and OTP-secured update keys.

Medical Imaging System Boot ROM

Avionics Data Logger Memory

Use Scenario: Hosting boot firmware and FPGA configuration bitstreams in portable ultrasound devices requiring extended temperature stability and radiation-tolerant non-volatility.

IC Role / Device Role / Timing Role: Trusted boot source with hardware ECC and 128-kbyte uniform sectors enabling fast, verified firmware recovery after power loss.

Use Value: Meets IEC 62304 Class C software safety requirements through deterministic erase/program timing and built-in integrity checking.

Use Scenario: Recording flight-critical telemetry and event logs in airborne data acquisition units where write endurance and data retention are mission-critical.

IC Role / Device Role / Timing Role: High-endurance flash memory supporting cyclic logging with 100,000 erase cycles and 20-year retention at elevated ambient temperatures.

Use Value: Reduces maintenance intervals and certification burden by eliminating wear-leveling firmware complexity via uniform sector architecture.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P10TFI010	Same density and pinout, but Industrial grade (–40°C to +85°C) and no AEC-Q100 qualification.	Lacks automotive temperature and reliability validation; unsuitable for under-hood deployment.	Select when cost sensitivity outweighs extended temperature or automotive compliance needs.
MX29GL256FHT2I-90G	Macronix 256 Mb parallel NOR with 90 ns access, but no integrated ECC and only 10,000 erase cycles.	Requires external ECC implementation and has lower endurance; not recommended for safety-critical logging.	Consider only for legacy designs where ECC is handled in software and lifetime requirements are <5 years.

Compared with S29GL256P10TFI010 and MX29GL256FHT2I-90G, the S29GL256S10TFA023 uniquely delivers AEC-Q100 Grade 2 qualification, on-die ECC, and 10× higher endurance - making it the only option suitable for automotive safety-critical boot storage without external redundancy.

Availability

S29GL256S10TFA023 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware updates, and medical imaging system boot ROMs requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL256S10TFA023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certifications including ISO/TS 16949 and AEC-Q200.

The GL-S family was designed specifically for automotive and industrial applications demanding robust parallel NOR flash with XIP capability, hardware ECC, and extended temperature operation - bridging the performance gap between traditional NOR and NAND-based boot solutions.

FAQ

Is S29GL256S10TFA023 pin-compatible with earlier S29GL256N or S29GL256P variants?

No. While functionally similar, S29GL256S uses a revised command set and enhanced status reporting logic. The TSOP pinout matches S29GL256P, but differences in RY/BY# behavior and OTP lock sequencing require firmware validation before drop-in replacement.

Does this device support synchronous read mode or require external clocking?

No. S29GL256S10TFA023 is strictly asynchronous - all read, program, and erase operations are controlled solely by CE#, OE#, and WE# timing without any clock input. Page-mode reads rely on address transitions, not clock edges.

Can the 1024-byte OTP array be reprogrammed after initial lock?

No. Once either OTP region is locked via the dedicated lock-bit command sequence, that region becomes permanently read-only. Unlocking is not supported; design must allocate and program OTP contents prior to final lock activation.

What is the maximum sustained write bandwidth using the 512-byte programming buffer?

At optimal conditions (V_CC = 3.3 V, T_A = 25°C), the device achieves up to 1.5 MBps effective programming rate for full-buffer writes, translating to ~340 µs per 512-byte buffer load - confirmed in Section 2 of the datasheet's Performance Summary table.

S29GL256S10TFA023 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL256S10TFA023 FAQ

1.How can I place an order for S29GL256S10TFA023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10TFA023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10TFA023 reliable?

The price and inventory of S29GL256S10TFA023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10TFA023 is usually 5 days.

3.What payment methods are accepted for S29GL256S10TFA023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10TFA023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10TFA023?

S29GL256S10TFA023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10TFA023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10TFA023?

For technical support, including S29GL256S10TFA023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10TFA023 requirements.

6.How does Aetrix verify that S29GL256S10TFA023 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10TFA023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10TFA023 meets industry standards.

7.What is the process for return or replacement of S29GL256S10TFA023?

All S29GL256S10TFA023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10TFA023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10TFA023 part is unused and in its original packaging.

Return procedure for S29GL256S10TFA023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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