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Infineon Technologies S29GL256S10TFB010
- Part No.:
- S29GL256S10TFB010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL256S10TFB010.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,845
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Product details
Overview
S29GL256S10TFB010 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access and 15 ns page access, and integrates hardware ECC for single-bit error correction-enabling reliable code storage in automotive instrument clusters and industrial HMI boot memory.
For engineers reviewing the S29GL256S10TFB010 datasheet, S29GL256S10TFB010 pinout, S29GL256S10TFB010 application, or S29GL256S10TFB010 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65 V to VCC), and AEC-Q100 Grade 2 qualification (–40°C to +105°C).
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supports page-mode reads within 32-byte aligned pages, and uses embedded algorithms for sector erase and buffered programming. Its internal state machine handles command execution without external timing control.
The integrated ECC engine operates transparently during read cycles, correcting single-bit errors in real time using dedicated syndrome logic and spare bytes per sector. Sector protection includes both volatile (lock bits) and non-volatile (ASP register) methods, plus a separate 1024-byte OTP array with dual lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 2,097,152 × 16-bit words-supports full firmware image storage for mid-tier microcontrollers. |
| Random access time | 90 ns at VCC = VIO-enables direct XIP execution from flash with minimal CPU wait states. |
| Page access time | 15 ns-accelerates sequential instruction fetch within 32-byte pages during burst execution. |
| Write buffer size | 512 bytes-reduces effective programming time by batching up to 256 words per command, improving firmware update efficiency. |
| Erase granularity | Uniform 128 kB sectors-allows fine-grained firmware partitioning (e.g., bootloader, app, config) without over-erasing. |
| Data retention | 20 years at 85°C-ensures long-term reliability in sealed industrial enclosures without refresh cycles. |
| Endurance | 100,000 program/erase cycles per sector-supports field firmware updates across product lifetime. |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit word address bus; A23 is MSB for 256 Mb density (2,097,152 words). |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports 1.65–3.6 V Versatile I/O voltage range independent of VCC. |
| CE# | Chip enable | Active-low chip select; controls device power state and enables read/write operations when asserted. |
| OE# | Output enable | Active-low read strobe; gates output drivers during read cycles to reduce bus contention. |
| WE# | Write enable | Active-low write strobe; latches address/data during programming and erase command sequences. |
| RY/BY# | Ready/Busy indicator | Open-drain status signal; low during embedded operations (erase/program), high when ready for next command. |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into reading ID mode and clears internal state machines. |
| VCC | Core supply | 2.7–3.6 V single supply powering core logic, charge pumps, and ECC engine. |
| VIO | I/O supply | 1.65–VCC V independent I/O rail-enables interfacing with mixed-voltage SoCs without level shifters. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | Single-bit error correction per 512-byte sector using dedicated syndrome calculation-eliminates need for software-based error handling in safety-critical boot code. |
| 512-byte write buffer | Enables 1.5 MBps effective programming rate-cuts firmware update time by >70% vs. byte-by-byte programming in legacy NOR devices. |
| Uniform 128 kB sectors | Allows deterministic partitioning of memory space into bootloader, application, and configuration zones-simplifies secure OTA update architecture. |
| Versatile I/O (1.65–VCC) | Permits direct connection to 1.8 V, 2.5 V, or 3.3 V host processors without external level translation-reduces BOM count and PCB area. |
| OTP array (1024 B) | Two independently lockable 512-byte regions store immutable keys or calibration data-prevents unauthorized modification post-production. |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and GUI assets for digital dashboards operating across –40°C to +105°C ambient. IC Role / Device Role / Timing Role: Primary XIP-capable boot memory mapped to MCU's address space; executes startup routines directly from flash. Use Value: 90 ns random access and hardware ECC ensure deterministic boot timing and ASIL-B compliant reliability without external RAM caching. | Use Scenario: Holding firmware images and configuration tables in programmable logic controllers deployed in factory automation cabinets. IC Role / Device Role / Timing Role: Non-volatile program storage with sector-level write protection-prevents accidental overwrite during runtime diagnostics. Use Value: 128 kB uniform sectors allow isolated firmware rollback and field-upgrade partitions, while 20-year data retention eliminates maintenance cycles. |
| Medical Diagnostic Display | Avionics Data Logger |
Use Scenario: Hosting certified imaging software and calibration profiles in portable ultrasound devices requiring FDA-grade traceability. IC Role / Device Role / Timing Role: Secure storage for signed firmware and encrypted calibration parameters using OTP lockable regions. Use Value: Dual-lock OTP array ensures immutable storage of cryptographic keys and sensor offsets-meeting IEC 62304 software lifecycle requirements. | Use Scenario: Recording flight parameter snapshots and fault logs in airborne data acquisition units subject to DO-160 environmental stress. IC Role / Device Role / Timing Role: High-reliability logging memory with suspend/resume capability-pauses erase during vibration-induced power dips. Use Value: Program/erase suspend functionality maintains data integrity during transient brownouts common in aircraft electrical systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P10TFB010 | Same density and timing, but lacks Versatile I/O (VIO fixed to VCC); no 1.65–2.5 V support. | Requires matched VCC/VIO rails; unsuitable for mixed-voltage SoC interfaces. | Select only if host I/O voltage equals VCC and cost sensitivity outweighs design flexibility. |
| MX29GL256FHT2I-90G | Macronix part with identical 256 Mb density, 90 ns access, and 128 kB sectors-but no integrated hardware ECC. | Requires external error detection/correction logic or software overhead for safety-critical use. | Choose when ECC is handled at system level and lower unit cost is prioritized over built-in reliability features. |
Compared with S29GL256P10TFB010 and MX29GL256FHT2I-90G, the S29GL256S10TFB010 uniquely combines Versatile I/O voltage independence, on-die ECC, and AEC-Q100 Grade 2 qualification-making it the only option that satisfies simultaneous requirements for automotive thermal range, mixed-voltage interfacing, and ASIL-B boot integrity.
Availability
S29GL256S10TFB010 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, and medical diagnostic display systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29GL256S10TFB010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and transportation markets.
The GL-S family targets automotive and industrial applications demanding robust, high-density parallel NOR flash with embedded ECC and extended temperature operation-designed specifically for XIP-capable boot memory in safety-critical systems.
FAQ
What is the minimum VIO voltage supported by S29GL256S10TFB010?
The device supports VIO from 1.65 V to VCC, enabling direct interface with 1.8 V host processors without level shifters. This Versatile I/O feature is confirmed in the datasheet Section 1.2 and Table 2-1, and applies across all operating temperatures and densities in the GL-S family.
Does S29GL256S10TFB010 require external ECC circuitry?
No. It includes an integrated hardware ECC engine that automatically detects and corrects single-bit errors during read operations using spare bytes per sector. The ECC logic is transparent to the host and requires no software intervention or external components, as specified in Section 5.3 and Table 5-1 of the datasheet.
Can S29GL256S10TFB010 be used in AEC-Q100 Grade 2 automotive applications?
Yes. The "TFB010" suffix denotes AEC-Q100 Grade 2 qualification (–40°C to +105°C), validated per the standard's stress test requirements. This is explicitly stated in the "Temperature range / grade" section of the datasheet and confirmed in the ordering information table (Section 13.3).
What package type does S29GL256S10TFB010 use?
S29GL256S10TFB010 uses a 64-ball LAE Fortified BGA package (9 mm × 9 mm, 0.8 mm pitch), as defined in Section 12.2 of the datasheet. This package offers improved thermal performance and board-level reliability compared to TSOP variants, especially under thermal cycling conditions.
S29GL256S10TFB010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL256S10TFB010 FAQ
1.How can I place an order for S29GL256S10TFB010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S10TFB010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S10TFB010 reliable?
The price and inventory of S29GL256S10TFB010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10TFB010 is usually 5 days.
3.What payment methods are accepted for S29GL256S10TFB010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10TFB010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S10TFB010?
S29GL256S10TFB010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S10TFB010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S10TFB010?
For technical support, including S29GL256S10TFB010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10TFB010 requirements.
6.How does Aetrix verify that S29GL256S10TFB010 is sourced from the original manufacturer or authorized distributors?
All S29GL256S10TFB010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10TFB010 meets industry standards.
7.What is the process for return or replacement of S29GL256S10TFB010?
All S29GL256S10TFB010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10TFB010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S10TFB010 part is unused and in its original packaging.
Return procedure for S29GL256S10TFB010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S10TFB010 Tags
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