Infineon Technologies S29GL256S10TFB013

Overview

S29GL256S10TFB013 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access and 15 ns page access, and integrates hardware ECC for single-bit error correction - deployed in automotive instrument clusters requiring fast XIP boot code execution and robust firmware storage.

For engineers reviewing the S29GL256S10TFB013 datasheet, S29GL256S10TFB013 pinout, S29GL256S10TFB013 application, or S29GL256S10TFB013 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and OTP array for secure configuration storage.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.

The internal architecture includes dedicated erase voltage and programming voltage generators, a 1024-byte one-time-programmable (OTP) array with dual lockable regions, and Advanced Sector Protection (ASP) enabling per-sector volatile/non-volatile locking - critical for firmware integrity in safety-critical automotive ECUs.

Key Specifications

Pinout & Package

Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Compared with S29GL256P10TFB013 and MX29GL256FHT2I-90G, the S29GL256S10TFB013 uniquely combines AEC-Q100 Grade 2 operation, hardware ECC, and OTP - making it the only option qualified for ASIL-B boot memory where data integrity and secure configuration are mandatory.

Availability

S29GL256S10TFB013 is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS domain controllers, industrial PLCs, and medical imaging systems requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL256S10TFB013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and transportation markets.

The GL-S family targets automotive and industrial applications demanding high-density, fast-access, and AEC-Q100-qualified parallel NOR flash - optimized for XIP boot code execution and firmware storage under harsh thermal and electrical conditions.

FAQ

What is the maximum operating temperature range for S29GL256S10TFB013?

The S29GL256S10TFB013 is rated for Industrial Plus (–40°C to +105°C) and Automotive AEC-Q100 Grade 2 (–40°C to +105°C) operation. This dual qualification confirms full functionality and guaranteed parametric performance across the entire +105°C junction temperature range, validated per AEC-Q100 stress test protocols including HTOL and TC.

Does this device support true 1.8 V I/O interfacing?

Yes - the Versatile I/O (VIO) feature allows independent 1.65–3.6 V operation on DQ pins. When VIO = 1.8 V, the device fully complies with 1.8 V logic thresholds (VIH = 0.7×VIO, VIL = 0.3×VIO), enabling direct connection to 1.8 V microcontrollers without level shifters, while maintaining full 2.7–3.6 V VCC operation.

How does the hardware ECC function during read operations?

Hardware ECC operates transparently during every read access: the internal circuitry checks all 512-bit data words (32 bytes) fetched from the array, corrects single-bit errors in real time, and reports uncorrectable multi-bit errors via the status register's ECC fail bit (SR[6]). No software intervention or additional latency is required for correction.

Can the OTP array be reprogrammed after initial programming?

No - the 1024-byte OTP array is permanently programmable. Once a bit is set to '0', it cannot be changed back to '1'. The two lockable regions (Region 0 and Region 1) can be individually locked via dedicated commands; once locked, further writes to that region are disabled permanently, ensuring irreversible storage of calibration data or cryptographic keys.