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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S10TFB020

Name: S29GL256S10TFB020
Brand: Infineon Technologies
SKU: S29GL256S10TFB020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S10TFB020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL256S10TFB020.pdf

Description:: IC FLASH 256MBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

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Inventory:2,483

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Product details

Overview

S29GL256S10TFB020 from Infineon is a 256 Mb (32 MB), 16-bit parallel NOR flash memory using 65 nm MIRRORBIT™ Eclipse technology, with 90 ns random access time, 15 ns page access time, and single 3.0 V supply (2.7–3.6 V) for read/program/erase - deployed in industrial embedded systems for firmware storage and boot code execution.

For engineers reviewing the S29GL256S10TFB020 datasheet, S29GL256S10TFB020 pinout, S29GL256S10TFB020 application, or S29GL256S10TFB020 equivalent, key selection factors include its 512-byte write buffer, hardware ECC (single-bit correction), uniform 128 kB sector erase, Versatile I/O (1.65–VCC), and AEC-Q100 Grade 2 qualification support.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), 16-bit DQ bus, and dedicated control signals (CE#, OE#, WE#, RY/BY#). Its embedded algorithm controller (EAC) manages all program/erase operations autonomously, including suspend/resume and status reporting via status register, data polling, or RY/BY# pin.

The internal architecture features a 32-byte page-aligned read path, enabling 15 ns subsequent accesses within the same page, and integrates hardware ECC logic that corrects single-bit errors on-the-fly during read operations without software intervention.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mb (32 MB); supports full firmware image storage for mid-complexity microcontrollers.
Random Access Time	90 ns at VCC = VIO; enables fast XIP execution in real-time embedded applications.
Page Access Time	15 ns; allows rapid sequential reads within 32-byte aligned pages for efficient code fetch.
Write Buffer Size	512 bytes; reduces effective programming time by batching up to 256 words per command.
ECC Support	Hardware single-bit error correction; ensures data integrity without host CPU overhead.
Endurance	100,000 program/erase cycles per sector; suitable for field-updatable firmware with moderate update frequency.
Data Retention	20 years at +85°C; guarantees long-term reliability in industrial temperature environments.

Pinout & Package

Package: 56-ball VBU Fortified BGA (9 mm × 7 mm), RoHS-compliant, lead-free, moisture sensitivity level 3.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address Inputs	24-bit word-aligned address bus; A23 is MSB for 256 Mb density (2²⁴ × 16 bits).
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports both read and write transfers in word mode.
CE#	Chip Enable	Active-low device select; controls power state and enables internal logic only when asserted.
OE#	Output Enable	Active-low read strobe; gates output drivers without affecting internal state or timing.
WE#	Write Enable	Active-low write strobe; latches address/data and initiates embedded program/erase commands.
RY/BY#	Ready/Busy Output	Open-drain status indicator; low = operation in progress, high = ready for next command.
VCC	Core Supply	3.0 V core voltage (2.7–3.6 V); powers logic, array, and EAC - no separate VPP required.
VIO	I/O Supply	Versatile I/O range (1.65–VCC); enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers.

Key Features

Feature	Design Value
Asynchronous Page Read	32-byte aligned page access with 15 ns subsequent reads - accelerates linear code execution without cache.
512-Byte Programming Buffer	Enables single-command programming of up to 256 words - cuts total firmware update time vs. byte-by-byte writes.
Hardware ECC	On-die single-bit error correction with no latency penalty or host driver dependency.
Uniform Sector Architecture	2048 × 128 kB sectors - simplifies partitioning for bootloader, app, and parameter storage with deterministic erase boundaries.
Advanced Sector Protection	Volatile/non-volatile lock bits per sector - prevents accidental overwrite during field updates or debug sessions.

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated gauge graphics, CAN message tables, and boot firmware in AEC-Q100 Grade 2 qualified modules operating at –40°C to +105°C.

IC Role / Device Role / Timing Role: Non-volatile boot memory with XIP capability and hardware ECC - ensures deterministic startup and runtime data integrity.

Use Value: Eliminates external error-checking logic and supports over-the-air updates with verified sector-level erase/program cycles.

Use Scenario: Holding ladder logic firmware, I/O configuration maps, and safety-critical parameters in DIN-rail mounted controllers with 20-year field life requirement.

IC Role / Device Role / Timing Role: Primary firmware storage with 128 kB uniform sectors - enables atomic firmware swaps and rollback-safe updates.

Use Value: 100,000 erase cycles and 20-year retention meet IEC 61131-3 lifecycle expectations for unattended industrial deployment.

Medical Diagnostic Display Boot

Telecom Base Station Configuration

Use Scenario: Hosting UEFI-compatible boot loader and display initialization code in FDA-regulated imaging equipment requiring traceable firmware integrity.

IC Role / Device Role / Timing Role: Secure silicon region (OTP) + hardware ECC - protects boot vector and validates firmware signature on power-up.

Use Value: OTP lockable regions prevent tampering; ECC ensures pixel rendering accuracy even after years of thermal cycling.

Use Scenario: Storing FPGA bitstreams, radio calibration profiles, and protocol stacks in carrier-grade baseband units with hot-swap maintenance windows.

IC Role / Device Role / Timing Role: Dual-plane sector protection - isolates active/inactive firmware images to enable zero-downtime field upgrades.

Use Value: Suspend/resume during erase allows background reconfiguration without interrupting RF transmission.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P10TFB020	Same density and timing, but uses older 90 nm process; lacks Versatile I/O (VIO fixed at VCC).	No support for mixed-voltage host interfaces; requires external level-shifting for 1.8 V controllers.	Select only if legacy design reuse or cost sensitivity outweighs I/O flexibility and power efficiency.
MX29GL256FHT2I-90G	Macronix part with identical 256 Mb density, 90 ns access, and 512-byte buffer; no integrated ECC.	Requires external ECC implementation or software correction - increases host CPU load and validation effort.	Choose when strict BOM cost targets apply and ECC can be managed externally without compromising functional safety.

Compared with S29GL256P10TFB020 and MX29GL256FHT2I-90G, the S29GL256S10TFB020 delivers superior system-level robustness through hardware ECC, wider I/O voltage tolerance, and newer 65 nm process benefits - reducing board complexity and qualifying faster for automotive and industrial safety standards.

Availability

S29GL256S10TFB020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, medical diagnostic display boot, and telecom base station configuration requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL256S10TFB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, sensing, connectivity, and security solutions for automotive, industrial, and IoT markets.

The GL-S family targets high-reliability embedded systems needing deterministic boot performance, field-updatable firmware, and AEC-Q100 compliance - combining XIP speed with data storage density and built-in data integrity features.

FAQ

Does S29GL256S10TFB020 support execute-in-place (XIP) operation?

Yes, it supports true XIP operation with 90 ns random access and 15 ns page-mode reads, enabling direct code execution from flash without loading into RAM. The 32-byte page alignment and asynchronous interface allow deterministic instruction fetch timing critical for real-time control loops.

What is the function of the RY/BY# pin?

RY/BY# is an open-drain ready/busy status output: low indicates an embedded program or erase operation is in progress; high means the device is idle and ready for the next command. It provides hardware handshaking independent of status register polling.

Can VIO be operated at 1.8 V while VCC is at 3.0 V?

Yes, the Versatile I/O feature explicitly supports VIO from 1.65 V to VCC, so 1.8 V I/O operation with 3.0 V core is fully compliant and validated per datasheet Section 8.3 - eliminating need for external level shifters when interfacing with 1.8 V microcontrollers.

Is the 1024-byte OTP array field-programmable?

Yes, the OTP array is one-time programmable in two lockable 512-byte regions. Once locked (via dedicated CFI commands), contents become permanently read-only. It is commonly used for secure keys, calibration data, or unique device identifiers in production programming.

S29GL256S10TFB020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL256S10TFB020 FAQ

1.How can I place an order for S29GL256S10TFB020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10TFB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10TFB020 reliable?

The price and inventory of S29GL256S10TFB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10TFB020 is usually 5 days.

3.What payment methods are accepted for S29GL256S10TFB020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10TFB020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10TFB020?

S29GL256S10TFB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10TFB020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10TFB020?

For technical support, including S29GL256S10TFB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10TFB020 requirements.

6.How does Aetrix verify that S29GL256S10TFB020 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10TFB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10TFB020 meets industry standards.

7.What is the process for return or replacement of S29GL256S10TFB020?

All S29GL256S10TFB020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10TFB020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10TFB020 part is unused and in its original packaging.

Return procedure for S29GL256S10TFB020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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