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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S10TFB023

Name: S29GL256S10TFB023
Brand: Infineon Technologies
SKU: S29GL256S10TFB023
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S10TFB023

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL256S10TFB023.pdf

Description:: IC FLASH 256MBIT PARALLEL 56TSOP

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Product details

Overview

S29GL256S10TFB023 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access and 15 ns page access, and integrates hardware ECC for single-bit error correction-enabling reliable code storage in automotive instrument clusters requiring AEC-Q100 Grade 2 (–40°C to +105°C) operation.

For engineers reviewing the S29GL256S10TFB023 datasheet, S29GL256S10TFB023 pinout, S29GL256S10TFB023 application, or S29GL256S10TFB023 equivalent, key selection criteria include its 512-byte programming buffer throughput (1.5 MBps), uniform 128 kB sector erase architecture, Versatile I/O support (1.65 V to VCC), OTP array with dual lockable regions, and CFI-compliant interface for bootloader compatibility.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations-including suspend/resume-and enforces automatic ECC during read cycles.

The flash array is organized into uniform 128 kB sectors, each independently erasable. Sector protection uses volatile and non-volatile methods via ASP registers, while the 1024-byte OTP array supports secure boot configuration with two separately lockable regions.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mb (32 MB), mapped as 2²³ × 16-bit words-supports full firmware image storage for mid-tier microcontrollers.
Random Access Time	90 ns at VCC = VIO-enables direct XIP execution from flash without external cache in real-time control loops.
Page Access Time	15 ns-accelerates sequential instruction fetch within 32-byte aligned pages during burst execution.
Programming Buffer	512 bytes-reduces effective programming time by 4× vs. single-word writes, critical for field firmware updates.
ECC Support	Internal hardware single-bit error correction-eliminates need for external ECC logic in safety-critical automotive modules.
Endurance & Retention	100,000 program/erase cycles and 20-year data retention-meets long-life requirements for industrial gateways and telematics units.
Operating Temperature	AEC-Q100 Grade 2 (–40°C to +105°C)-qualified for under-hood automotive applications including ADAS sensor fusion ECUs.

Pinout & Package

Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). RoHS-compliant, lead-free, moisture sensitivity level 3 (MSL3).

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address Inputs	24-bit address bus; A23 is MSB for 256 Mb density-defines 16-Mword address space with word alignment only.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports 1.65–3.6 V I/O voltage (VIO) independent of core VCC-simplifies interfacing with mixed-voltage SoCs.
CE#	Chip Enable	Active-low chip select; tCE = 90 ns-controls device activation timing for multi-flash memory systems.
OE#	Output Enable	Active-low output control; tOE = 25 ns-governs data bus release timing during read termination.
WE#	Write Enable	Active-low write strobe; initiates command latching and embedded program/erase sequences.
RY/BY#	Ready/Busy Output	Open-drain status indicator; low during active program/erase-enables polling-free interrupt-driven firmware flow control.
WP#	Write Protect	Hardware sector protection enable; asserts when pulled low to prevent accidental erase of protected sectors.
RESET#	Hardware Reset	Asynchronous reset input; forces device into standby mode and clears internal state-required for power-cycle recovery in automotive systems.

Key Features

Feature	Design Value
Versatile I/O Interface	VIO range 1.65 V to VCC allows seamless integration with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters.
512-Byte Programming Buffer	Enables 1.5 MBps effective write speed-cuts firmware update time by >75% versus byte-wise programming in OTA deployments.
Uniform 128 kB Sector Architecture	Eliminates complex block management; enables deterministic erase timing (477 kBps) for predictable update windows in safety-critical firmware.
Hardware ECC Engine	Single-bit correction per 512-byte sector without CPU intervention-reduces MCU overhead and improves system-level FIT rate.
Secure OTP Array	1024-byte one-time-programmable region with two lockable segments-stores immutable root keys and boot configuration for secure boot chains.

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated gauge graphics, driver alert logic, and over-the-air (OTA) update images in digital dashboards.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability and AEC-Q100 Grade 2 qualification.

Use Value: 90 ns random access enables real-time rendering of dynamic UI elements; hardware ECC ensures display integrity over 15+ year vehicle lifetime.

Use Scenario: Holding ladder logic firmware, I/O mapping tables, and safety-certified runtime code in programmable logic controllers.

IC Role / Device Role / Timing Role: Boot ROM and field-upgradable application memory with deterministic 128 kB sector erase timing.

Use Value: Uniform sector size simplifies firmware partitioning; 20-year data retention meets industrial equipment lifecycle requirements.

Telematics Control Unit (TCU)

Medical Diagnostic Imaging Bootloader

Use Scenario: Hosting cellular modem firmware, GNSS stack, and encrypted vehicle-to-cloud communication binaries.

IC Role / Device Role / Timing Role: Secure, high-reliability flash for dual-bank OTA updates with rollback protection.

Use Value: 512-byte buffer enables sub-second firmware patching; OTP region stores cryptographic keys for signature verification.

Use Scenario: Storing certified bootloader, FPGA configuration bitstreams, and regulatory-mandated self-test routines.

IC Role / Device Role / Timing Role: Trusted boot source with hardware-enforced write protection and ECC-verified execution.

Use Value: Internal ECC eliminates soft-error-induced boot failures; sector protection prevents unauthorized modification of FDA-cleared code.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P10TFB020	Same density and package, but lacks Versatile I/O (VIO fixed to VCC); no 1.65 V–VCC flexibility.	Not suitable for mixed-voltage SoC interfaces; limited to 3.3 V-only host designs.	Select only if host I/O voltage matches VCC exactly and cost is primary constraint.
MX29GL256FHT2I-90G	256 Mb parallel NOR, 90 ns access, but no integrated ECC engine; requires external error handling.	Increases firmware complexity for safety-critical use; not AEC-Q100 qualified.	Consider only for cost-sensitive consumer applications where ECC is managed in software.

Compared with S29GL256P10TFB020 and MX29GL256FHT2I-90G, the S29GL256S10TFB023 uniquely combines AEC-Q100 Grade 2 qualification, hardware ECC, and Versatile I/O-making it the only choice for automotive and industrial systems requiring guaranteed data integrity across voltage and temperature extremes.

Availability

S29GL256S10TFB023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, telematics control units, and medical diagnostic bootloaders requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL256S10TFB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

The GL-S family targets high-reliability embedded systems requiring fast XIP-capable flash with automotive-grade qualification, robust data integrity, and flexible I/O voltage support-designed specifically for next-generation ECU and edge-node firmware storage.

FAQ

What is the maximum operating frequency supported by S29GL256S10TFB023?

The device does not operate on a clock signal-it is an asynchronous parallel NOR flash. Its performance is defined by access times: 90 ns random access and 15 ns page access at 3.0 V. System timing depends on host bus controller setup/hold requirements, not a clock frequency.

Does S29GL256S10TFB023 support quad SPI or other serial interfaces?

No. This part is strictly a parallel-interface NOR flash with a 16-bit DQ bus and dedicated control signals (CE#, OE#, WE#). It does not implement SPI, QSPI, or any serial protocol-only common flash interface (CFI) commands over the parallel bus.

How is the 1024-byte OTP array structured and accessed?

The OTP array occupies a dedicated 1024-byte address space outside the main flash array. It contains two independently lockable 512-byte regions. Access requires issuing specific CFI commands via the standard command set; once locked, regions cannot be reprogrammed or unlocked.

Can S29GL256S10TFB023 be used in a 1.8 V I/O system?

Yes. Its Versatile I/O feature supports VIO from 1.65 V to VCC. With VCC = 3.3 V, VIO can be set to 1.8 V, enabling direct connection to 1.8 V logic without level shifters-provided all timing parameters (e.g., tOE = 35 ns) are met at that VIO level.

S29GL256S10TFB023 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL256S10TFB023 FAQ

1.How can I place an order for S29GL256S10TFB023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10TFB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10TFB023 reliable?

The price and inventory of S29GL256S10TFB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10TFB023 is usually 5 days.

3.What payment methods are accepted for S29GL256S10TFB023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10TFB023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10TFB023?

S29GL256S10TFB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10TFB023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10TFB023?

For technical support, including S29GL256S10TFB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10TFB023 requirements.

6.How does Aetrix verify that S29GL256S10TFB023 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10TFB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10TFB023 meets industry standards.

7.What is the process for return or replacement of S29GL256S10TFB023?

All S29GL256S10TFB023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10TFB023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10TFB023 part is unused and in its original packaging.

Return procedure for S29GL256S10TFB023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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