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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S10TFI010

Name: S29GL256S10TFI010
Brand: Infineon Technologies
SKU: S29GL256S10TFI010
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S10TFI010

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL256S10TFI010.pdf

Description:: IC FLASH 256MBIT PARALLEL 56TSOP

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Product details

Overview

S29GL256S10TFI010 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware update storage for industrial microcontroller-based systems.

For engineers reviewing the S29GL256S10TFI010 datasheet, S29GL256S10TFI010 pinout, S29GL256S10TFI010 application, or S29GL256S10TFI010 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65 V to VCC), and AEC-Q100 Grade 3 qualification for automotive control modules.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) handles all program/erase operations-including suspend/resume-and manages status via RY/BY#, data polling, and status register.

The internal architecture includes a dedicated ECC engine that automatically corrects single-bit errors during read and detects multi-bit errors, plus an OTP array (1024 bytes, two lockable regions) for secure configuration storage. Sector protection uses volatile and non-volatile methods per 128 kB sector.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	256 Mb (32 MB), organized as 2,097,152 × 16-bit words
Random access time	90 ns at VCC = VIO - determines minimum instruction fetch latency in XIP applications
Page access time	15 ns - enables fast sequential reads within 32-byte aligned pages
Write buffer size	512 bytes - allows single-command programming of up to 256 words, improving firmware update speed
Erase cycle endurance	100,000 cycles per sector - supports field firmware updates over product lifetime
Data retention	20 years at +85°C - ensures long-term reliability in unpowered industrial deployments
Operating temperature	–40°C to +85°C (Industrial grade) - validated for use in motor drives and PLCs without derating

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 400 mil width, JEDEC MO-141AC compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address inputs	24-bit address bus; A23 is MSB for 256 Mb density (2²⁴ × 16 = 32 MB)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes per command sequence
CE#	Chip enable	Active-low enable for device selection; tCE = 90 ns max defines chip select setup timing
OE#	Output enable	Active-low control for data output gating; tOE = 25 ns max governs read data hold
WE#	Write enable	Active-low strobe for write operations; initiates command latching and embedded algorithms
RY/BY#	Ready/Busy indicator	Open-drain output signaling active program/erase; used for hardware flow control
VCC	Core supply	2.7–3.6 V single supply powering core logic, charge pumps, and ECC engine
VIO	I/O supply	1.65–VCC range; decouples I/O voltage from core, enabling mixed-voltage system interfacing

Key Features

Feature	Design Value
Hardware ECC engine	Single-bit error correction + multi-bit error detection per read cycle, eliminating need for external error-handling logic
512-byte write buffer	Reduces effective programming time by >70% vs. single-word writes-critical for OTA firmware patches
Uniform 128 kB sectors	Enables deterministic erase scheduling and wear leveling across full memory map
Suspend/resume capability	Allows interrupting erase or program to service high-priority reads, preserving real-time system responsiveness
Advanced sector protection (ASP)	Per-sector lock/unlock via volatile (power-on reset) and non-volatile (permanent) modes-secures bootloader and calibration data

Applications

Industrial Motor Control

Automotive ADAS ECU

Use Scenario: Storing motor profile tables and safety-critical firmware in servo drive controllers operating at –40°C to +85°C.

IC Role / Device Role / Timing Role: Boot ROM and firmware update storage with XIP-capable random access and 90 ns latency.

Use Value: Hardware ECC ensures integrity of motion control code; 128 kB uniform sectors simplify field update partitioning.

Use Scenario: Holding sensor fusion algorithms and calibration data in radar processing units qualified to AEC-Q100 Grade 3.

IC Role / Device Role / Timing Role: Non-volatile storage for boot image and runtime configuration with power-loss-safe erase suspend.

Use Value: Versatile I/O (1.65–3.6 V) interfaces directly to 1.8 V FPGA logic; OTP region stores cryptographic keys.

Medical Imaging Console

Energy Meter Firmware

Use Scenario: Retaining DICOM protocol stacks and UI assets in portable ultrasound devices requiring 20-year data retention.

IC Role / Device Role / Timing Role: High-reliability firmware repository with automatic ECC correction during cold-start initialization.

Use Value: 100,000 erase cycles support frequent regulatory software revisions; page-mode reads accelerate GUI asset loading.

Use Scenario: Storing tariff tables and communication stack binaries in ANSI C12.22-compliant smart meters deployed in outdoor enclosures.

IC Role / Device Role / Timing Role: Secure, long-life storage for revenue-critical parameters with sector-level write protection.

Use Value: ASP prevents accidental overwrite of billing logic; standby current <100 µA extends battery backup life.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P10TFI010	Same density and package, but lacks Versatile I/O (VIO fixed to VCC); no 1.65 V compatibility	Not suitable for mixed-voltage SoC interfaces requiring independent I/O rail scaling	Select only when system uses single 3.3 V rail for both core and I/O
MX29GL256FHI-90G	Micron part with identical 256 Mb density, 90 ns access, and 512-byte buffer-but no integrated ECC engine	Requires external error management logic or software ECC, increasing BOM and validation effort	Choose only if ECC is handled externally and cost sensitivity outweighs reliability assurance

Compared with S29GL256P10TFI010, this part adds Versatile I/O flexibility; versus MX29GL256FHI-90G, it delivers built-in ECC-reducing system-level error handling complexity and qualifying for higher functional safety integrity levels.

Availability

S29GL256S10TFI010 is available at Aetrix Electronics and suitable for industrial motor control, automotive ADAS ECUs, medical imaging consoles, and smart energy metering requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL256S10TFI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and non-volatile memory solutions for industrial and automotive applications.

The GL-S family targets high-reliability embedded systems needing fast XIP-capable flash with robust data integrity-designed specifically for boot code, firmware, and configuration storage where ECC, sector protection, and AEC-Q100 compliance are mandatory.

FAQ

What is the maximum operating frequency supported for read operations?

S29GL256S10TFI010 does not use a clock signal-it is an asynchronous parallel device. Read timing is governed by access times: 90 ns random access and 15 ns page access. System bus timing must meet tCE (90 ns), tOE (25 ns), and tDF (data float) specifications per the datasheet's AC characteristics table.

Does this device support execute-in-place (XIP) operation?

Yes. The S29GL256S10TFI010 supports true XIP operation due to its fast random access (90 ns) and page-mode capability. Code can be fetched directly from flash without copying to RAM, reducing boot time and SRAM usage in resource-constrained microcontrollers.

How is the 1024-byte OTP array structured and accessed?

The OTP array consists of two independently lockable 512-byte regions. Access requires issuing the CFI query command followed by specific unlock-bypass and OTP program commands. Once locked (via non-volatile bit), a region becomes permanently read-only and immune to accidental erase or reprogram.

Can the device operate with VIO = 1.8 V while VCC = 3.3 V?

Yes. The Versatile I/O feature explicitly supports VIO from 1.65 V to VCC. With VCC = 3.3 V, VIO may be set to 1.8 V, allowing direct interface to 1.8 V FPGAs or ASICs without level shifters-verified in the datasheet's "Versatile I/O" section and DC characteristics table.

S29GL256S10TFI010 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tube

Product Status:: Active

Programmable:: Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL256S10TFI010 FAQ

1.How can I place an order for S29GL256S10TFI010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10TFI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10TFI010 reliable?

The price and inventory of S29GL256S10TFI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10TFI010 is usually 5 days.

3.What payment methods are accepted for S29GL256S10TFI010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10TFI010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10TFI010?

S29GL256S10TFI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10TFI010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10TFI010?

For technical support, including S29GL256S10TFI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10TFI010 requirements.

6.How does Aetrix verify that S29GL256S10TFI010 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10TFI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10TFI010 meets industry standards.

7.What is the process for return or replacement of S29GL256S10TFI010?

All S29GL256S10TFI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10TFI010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10TFI010 part is unused and in its original packaging.

Return procedure for S29GL256S10TFI010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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