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Infineon Technologies S29GL256S10TFI020
- Part No.:
- S29GL256S10TFI020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL256S10TFI020.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,621
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Product details
Overview
S29GL256S10TFI020 from Infineon is a 256 Mb (32 MB), 16-bit parallel NOR flash memory using 65 nm MIRRORBIT™ Eclipse technology, operating from a single 2.7–3.6 V supply with 90 ns random access time and 15 ns page access time. It integrates hardware ECC for single-bit error correction, 128 kB uniform sector erase, and a 512-byte write buffer-enabling fast in-system programming for boot code storage in industrial microcontroller-based systems.
For engineers reviewing the S29GL256S10TFI020 datasheet, S29GL256S10TFI020 pinout, S29GL256S10TFI020 application, or S29GL256S10TFI020 equivalent, key selection criteria include its asynchronous ×16 interface, Versatile I/O (1.65–VCC), industrial temperature grade (–40°C to +85°C), TSOP-56 packaging, and CFI-compliant command set for legacy BIOS and FPGA configuration use cases.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) handles all program/erase operations-including suspend/resume-and manages status via RY/BY#, data polling, and status register.
Hardware ECC operates transparently during read cycles, correcting single-bit errors without software intervention. Sector protection uses volatile (lock bits) and non-volatile (ASP) methods, while the separate 1024-byte OTP array supports secure boot key storage with dual lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 2,097,152 × 16-bit words |
| Access time (random) | 90 ns at VCC = VIO = 3.0 V - determines minimum CPU wait-state insertion |
| Page access time | 15 ns - enables burst reads within 32-byte aligned pages for faster firmware execution |
| Write buffer size | 512 bytes - allows single-command programming of up to 256 words, reducing host overhead |
| Erase block size | 128 kB uniform sectors - simplifies partitioning for bootloader + application + parameter storage |
| Data retention | 20 years - validated under industrial temperature cycling, critical for unattended equipment |
| Endurance | 100,000 program/erase cycles per sector - supports field firmware updates over product lifetime |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP-I, Type I), 14 mm × 20 mm body, 0.5 mm pitch, JEDEC MO-141AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit word address bus; A23 is MSB for 256 Mb density (2,097,152 words) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes via WE# and BYTE# control |
| CE# | Chip enable | Active-low device select; controls power state and enables internal timing for access |
| OE# | Output enable | Active-low read strobe; gates output drivers without affecting internal state |
| WE# | Write enable | Active-low write strobe; initiates command latching or data loading during programming |
| RY/BY# | Ready/Busy indicator | Open-drain active-low signal indicating ongoing embedded operation (program/erase) |
| VCC | Core supply | 2.7–3.6 V single supply powering core logic, charge pumps, and ECC engine |
| VIO | I/O supply | 1.65–VCC independent I/O voltage - enables interfacing with 1.8 V or 3.3 V controllers |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | Single-bit error correction on every read - eliminates need for external error-handling logic in safety-critical boot paths |
| Versatile I/O (VIO) | Independent 1.65–VCC I/O rail - permits direct connection to mixed-voltage SoCs without level shifters |
| 512-byte write buffer | Reduces effective programming time by >60% vs. single-word writes - accelerates field firmware patching |
| CFI-compliant interface | Standardized JEDEC JESD68 query table - ensures compatibility with generic flash programmers and UEFI firmware stacks |
| OTP array with dual locks | 1024-byte one-time-programmable region split into two independently lockable blocks - secures cryptographic keys and calibration data |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
|
Use Scenario: Storing boot loader and real-time OS image in programmable logic controllers requiring zero downtime during firmware upgrades. IC Role / Device Role / Timing Role: Primary non-volatile XIP-capable code storage with deterministic 90 ns read latency for hard real-time task initialization. Use Value: Uniform 128 kB sectors allow atomic firmware swap; hardware ECC prevents silent corruption in electrically noisy factory environments. |
Use Scenario: Holding calibrated display firmware and safety-critical gauge logic in automotive digital instrument clusters meeting AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Boot memory mapped directly to MCU address space; supports page-mode reads for rapid GUI asset loading during startup. Use Value: 20-year data retention and –40°C to +105°C operation ensure reliability across vehicle lifetime and thermal extremes. |
| FPGA Configuration Flash | Medical Imaging System Parameter Storage |
|
Use Scenario: Storing bitstream and runtime configuration for Xilinx/Intel FPGAs in diagnostic imaging subsystems. IC Role / Device Role / Timing Role: Parallel interface provides high-throughput configuration loading; CFI support enables automated bitstream validation pre-configuration. Use Value: 512-byte write buffer reduces reconfiguration time by enabling full page writes - critical for rapid system recovery after power loss. |
Use Scenario: Retaining calibration coefficients, sensor offsets, and regulatory audit logs in FDA-cleared ultrasound and MRI control units. IC Role / Device Role / Timing Role: Secure non-volatile parameter archive with OTP-locked calibration keys and ASP-protected service records. Use Value: Dual-lock OTP and sector-level ASP prevent unauthorized modification of clinical accuracy parameters during maintenance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P10TFI020 | Same density and timing, but lacks hardware ECC and OTP array; uses older 90 nm process | Lower cost where ECC and secure key storage are not required | Select only if system-level error detection and secure boot are handled externally |
| MX29GL256FHT2I-90G | 256 Mb, 90 ns, TSOP-56, but no Versatile I/O (VIO fixed at VCC); no integrated ECC | Compatible for basic boot storage in 3.3 V-only designs without ECC needs | Choose when interfacing exclusively with 3.3 V controllers and ECC is implemented in firmware |
Compared with S29GL256P10TFI020 and MX29GL256FHT2I-90G, the S29GL256S10TFI020 uniquely delivers hardware ECC, OTP security, and flexible VIO-making it the only choice for safety-certified or mixed-voltage embedded boot systems requiring guaranteed data integrity.
Availability
S29GL256S10TFI020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and FPGA configuration requiring stable component supply across extended product lifecycles.
Supply support for S29GL256S10TFI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q200.
The GL-S family targets high-reliability embedded systems needing deterministic boot performance, long-term data retention, and hardware-assisted security-designed specifically for industrial automation, automotive ECUs, and medical devices.
FAQ
Does S29GL256S10TFI020 support byte-level writes?
No. This device operates exclusively on 16-bit word boundaries due to its ×16 data bus architecture. All write operations-whether single-word or buffered-require even-addressed 16-bit data transfers. Byte writes are not supported, and attempting them results in undefined behavior or bus contention.
What is the function of the STB pin on this device?
The STB (Strobe) pin is not present on the S29GL256S10TFI020 in TSOP-56 packaging. It appears only on certain FBGA variants (e.g., LAE/LAA packages) as a secondary chip enable for multi-die configurations. The TSOP-56 version uses CE#, OE#, and WE# exclusively for control signaling.
Can the OTP array be reprogrammed after locking?
No. Once either of the two OTP lock bits is set (via specific CFI command sequence), that 512-byte region becomes permanently read-only. Locking is irreversible and requires VPP = 12 V in some programming modes-though the S29GL256S10TFI020 implements internal charge pumps to avoid external high-voltage supplies.
Is the RY/BY# pin compatible with standard open-drain interrupt interfaces?
Yes. RY/BY# is an open-drain output with internal pull-up disabled by default. It requires an external 4.7 kΩ pull-up resistor to VIO and asserts low during program/erase operations. It can directly drive standard GPIO interrupt inputs on ARM Cortex-M or Power Architecture MCUs without additional buffering.
S29GL256S10TFI020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL256S10TFI020 FAQ
1.How can I place an order for S29GL256S10TFI020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S10TFI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S10TFI020 reliable?
The price and inventory of S29GL256S10TFI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10TFI020 is usually 5 days.
3.What payment methods are accepted for S29GL256S10TFI020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10TFI020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S10TFI020?
S29GL256S10TFI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S10TFI020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S10TFI020?
For technical support, including S29GL256S10TFI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10TFI020 requirements.
6.How does Aetrix verify that S29GL256S10TFI020 is sourced from the original manufacturer or authorized distributors?
All S29GL256S10TFI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10TFI020 meets industry standards.
7.What is the process for return or replacement of S29GL256S10TFI020?
All S29GL256S10TFI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10TFI020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S10TFI020 part is unused and in its original packaging.
Return procedure for S29GL256S10TFI020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S10TFI020 Tags
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M24C02-WMN6TP
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