Infineon Technologies S29GL256S10TFIV10
- Part No.:
- S29GL256S10TFIV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL256S10TFIV10.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:954
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Product details
Overview
S29GL256S10TFIV10 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-enabling reliable code storage in automotive instrument clusters and industrial HMI boot memory.
For engineers reviewing the S29GL256S10TFIV10 datasheet, S29GL256S10TFIV10 pinout, S29GL256S10TFIV10 application, or S29GL256S10TFIV10 equivalent, this device supports asynchronous XIP-capable read, 512-byte buffer programming, uniform 128 kB sector erase, and AEC-Q100 Grade 3 qualification for automotive embedded systems requiring deterministic timing and long-term data retention.
Technical Context
The S29GL256S10TFIV10 implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.
It features dual-voltage I/O (VIO = 1.65 V to VCC), enabling interoperability with mixed-voltage host systems. Internal hardware ECC corrects single-bit errors on-the-fly during read, while the 1024-byte OTP array provides secure storage for calibration data or security keys-both protected by advanced sector protection (ASP) with volatile/non-volatile lock options.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 2,097,152 × 16-bit words-supports full firmware image storage for mid-tier microcontrollers. |
| Random access time | 90 ns at VCC = VIO-enables real-time XIP execution without wait states in Cortex-M7-based applications. |
| Page access time | 15 ns-accelerates sequential instruction fetch within 32-byte aligned pages, reducing effective read latency. |
| Programming buffer | 512 bytes-allows single-command write of up to 256 words, cutting typical firmware update time by >4× vs. byte-wise programming. |
| Erase block size | Uniform 128 kB sectors-simplifies partitioning for bootloader, application, and parameter storage with deterministic erase timing. |
| Data retention | 20 years at +85°C-meets automotive ECU lifetime requirements without refresh cycles. |
| Endurance | 100,000 program/erase cycles per sector-supports field-upgradable firmware in telematics gateways. |
| Operating temperature | –40°C to +85°C (Industrial grade), AEC-Q100 Grade 3 qualified-validated for under-hood and dashboard control units. |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AC footprint with gull-wing leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit word-aligned address bus; A23 is MSB for 256 Mb density (2,097,152 words). |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports high-speed page reads and buffer programming. |
| CE# | Chip enable | Active-low chip select; enables device for read/write; tCE = 90 ns max determines minimum cycle time. |
| OE# | Output enable | Active-low output control; decouples data bus during standby; tOE = 25 ns supports fast read turnaround. |
| WE# | Write enable | Active-low write strobe; initiates command latching and embedded program/erase sequences. |
| RY/BY# | Ready/Busy indicator | Open-drain output; low during internal operations-enables hardware polling without software overhead. |
| VCC | Core supply | 2.7–3.6 V single supply powers core logic, charge pumps, and ECC engine-no auxiliary voltage required. |
| VIO | I/O supply | 1.65–3.6 V independent I/O rail-permits interfacing with 1.8 V or 3.3 V controllers without level shifters. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | On-the-fly single-bit error correction with automatic detection-eliminates need for external error-handling firmware in safety-critical boot memory. |
| 512-byte write buffer | Reduces average programming time to ≤1.5 MBps-enables sub-second firmware updates in OTA-capable ECUs. |
| Uniform 128 kB sectors | Enables predictable erase scheduling and wear leveling across 256 sectors-simplifies FOTA partition management. |
| OTP array (1024 B) | Two lockable regions store immutable calibration data or cryptographic keys-prevents accidental overwrites during field updates. |
| ASP sector protection | Volatile (power-cycle reset) and non-volatile (permanent) lock modes per sector-supports secure bootloader lockdown in production. |
Applications
| Automotive Instrument Cluster | Industrial HMI Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and GUI assets for digital dashboards with real-time rendering requirements. IC Role / Device Role / Timing Role: Primary XIP-capable code storage device; supplies instructions directly to ARM Cortex-R5F CPU via parallel bus. Use Value: 90 ns random access and 15 ns page mode enable zero-wait-state execution, meeting <50 µs display initialization deadlines. |
Use Scenario: Hosting bootloader and configuration parameters in panel-mounted HMIs operating in factory environments. IC Role / Device Role / Timing Role: Non-volatile firmware repository with sector-level protection for field-upgradable application images. Use Value: 100,000 erase cycles and 20-year data retention ensure 15+ year service life without degradation in unattended operation. |
| Telematics Control Unit (TCU) | Medical Diagnostic Equipment |
Use Scenario: Secure storage of cellular modem firmware, CAN gateway logic, and OTA update staging area. IC Role / Device Role / Timing Role: Dual-role memory: boot code execution + parameter logging buffer with ECC-protected writes. Use Value: Hardware ECC and 128 kB uniform sectors allow safe concurrent read (XIP) and background erase/program operations. |
Use Scenario: Holding certified application binaries and calibration tables in FDA-cleared imaging devices requiring traceable firmware history. IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified boot memory with OTP-secured calibration constants. Use Value: Industrial temperature range (–40°C to +85°C) and 20-year retention meet IEC 62304 Class C software lifecycle mandates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P10TFIV10 | Same density and pinout, but uses older 90 nm process; 110 ns random access, no hardware ECC. | Lacks on-die ECC and has slower timing-requires external error handling and limits use in safety-critical boot paths. | Select only for cost-sensitive legacy designs where ECC is managed in software and timing margins permit. |
| MX29GL256FHT2I-90G | 256 Mb parallel NOR, 90 ns access, but no integrated ECC, no OTP array, and no ASP support. | Requires external ECC logic and lacks secure key storage-unsuitable for automotive or medical firmware integrity requirements. | Consider only for non-safety applications with simple firmware storage needs and tight BOM cost targets. |
Compared with S29GL256P10TFIV10 and MX29GL256FHT2I-90G, the S29GL256S10TFIV10 uniquely combines hardware ECC, OTP security, and AEC-Q100 Grade 3 qualification-making it the only option among the three that satisfies ISO 26262 ASIL-B boot memory requirements without external components.
Availability
S29GL256S10TFIV10 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMI boot memory, telematics control units, and medical diagnostic equipment requiring stable component supply across extended product lifecycles.
Supply support for S29GL256S10TFIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and automotive markets.
The GL-S family was designed specifically for embedded systems demanding XIP performance, long-term data integrity, and automotive-grade qualification-targeting boot code storage in ECUs, gateways, and safety-critical displays.
FAQ
What is the maximum operating frequency supported by the S29GL256S10TFIV10?
The S29GL256S10TFIV10 is an asynchronous parallel NOR flash and does not operate on a clock signal. Its performance is defined by access times: 90 ns random access and 15 ns page access. System timing depends on host controller setup/hold requirements and bus loading, not a fixed clock frequency. No maximum clock rate is specified because it uses address/data strobes (CE#, OE#, WE#) rather than synchronous clocking.
Does the S29GL256S10TFIV10 support burst read or sequential addressing?
No, the S29GL256S10TFIV10 does not support burst read or auto-increment addressing. It supports only asynchronous random and page-mode reads. In page mode, successive reads within the same 32-byte aligned page require only low-order address bits (A0–A3) to change, achieving 15 ns access-but each read remains individually strobed via CE# and OE#.
Can the OTP region be reprogrammed after locking?
No. Once a region of the 1024-byte OTP array is permanently locked using the appropriate unlock-bypass-lock command sequence, it cannot be reprogrammed or unlocked. The lock is irreversible and enforced by on-die fuses. Volatile locking (cleared on power cycle) is available for temporary protection during development, but permanent locking is one-time only.
Is the S29GL256S10TFIV10 compatible with 1.8 V I/O interfaces?
Yes. The versatile I/O feature allows VIO to operate from 1.65 V to VCC. When VCC = 3.3 V, VIO can be set to 1.8 V, enabling direct connection to 1.8 V host processors without level shifters. Signal thresholds and timing parameters (e.g., tOE = 35 ns in VersatileIO mode) are guaranteed across the full VIO range per datasheet Section 11.4.
S29GL256S10TFIV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL256S10TFIV10 FAQ
1.How can I place an order for S29GL256S10TFIV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S10TFIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S10TFIV10 reliable?
The price and inventory of S29GL256S10TFIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10TFIV10 is usually 5 days.
3.What payment methods are accepted for S29GL256S10TFIV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10TFIV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S10TFIV10?
S29GL256S10TFIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S10TFIV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S10TFIV10?
For technical support, including S29GL256S10TFIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10TFIV10 requirements.
6.How does Aetrix verify that S29GL256S10TFIV10 is sourced from the original manufacturer or authorized distributors?
All S29GL256S10TFIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10TFIV10 meets industry standards.
7.What is the process for return or replacement of S29GL256S10TFIV10?
All S29GL256S10TFIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10TFIV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S10TFIV10 part is unused and in its original packaging.
Return procedure for S29GL256S10TFIV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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