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Infineon Technologies S29GL256S10TFIV13
- Part No.:
- S29GL256S10TFIV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL256S10TFIV13.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,209
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Product details
Overview
S29GL256S10TFIV13 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware update storage for industrial microcontroller-based systems.
For engineers reviewing the S29GL256S10TFIV13 datasheet, S29GL256S10TFIV13 pinout, S29GL256S10TFIV13 application, or S29GL256S10TFIV13 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer, Versatile I/O (1.65 V to VCC), CFI compliance, and AEC-Q100 Grade 3 qualification for automotive control modules.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.
The flash array is organized into uniform 128 kB sectors, each individually erasable, and includes a dedicated 1024-byte OTP array with two lockable regions. Internal hardware ECC corrects single-bit errors on-the-fly during read operations without software intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (32 MB); supports full firmware image storage for mid-tier MCUs |
| Interface | Parallel ×16 asynchronous; enables XIP execution without external SRAM buffering |
| Random Access Time | 90 ns at VCC = VIO; meets real-time boot latency requirements in industrial PLCs |
| Page Access Time | 15 ns; accelerates sequential instruction fetch within 32-byte aligned pages |
| Write Buffer Size | 512 bytes; reduces effective programming time by batching up to 256 words per command |
| ECC Support | Internal hardware single-bit correction; eliminates need for external ECC logic or software overhead |
| Endurance | 100,000 program/erase cycles; suitable for field-updatable firmware with moderate revision frequency |
| Data Retention | 20 years at +85°C; ensures long-term reliability in unattended embedded deployments |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm body, standard JEDEC MO-141B footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit word address bus; A23 is MSB for 256 Mb density (2²⁴ × 16 bits) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes per CE#/WE# strobe |
| CE# | Chip enable | Active-low device select; controls power state and enables internal timing for access |
| OE# | Output enable | Active-low read gate; isolates DQ bus during inactive cycles to prevent contention |
| WE# | Write enable | Active-low write strobe; latches address/data on rising edge for program/erase commands |
| RY/BY# | Ready/Busy output | Open-drain status indicator; low during embedded operations, high when ready |
| VCC | Core supply | 2.7–3.6 V single supply for core logic, programming, and erase voltage generation |
| VIO | I/O supply | 1.65–VCC versatile I/O range; allows interfacing with 1.8 V, 2.5 V, or 3.3 V controllers |
| WP# | Hardware write protect | Active-low pin; locks sector protection registers and prevents accidental program/erase |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into standby and clears internal state |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse technology | Enables higher density and lower active current vs. legacy floating-gate NOR (60 mA read @ 5 MHz) |
| Uniform 128 kB sector architecture | Allows precise firmware partitioning-e.g., separate boot loader, app, and config sectors |
| Automatic ECC with single-bit correction | Corrects bit flips in real time during read; avoids system-level CRC retries or reboot on soft errors |
| Suspend/resume for program & erase | Permits interrupt-driven background updates-e.g., pause erase to service CAN interrupt, then resume |
| Common Flash Interface (CFI) | Enables runtime detection of geometry, timing, and command set-critical for bootloader portability |
Applications
| Automotive Engine Control Unit (ECU) | Industrial Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Storing calibrated engine maps and diagnostic firmware in AEC-Q100 Grade 3 qualified hardware. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤90 ns latency. Use Value: Meets ASIL-B functional safety requirements via hardware ECC and 20-year data retention at +85°C. | Use Scenario: Holding ladder logic runtime images and configuration parameters in DIN-rail mounted controllers. IC Role / Device Role / Timing Role: Firmware storage with sector-level protection to prevent corruption during brown-out events. Use Value: ASP (Advanced Sector Protection) enables volatile/non-volatile locking of critical boot sectors independent of power cycle. |
| Medical Imaging Front-End Module | Telecom Base Station Management Controller |
Use Scenario: Hosting FPGA configuration bitstreams and calibration coefficients in Class II medical devices. IC Role / Device Role / Timing Role: High-reliability code storage with 100,000 erase cycles supporting periodic regulatory updates. Use Value: 512-byte write buffer cuts firmware update time by >4× vs. single-word programming, reducing downtime. | Use Scenario: Storing platform management firmware (e.g., IPMI, CPLD images) in carrier-grade baseband units. IC Role / Device Role / Timing Role: Parallel NOR with CFI support enabling generic bootloader compatibility across hardware revisions. Use Value: Versatile I/O (1.65–3.6 V) simplifies interface to mixed-voltage management SoCs without level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P10TFIV10 | Same density and package, but uses older 90 nm process; 110 ns random access, no hardware ECC | Lacks built-in ECC and has slower timing; requires external error handling in safety-critical designs | Select only if cost sensitivity outweighs ECC requirement and timing margin is acceptable |
| MX29GL256FHT2I-90G | Micron 256 Mb parallel NOR; 90 ns access, 512-byte buffer, but no integrated ECC or ASP | Relies on software ECC and external sector locking; less robust for automotive/industrial field updates | Prefer where existing Micron toolchain integration exists and ECC is handled at firmware layer |
Compared with S29GL256P10TFIV10 and MX29GL256FHT2I-90G, the S29GL256S10TFIV13 provides superior reliability through on-die ECC and stronger data integrity features-making it optimal for safety-aware or long-lifecycle embedded systems where firmware corruption risk must be minimized at silicon level.
Availability
S29GL256S10TFIV13 is available at Aetrix Electronics and suitable for automotive ECU firmware storage, industrial PLC boot code hosting, and medical device configuration retention requiring stable component supply across multi-year production programs.
Supply support for S29GL256S10TFIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in flash memory for mission-critical embedded systems.
The GL-S family targets high-reliability embedded applications demanding fast XIP performance, robust data integrity, and extended temperature operation-especially in automotive, industrial automation, and medical electronics.
FAQ
Is S29GL256S10TFIV13 pin-compatible with earlier S29GL256P variants?
No. While both are 56-pin TSOP packages, S29GL256S10TFIV13 introduces new signal timing and enhanced command set features-including hardware ECC and updated status register mapping-that require firmware and timing adjustments. Direct replacement without validation is not recommended.
Does this device support execute-in-place (XIP) operation?
Yes. The S29GL256S10TFIV13 supports true XIP operation due to its fast 90 ns random access time and asynchronous parallel interface. It delivers instruction fetches directly to the CPU without requiring shadowing into RAM, reducing system memory footprint and boot latency.
What is the function of the Versatile I/O (VIO) supply pin?
VIO sets the voltage level for all input buffers and output drivers independently of VCC. It accepts 1.65 V to VCC, enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without external level shifters-reducing BOM count and PCB complexity in mixed-voltage systems.
How does the 512-byte write buffer improve programming efficiency?
The 512-byte buffer allows up to 256 words to be loaded before initiating a program operation, reducing per-word overhead. This achieves 1.5 MBps effective programming rate-up to 4× faster than single-word programming-cutting firmware update time significantly in field-deployed systems.
S29GL256S10TFIV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL256S10TFIV13 FAQ
1.How can I place an order for S29GL256S10TFIV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S10TFIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S10TFIV13 reliable?
The price and inventory of S29GL256S10TFIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10TFIV13 is usually 5 days.
3.What payment methods are accepted for S29GL256S10TFIV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10TFIV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S10TFIV13?
S29GL256S10TFIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S10TFIV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S10TFIV13?
For technical support, including S29GL256S10TFIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10TFIV13 requirements.
6.How does Aetrix verify that S29GL256S10TFIV13 is sourced from the original manufacturer or authorized distributors?
All S29GL256S10TFIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10TFIV13 meets industry standards.
7.What is the process for return or replacement of S29GL256S10TFIV13?
All S29GL256S10TFIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10TFIV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S10TFIV13 part is unused and in its original packaging.
Return procedure for S29GL256S10TFIV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S10TFIV13 Tags
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STMicroelectronics
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Microchip Technology
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STMicroelectronics
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