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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S10TFIV20

Name: S29GL256S10TFIV20
Brand: Infineon Technologies
SKU: S29GL256S10TFIV20
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S10TFIV20

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL256S10TFIV20.pdf

Description:: IC FLASH 256MBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

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Inventory:1,243

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Product details

Overview

S29GL256S10TFIV20 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware update storage for industrial controllers.

For engineers reviewing the S29GL256S10TFIV20 datasheet, S29GL256S10TFIV20 pinout, S29GL256S10TFIV20 application, or S29GL256S10TFIV20 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer, Versatile I/O (1.65 V to VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and TSOP-56 package compatibility.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.

The flash array is organized into uniform 128 kB sectors, each individually erasable. Internal hardware ECC performs real-time single-bit correction during read, while the 1024-byte OTP array supports secure configuration storage with dual lockable regions.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	256 Mb (32 MB), enabling full firmware image storage for mid-tier microcontrollers
Random access time	90 ns at VCC = VIO, meeting XIP timing requirements for ARM Cortex-M7 boot execution
Page access time	15 ns, allowing rapid sequential reads within 32-byte aligned pages
Write buffer size	512 bytes, reducing effective programming time by batching up to 256 words per operation
ECC support	On-die single-bit error correction, eliminating need for external ECC logic in safety-critical systems
Operating temperature	–40°C to +105°C (AEC-Q100 Grade 2), qualified for under-hood automotive ECUs
Endurance & retention	100,000 program/erase cycles and 20-year data retention at 85°C

Pinout & Package

Package: 56-pin Thin Small Outline Package (TSOP-I, Type 1), 14 mm × 20 mm body, 0.5 mm pitch, JEDEC MO-141AC compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address inputs	24-bit address bus supporting full 32 MB address space (word-aligned; A0 ignored)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports 1.65 V to VCC I/O voltage range (Versatile I/O)
CE#	Chip enable	Active-low chip select; controls device power state and enables internal logic
OE#	Output enable	Active-low control for data output drivers; used during read operations
WE#	Write enable	Active-low control for write and erase command latching
RY/BY#	Ready/Busy indicator	Open-drain output signaling active embedded operation (low = busy)
RESET#	Hardware reset	Active-low input forcing device into reset state; clears status register and aborts operations
WP#	Write protect	Hardware sector protection enable; disables program/erase when asserted

Key Features

Feature	Design Value
Uniform 128 kB sectors	Enables deterministic firmware partitioning and over-the-air (OTA) update rollback without partial-sector constraints
Suspend/resume capability	Allows interruption of long erase cycles to service high-priority read requests-critical for real-time OS environments
Common Flash Interface (CFI)	Provides standardized JEDEC-compliant parameter table for automatic driver detection and configuration in bootloader code
Advanced sector protection (ASP)	Supports both volatile (power-on default) and non-volatile (permanent) locking per sector, preventing accidental firmware corruption
Secure OTP array	1024-byte one-time-programmable region with two independently lockable blocks for keys, calibration data, or MAC addresses

Applications

Automotive Engine Control Unit (ECU)

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated engine maps and diagnostic software in an AEC-Q100 Grade 2 ECU operating at 105°C ambient.

IC Role / Device Role / Timing Role: Boot ROM and field-upgradable firmware storage with XIP-capable random access and ECC-protected integrity.

Use Value: 90 ns random access enables direct CPU instruction fetch; 100,000-cycle endurance supports lifetime reprogramming; AEC-Q100 Grade 2 ensures reliability under thermal stress.

Use Scenario: Holding ladder logic runtime images and configuration parameters in a DIN-rail mounted programmable logic controller.

IC Role / Device Role / Timing Role: Non-volatile firmware repository accessed asynchronously by ARM-based controller during cold/warm boot sequences.

Use Value: 128 kB uniform sectors simplify OTA update partitioning; ASP prevents unauthorized modification of safety-critical logic; CFI simplifies driver porting across PLC generations.

Medical Imaging System Boot Loader

Avionics Data Recorder

Use Scenario: Hosting secure boot loader and FPGA configuration bitstreams in Class II medical imaging equipment requiring traceable firmware revision control.

IC Role / Device Role / Timing Role: Trusted boot source with hardware-enforced write protection and OTP-stored cryptographic keys.

Use Value: Dual-lock OTP regions isolate root-of-trust keys from field-updatable firmware; ECC ensures bitstream integrity during power transitions; 20-year retention meets regulatory archival requirements.

Use Scenario: Capturing flight-critical telemetry snapshots in DO-160G-certified avionics recorders exposed to wide temperature swings and vibration.

IC Role / Device Role / Timing Role: High-reliability data logger memory with suspend-capable erase for deterministic response to emergency triggers.

Use Value: Suspend/resume allows immediate read access during ongoing sector erase; –40°C to +105°C rating covers extended environmental envelope; 100 µA standby current extends battery-backed operation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P10TFIV10	Same density and timing, but uses older 90 nm process; lacks Versatile I/O (VIO fixed to VCC)	No support for mixed-voltage host interfaces; incompatible with 1.8 V I/O microcontrollers	Select only if legacy board compatibility requires identical pinout and no VIO flexibility needed
MX29GL256FHI-90G	Macronix part with 90 ns access, but no integrated ECC and only 10,000 erase cycles	Requires external ECC implementation; unsuitable for safety-critical or high-endurance use cases	Consider only for cost-sensitive, non-safety applications where ECC and endurance are not mandated

Compared with S29GL256P10TFIV10 and MX29GL256FHI-90G, the S29GL256S10TFIV20 uniquely combines AEC-Q100 Grade 2 qualification, on-die ECC, Versatile I/O, and 100,000-cycle endurance-making it the only option qualified for automotive and industrial safety firmware storage without external error handling.

Availability

S29GL256S10TFIV20 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC firmware updates, and medical imaging boot loader deployment requiring stable component supply across multi-year production cycles.

Supply support for S29GL256S10TFIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in flash memory for mission-critical systems.

The GL-S family targets high-reliability embedded applications demanding fast XIP performance, robust data integrity, and long-term firmware storage-especially in automotive, industrial, and medical electronics.

FAQ

What is the purpose of the Versatile I/O (VIO) feature?

Versatile I/O allows independent voltage scaling of the data bus (DQ0–DQ15) between 1.65 V and VCC, enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V microcontrollers without level shifters. This reduces BOM cost and PCB complexity while maintaining signal integrity across mixed-voltage system designs.

Does S29GL256S10TFIV20 support execute-in-place (XIP) operation?

Yes-it supports true XIP via fast 90 ns random access and page-mode reads (15 ns), allowing ARM or RISC-V processors to fetch instructions directly from flash without copying to RAM. The 32-byte page alignment and word-addressed architecture are optimized for cache-line–compatible instruction fetch patterns.

How does the 512-byte write buffer improve programming efficiency?

The buffer accepts up to 512 bytes (256 words) in a single command sequence, reducing overhead from repeated command latching and status polling. Measured throughput reaches 1.5 MBps-over 3× faster than single-word programming-accelerating firmware updates and field provisioning in production and service environments.

Can the OTP array be used for cryptographic key storage?

Yes-the 1024-byte OTP array has two independently lockable regions, allowing permanent storage of asymmetric private keys or symmetric root keys. Once locked, regions are irreversible and immune to overwrite, providing hardware-rooted trust for secure boot and firmware authentication in ISO 13849 or IEC 62443–compliant systems.

S29GL256S10TFIV20 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL256S10TFIV20 FAQ

1.How can I place an order for S29GL256S10TFIV20 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S10TFIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S10TFIV20 reliable?

The price and inventory of S29GL256S10TFIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10TFIV20 is usually 5 days.

3.What payment methods are accepted for S29GL256S10TFIV20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10TFIV20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S10TFIV20?

S29GL256S10TFIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S10TFIV20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S10TFIV20?

For technical support, including S29GL256S10TFIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10TFIV20 requirements.

6.How does Aetrix verify that S29GL256S10TFIV20 is sourced from the original manufacturer or authorized distributors?

All S29GL256S10TFIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10TFIV20 meets industry standards.

7.What is the process for return or replacement of S29GL256S10TFIV20?

All S29GL256S10TFIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10TFIV20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S10TFIV20 part is unused and in its original packaging.

Return procedure for S29GL256S10TFIV20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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