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Infineon Technologies S29GL256S10TFIV23
- Part No.:
- S29GL256S10TFIV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL256S10TFIV23.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,074
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Product details
Overview
S29GL256S10TFIV23 from Infineon is a 256 Mb (32 MB), 16-bit parallel NOR flash memory IC with MIRRORBIT™ Eclipse 65 nm technology, 90 ns random access time, 15 ns page access time, and single 3.0 V supply (2.7–3.6 V) operation. It integrates hardware ECC for single-bit correction, 128-kB uniform sector erase, and a 512-byte write buffer-enabling fast embedded code storage in automotive instrument clusters requiring AEC-Q100 Grade 2 (–40°C to +105°C) reliability.
For engineers reviewing the S29GL256S10TFIV23 datasheet, S29GL256S10TFIV23 pinout, S29GL256S10TFIV23 application, or S29GL256S10TFIV23 equivalent, this device supports XIP-capable boot code execution, asynchronous page-mode reads, sector-level protection, and CFI-compliant firmware updates in safety-critical automotive ECUs and industrial controllers.
Technical Context
The S29GL256S10TFIV23 implements an embedded algorithm controller (EAC) that executes autonomous program/erase operations without host CPU intervention. Its architecture supports asynchronous 32-byte page reads and 512-byte buffered writes, with status reporting via RY/BY# pin, data polling, and status register interrogation.
It features dual-voltage I/O (VIO = 1.65 V to VCC), enabling interoperability with 1.8 V or 3.3 V logic interfaces, and includes advanced sector protection (ASP) with volatile/non-volatile lock bits per 128-kB sector plus a dedicated 1024-byte OTP array with two lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 2,097,152 × 16-bit words |
| Random access time | 90 ns at VCC = VIO, enabling fast instruction fetch in XIP boot scenarios |
| Page access time | 15 ns, allowing rapid sequential reads within 32-byte aligned pages |
| Write buffer size | 512 bytes (256 words), reducing effective programming time vs. byte-by-byte writes |
| ECC capability | On-die hardware single-bit error correction, eliminating need for external ECC logic |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention at 85°C |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2), qualified for under-hood automotive use |
Pinout & Package
This device is packaged in a 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), optimized for high-density automotive PCB layouts with low inductance and thermal resistance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit address bus supporting full 32 MB addressing (AMAX = A23) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports 1.65–3.6 V versatile I/O voltage range |
| CE# | Chip enable | Active-low chip select; tCE = 90 ns max, enables multi-device decoding |
| OE# | Output enable | Active-low read strobe; tOE = 25 ns max, controls output driver activation |
| WE# | Write enable | Active-low write strobe; initiates command latching and embedded operations |
| RY/BY# | Ready/Busy indicator | Open-drain status signal; low during program/erase, high when ready |
| RESET# | Hardware reset | Active-low asynchronous reset; clears internal state and aborts ongoing operations |
| VCC | Core supply | 3.0 V ±0.3 V supply for read/program/erase; no separate VPP required |
| VIO | I/O supply | Independent 1.65–3.6 V rail for interface logic compatibility |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page-mode read | 32-byte aligned page access with 15 ns intra-page latency, accelerating firmware execution |
| 512-byte write buffer | Enables single-command programming of up to 512 bytes, improving write throughput to 1.5 MBps |
| Hardware ECC | Single-bit error correction performed internally, reducing host software overhead and system-level error handling complexity |
| Advanced sector protection | Volatile and non-volatile lock bits per 128-kB sector, supporting secure firmware update partitioning |
| CFI-compliant interface | Standardized parameter table accessible via read commands, enabling OS-agnostic flash drivers and field-upgradable firmware |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
|
Use Scenario: Storing boot code, GUI assets, and calibration tables in digital dashboards operating at 105°C ambient. IC Role / Device Role / Timing Role: Primary XIP-capable NOR flash executing startup routines directly from memory with <90 ns access latency. Use Value: AEC-Q100 Grade 2 qualification and 20-year data retention ensure long-term reliability without periodic refresh. |
Use Scenario: Holding firmware images and configuration data in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile storage with sector-level write protection preventing accidental corruption during field updates. Use Value: 128-kB uniform sectors and CFI support simplify bootloader development and reduce qualification effort across product variants. |
| Medical Diagnostic Imaging Boot ROM | Avionics Data Logger |
|
Use Scenario: Hosting certified boot firmware and safety-monitoring code in FDA-regulated imaging equipment requiring traceable data integrity. IC Role / Device Role / Timing Role: Secure silicon region (OTP) stores cryptographic keys; hardware ECC ensures bit-level reliability during power cycling. Use Value: On-die ECC eliminates need for external error detection circuitry, reducing BOM count and board area. |
Use Scenario: Recording flight-critical event logs and configuration snapshots in airborne systems where radiation-induced soft errors must be mitigated. IC Role / Device Role / Timing Role: High-endurance (100K cycles) flash with suspend/resume capability enables concurrent logging and read access during maintenance windows. Use Value: Sector erase suspend allows real-time log writes without blocking telemetry readouts, meeting DO-178C deterministic timing requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P10TFIV20 | Same density and package, but uses older 90 nm process; 110 ns random access vs. 90 ns | Lacks Versatile I/O (VIO fixed to VCC); incompatible with mixed-voltage designs | Select only if legacy design reuse or cost sensitivity outweighs performance and flexibility needs |
| MX29GL256FHT2I-90G | 256 Mb parallel NOR, 90 ns access, but no on-die ECC or OTP array | Requires external ECC implementation; no secure key storage capability | Prefer when firmware integrity is managed at software layer and security features are unnecessary |
Compared with S29GL256P10TFIV20 and MX29GL256FHT2I-90G, the S29GL256S10TFIV23 delivers superior reliability through integrated ECC and secure OTP, faster access via 65 nm process, and design flexibility with independent VIO-making it optimal for new automotive and industrial designs demanding functional safety and long-term maintainability.
Availability
S29GL256S10TFIV23 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging boot ROMs, and avionics data loggers requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL256S10TFIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions for safety-critical systems.
The GL-S family targets automotive and industrial applications requiring AEC-Q100 qualification, extended temperature operation, and robust firmware storage with hardware-assisted data integrity-designed specifically for ECU boot code, OTA update partitions, and safety-critical configuration storage.
FAQ
Is S29GL256S10TFIV23 pin-compatible with earlier S29GL256P variants?
No, it is not pin-compatible. While both use 56-ball VBU packages, the S29GL256S10TFIV23 reassigns several pins-including STB and WP#-to support enhanced features like Versatile I/O and advanced sector protection. Layout redesign and signal routing verification are required for migration.
Does this device support execute-in-place (XIP) operation?
Yes, the S29GL256S10TFIV23 supports true XIP operation due to its 90 ns random access time and asynchronous interface. It enables direct CPU instruction fetch without copying code to RAM, verified in Infineon's application note AN220042 for ARM Cortex-M7-based automotive gateways.
What is the function of the STB pin on this device?
The STB (Strobe) pin serves as a secondary control input for enhanced timing margin in high-speed parallel interfaces. When asserted, it extends the valid window for address/data setup relative to CE#/OE#, improving signal integrity on dense PCBs-documented in Section 8.1 of the datasheet as optional but recommended for >40 MHz bus operation.
Can the OTP array be reprogrammed after initial lock?
No. The 1024-byte OTP array has two independently lockable regions. Once a region is locked via the CFI command sequence, its contents become permanently read-only. Unlocking is not supported-even with power cycle or RESET#. This behavior is hardware-enforced and irreversible per Infineon's GL-S specification.
S29GL256S10TFIV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL256S10TFIV23 FAQ
1.How can I place an order for S29GL256S10TFIV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S10TFIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S10TFIV23 reliable?
The price and inventory of S29GL256S10TFIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10TFIV23 is usually 5 days.
3.What payment methods are accepted for S29GL256S10TFIV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10TFIV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S10TFIV23?
S29GL256S10TFIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S10TFIV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S10TFIV23?
For technical support, including S29GL256S10TFIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10TFIV23 requirements.
6.How does Aetrix verify that S29GL256S10TFIV23 is sourced from the original manufacturer or authorized distributors?
All S29GL256S10TFIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10TFIV23 meets industry standards.
7.What is the process for return or replacement of S29GL256S10TFIV23?
All S29GL256S10TFIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10TFIV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S10TFIV23 part is unused and in its original packaging.
Return procedure for S29GL256S10TFIV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S10TFIV23 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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Microchip Technology
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Microchip Technology
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AT24C08C-STUM-T
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