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Infineon Technologies S29GL256S10TFV020
- Part No.:
- S29GL256S10TFV020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL256S10TFV020.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,064
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Product details
Overview
S29GL256S10TFV020 from Infineon Technologies is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware execution in industrial control and automotive ECUs.
For engineers reviewing the S29GL256S10TFV020 datasheet, S29GL256S10TFV020 pinout, S29GL256S10TFV020 application, or S29GL256S10TFV020 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer, Versatile I/O (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and TSOP-56 package compatibility.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations-including suspend/resume-and enforces sector-level protection via volatile/non-volatile ASP and OTP lockable regions.
The internal architecture includes dedicated erase voltage and programming voltage generators, status register monitoring, and RY/BY# pin-driven busy signaling. ECC logic operates transparently during read cycles, correcting single-bit errors without software intervention and reporting uncorrectable multi-bit errors via status flags.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), enabling full firmware image storage for mid-tier microcontrollers |
| Random access time | 90 ns at VCC = VIO, meeting real-time boot latency requirements in safety-critical systems |
| Page access time | 15 ns, accelerating sequential instruction fetch in XIP applications |
| Write buffer size | 512 bytes (256 words), reducing effective programming time by >3× vs. single-word writes |
| Erase endurance | 100,000 cycles per sector, supporting field firmware updates over 10+ years of operation |
| Data retention | 20 years at +85°C, ensuring long-term reliability in sealed automotive modules |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2), qualified for under-hood ECU deployment |
| I/O voltage range | VIO = 1.65 V to VCC, allowing direct interfacing with 1.8 V or 3.3 V host processors |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, surface-mount, JEDEC MO-141AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit word address bus (A23 = MSB); supports 32 MB linear space with no byte enables |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates at VIO voltage level, independent of VCC |
| CE# | Chip enable | Active-low device select; controls power state and enables command decoding |
| OE# | Output enable | Active-low read strobe; gates output drivers without affecting internal state |
| WE# | Write enable | Active-low write strobe; initiates program/erase commands when CE# and OE# are inactive |
| RY/BY# | Ready/Busy indicator | Open-drain output; low during embedded operations, used for hardware polling |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into reading state and clears status registers |
| WP# | Write protect | Active-low hardware sector lock; overrides software protection for critical boot sectors |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | Single-bit error correction with automatic detection and flagging-eliminates need for external error-handling logic |
| 512-byte write buffer | Enables burst programming of up to 256 words per command, cutting typical firmware update time by 65% vs. legacy flash |
| Uniform 128-kB sectors | Allows precise, non-disruptive firmware patching without erasing unrelated application code |
| Versatile I/O (1.65–3.6 V) | Permits direct connection to mixed-voltage SoCs without level shifters-reducing BOM count and layout complexity |
| OTP array (1024 B) | Two lockable regions store immutable keys or calibration data, preventing accidental overwrite after production programming |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot loader and calibrated engine maps in diesel ECU modules exposed to under-hood thermal cycling. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability and deterministic 90 ns read latency for real-time instruction fetch. Use Value: AEC-Q100 Grade 2 qualification ensures reliable operation at +105°C; 20-year data retention prevents map corruption over vehicle lifetime. | Use Scenario: Holding firmware and configuration data for modular programmable logic controllers deployed in factory automation cabinets. IC Role / Device Role / Timing Role: Primary firmware repository with sector-protected bootloader region and field-upgradable application partition. Use Value: 128 kB uniform sectors enable atomic firmware updates; WP# pin provides hardware-level protection against unintended reprogramming. |
| Medical Diagnostic Imaging Boot Memory | Avionics Display System Code Storage |
Use Scenario: Hosting secure boot ROM and FPGA configuration bitstreams in portable ultrasound devices requiring rapid cold-start. IC Role / Device Role / Timing Role: Fast-access boot memory supporting eXecute-In-Place execution with ECC-protected integrity verification. Use Value: Hardware ECC corrects latent bit flips caused by cosmic radiation; 15 ns page access accelerates initialization sequence. | Use Scenario: Storing display controller firmware and font assets in certified cockpit displays operating in extended temperature environments. IC Role / Device Role / Timing Role: High-reliability code storage with OTP-secured cryptographic keys and CFI-compliant identification for DO-254 traceability. Use Value: Common Flash Interface table enables automated BOM validation; 100,000 erase cycles support 15+ years of scheduled maintenance updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P10TFV020 | Same density and timing, but uses older 90 nm process; lacks Versatile I/O (VIO fixed to VCC) | Not suitable for mixed-voltage host interfaces; limited to 3.3 V-only designs | Select only if legacy board reuse requires identical timing and no VIO flexibility needed |
| MX29GL256FHTI-90G | Micron part with 90 ns access, but no integrated ECC and only 50,000 erase cycles | Requires external error handling; unsuitable for safety-critical AEC-Q100 systems | Consider only for cost-sensitive industrial applications where ECC is managed in software |
Compared with S29GL256P10TFV020 and MX29GL256FHTI-90G, the S29GL256S10TFV020 uniquely combines AEC-Q100 Grade 2 qualification, hardware ECC, and 1.65–3.6 V Versatile I/O-making it the only choice for new automotive and high-integrity industrial designs requiring zero-error firmware execution.
Availability
S29GL256S10TFV020 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware upgrades, and medical imaging system manufacturing requiring stable component supply across extended product lifecycles.
Supply support for S29GL256S10TFV020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for mission-critical applications.
The GL-S family targets automotive and industrial embedded systems needing fast, secure, and long-life parallel NOR flash-designed specifically for XIP-capable boot memory with robust data integrity and AEC-Q100 compliance.
FAQ
What is the purpose of the Versatile I/O (VIO) feature?
The Versatile I/O feature allows the S29GL256S10TFV020 to operate with VIO independently set between 1.65 V and VCC, enabling direct interface with 1.8 V or 3.3 V host processors without external level shifters. This reduces system BOM cost and simplifies PCB routing while maintaining signal integrity across mixed-voltage designs.
How does the hardware ECC function during normal read operations?
Hardware ECC operates transparently during every read cycle: single-bit errors in retrieved data are automatically corrected before output, and the status register flags uncorrectable multi-bit errors. No software overhead or interrupt handling is required-correction occurs within the device's internal data path prior to DQ bus assertion.
Can the 1024-byte OTP array be reprogrammed after initial programming?
No-the OTP (One-Time Programmable) array is permanently programmed during final test and cannot be erased or rewritten. Each of its two lockable regions can be individually secured via dedicated lock bits; once locked, the contents are immutable, providing tamper-resistant storage for cryptographic keys or calibration constants.
What distinguishes the TSOP-56 package from the BGA variants of this flash device?
The TSOP-56 package offers through-hole-compatible surface mounting with standardized 0.5 mm pitch and 14 mm × 20 mm footprint, enabling easier prototyping and rework. In contrast, the LAA/LAE/VBU BGA packages provide higher I/O density and better thermal performance but require precision PCB assembly and are not hand-solderable.
S29GL256S10TFV020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL256S10TFV020 FAQ
1.How can I place an order for S29GL256S10TFV020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S10TFV020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S10TFV020 reliable?
The price and inventory of S29GL256S10TFV020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10TFV020 is usually 5 days.
3.What payment methods are accepted for S29GL256S10TFV020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10TFV020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S10TFV020?
S29GL256S10TFV020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S10TFV020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S10TFV020?
For technical support, including S29GL256S10TFV020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10TFV020 requirements.
6.How does Aetrix verify that S29GL256S10TFV020 is sourced from the original manufacturer or authorized distributors?
All S29GL256S10TFV020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10TFV020 meets industry standards.
7.What is the process for return or replacement of S29GL256S10TFV020?
All S29GL256S10TFV020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10TFV020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S10TFV020 part is unused and in its original packaging.
Return procedure for S29GL256S10TFV020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S10TFV020 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
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