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Infineon Technologies S29GL256S10TFV023
- Part No.:
- S29GL256S10TFV023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL256S10TFV023.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,383
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Product details
Overview
S29GL256S10TFV023 from Infineon is a 256 Mb (32 MB), 16-bit parallel NOR flash memory IC using 65 nm MIRRORBIT™ Eclipse technology, operating from a single 2.7–3.6 V supply with 90 ns random access time and 15 ns page access time. It integrates hardware ECC for single-bit error correction, supports 128 kB uniform sector erase, and includes a 512-byte write buffer-enabling fast embedded code storage and XIP execution in industrial control and automotive infotainment systems.
For engineers reviewing the S29GL256S10TFV023 datasheet, S29GL256S10TFV023 pinout, S29GL256S10TFV023 application, or S29GL256S10TFV023 equivalent, key selection criteria include its Versatile I/O (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), 100,000 program/erase cycles, and support for suspend/resume during programming and erase operations.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), 16-bit DQ bus, and dedicated control signals (CE#, OE#, WE#, RY/BY#). Its embedded algorithm controller (EAC) manages all program/erase sequences internally, eliminating external timing control requirements.
The internal hardware ECC engine operates transparently during read operations and corrects single-bit errors on-the-fly without CPU intervention. Sector protection is implemented via both volatile (lock bits) and non-volatile (ASP) methods, and the device includes a separate 1024-byte OTP array with two lockable regions for secure boot code or calibration data.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 2,097,152 × 16-bit words - enables full firmware image storage for mid-tier microcontrollers. |
| Access time (random) | 90 ns at VCC = VIO - meets real-time boot latency requirements for industrial PLCs and automotive ECUs. |
| Page access time | 15 ns - accelerates sequential instruction fetch in XIP mode with minimal bus turnaround overhead. |
| Write buffer size | 512 bytes (256 words) - reduces effective programming time by >3× vs. single-word writes in firmware update routines. |
| ECC capability | Single-bit error correction per 512-byte sector - ensures data integrity without software overhead in safety-critical applications. |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention - supports long-life deployments in unattended infrastructure equipment. |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive modules and industrial edge gateways. |
Pinout & Package
Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus supporting full 32 MB address space; A23 is MSB for 256 Mb density. |
| DQ0–DQ15 | Data I/O bidirectional bus | 16-bit parallel data path; supports byte/word reads/writes; compatible with standard 16-bit microcontroller buses. |
| CE# | Chip enable | Active-low chip select; controls device power state and enables command decoding only when asserted. |
| OE# | Output enable | Active-low read strobe; gates output drivers to prevent bus contention during multi-device configurations. |
| WE# | Write enable | Active-low write strobe; initiates internal program/erase algorithms when combined with valid command sequences. |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active internal operation (low) or completion (high); used for polling-based status monitoring. |
| VCC | Core supply | 2.7–3.6 V single supply powering core logic, charge pumps, and internal regulators - eliminates need for auxiliary voltage rails. |
| VIO | I/O supply | 1.65–3.6 V independent I/O voltage - allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters. |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65–3.6 V - enables seamless integration with mixed-voltage SoCs and legacy 1.8 V FPGAs without external level translation. |
| Hardware ECC engine | On-die single-bit error correction per 512-byte sector - eliminates software ECC overhead and guarantees deterministic read latency in safety-critical boot paths. |
| Suspend/resume capability | Interrupts ongoing program or erase to service high-priority read requests - essential for real-time OS environments requiring low-latency interrupt response. |
| Advanced sector protection (ASP) | Volatile and non-volatile lock bits per 128 kB sector - allows field-upgradable firmware partitions while protecting bootloader and calibration data from accidental overwrite. |
| Common Flash Interface (CFI) | Standardized parameter table accessible via read commands - enables automatic driver configuration across toolchains and OS flash abstractions (e.g., U-Boot, Linux MTD). |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated gauge graphics, firmware updates, and vehicle configuration data in digital instrument clusters. IC Role / Device Role / Timing Role: Non-volatile code and data storage with XIP-capable parallel interface for real-time display rendering. Use Value: 90 ns random access and 15 ns page mode enable sub-100 µs GUI frame load times; AEC-Q100 Grade 2 ensures reliability at 105°C ambient. |
Use Scenario: Holding ladder logic firmware, I/O mapping tables, and runtime configuration in programmable logic controllers. IC Role / Device Role / Timing Role: Boot memory and persistent program storage with hardware ECC for deterministic fail-safe operation. Use Value: 100,000 erase cycles and 20-year retention support 15+ year field deployments; sector protection isolates user logic from system firmware. |
| Medical Imaging Control Panel | Telecom Base Station Boot ROM |
Use Scenario: Storing UI assets, diagnostic firmware, and regulatory compliance logs in FDA-cleared imaging devices. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage with OTP region for cryptographic keys and calibration certificates. Use Value: Separate 1024-byte OTP array with dual lockable regions prevents unauthorized modification of critical security parameters. |
Use Scenario: Hosting bootloader, FPGA bitstreams, and baseband DSP firmware in 4G/5G remote radio units. IC Role / Device Role / Timing Role: High-reliability boot memory interfaced directly to ARM Cortex-A series application processors. Use Value: 512-byte write buffer cuts firmware update time by 70% vs. byte-wise programming; CFI support simplifies cross-platform driver development. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P10TFV020 | Same density and package, but uses older 90 nm process; 110 ns random access; no hardware ECC. | Lacks on-die ECC and has slower access - suitable only for cost-sensitive, non-safety-critical consumer applications. | Select only if ECC and <90 ns access are not required; verify compatibility with existing command set and timing margins. |
| MX29GL256FHT2I-90G | Micron 256 Mb parallel NOR; 90 ns access; no integrated ECC; supports CFI but lacks ASP and OTP regions. | No sector-level non-volatile protection or secure OTP - requires external management for firmware partitioning and key storage. | Choose when migrating from legacy Micron platforms; confirm absence of ECC dependency in current firmware stack. |
Compared with S29GL256P10TFV020 and MX29GL256FHT2I-90G, the S29GL256S10TFV023 delivers superior reliability through hardware ECC and enhanced security via ASP and OTP - making it the only option qualified for AEC-Q100 Grade 2 and certified for functional safety boot paths.
Availability
S29GL256S10TFV023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging panels, and telecom base station boot ROMs requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL256S10TFV023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certifications including ISO/TS 16949 and AEC-Q200.
The GL-S family was designed specifically for automotive and industrial applications demanding high endurance, extended temperature operation, and integrated data integrity features - bridging the performance gap between XIP and data-storage flash architectures.
FAQ
Does S29GL256S10TFV023 support 1.8 V I/O interfaces?
Yes. The Versatile I/O feature allows VIO to operate from 1.65 V to 3.6 V, enabling direct connection to 1.8 V microcontrollers without level shifters. This is confirmed in the datasheet's "Versatile I/O feature" section and electrical specifications table (VIO min = 1.65 V).
What is the function of the RY/BY# pin?
RY/BY# is an open-drain ready/busy indicator that goes low during internal program or erase operations and returns high upon completion. It supports polling-based status monitoring and can be tied to an interrupt input on the host processor for event-driven operation.
Can the OTP region be reprogrammed after locking?
No. Once either of the two 512-byte OTP lock bits is set, that region becomes permanently read-only. The lock bits themselves are one-time programmable and cannot be cleared or reset - ensuring irreversible protection of boot code or cryptographic keys.
Is AEC-Q100 Grade 2 qualification verified for this specific part number?
Yes. S29GL256S10TFV023 is explicitly listed in the datasheet's "Temperature range / grade" table as qualified for Automotive, AEC-Q100 Grade 2 (–40°C to +105°C), with test reports covering HTOL, ESD, and thermal cycling per AEC-Q100 Rev G requirements.
S29GL256S10TFV023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL256S10TFV023 FAQ
1.How can I place an order for S29GL256S10TFV023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S10TFV023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S10TFV023 reliable?
The price and inventory of S29GL256S10TFV023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S10TFV023 is usually 5 days.
3.What payment methods are accepted for S29GL256S10TFV023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S10TFV023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S10TFV023?
S29GL256S10TFV023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S10TFV023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S10TFV023?
For technical support, including S29GL256S10TFV023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S10TFV023 requirements.
6.How does Aetrix verify that S29GL256S10TFV023 is sourced from the original manufacturer or authorized distributors?
All S29GL256S10TFV023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S10TFV023 meets industry standards.
7.What is the process for return or replacement of S29GL256S10TFV023?
All S29GL256S10TFV023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S10TFV023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S10TFV023 part is unused and in its original packaging.
Return procedure for S29GL256S10TFV023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S10TFV023 Tags
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