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Infineon Technologies S29GL256S11DHB010
- Part No.:
- S29GL256S11DHB010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S11DHB010.pdf
- Description:
- IC FLASH 256MBIT CFI 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,418
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Product details
Overview
S29GL256S11DHB010 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction - enabling reliable code storage in automotive engine control units and industrial HMIs.
For engineers reviewing the S29GL256S11DHB010 datasheet, S29GL256S11DHB010 pinout, S29GL256S11DHB010 application, or S29GL256S11DHB010 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant interface for bootloader compatibility.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supports page-mode reads (32-byte aligned pages), and uses embedded algorithms for sector erase and buffer programming. Its internal state machine handles command execution without external timing control.
The integrated ECC engine operates transparently during read cycles, correcting single-bit errors in real time using dedicated syndrome logic and spare bytes per sector. Sector protection is configurable via volatile (SR bits) and non-volatile (lock bits) methods, including OTP array partitioning into two 512-byte lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), mapped as 223 × 16-bit words - supports full firmware image storage for mid-tier microcontrollers. |
| Access time (random) | 90 ns at VCC = VIO - enables direct XIP execution from flash in real-time control loops. |
| Page access time | 15 ns - accelerates sequential instruction fetch within 32-byte aligned pages. |
| Write buffer size | 512 bytes (256 words) - reduces average programming time by batching writes, critical for OTA update efficiency. |
| ECC capability | Single-bit error correction per 512-byte sector - ensures data integrity without software overhead in safety-critical boot code. |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention - meets automotive ECU long-life requirements. |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive applications. |
Pinout & Package
Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit address bus; A23 is MSB for 256 Mb density - defines 16-Mword linear space. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes and reads per JEDEC standard. |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching timing window. |
| OE# | Output enable | Active-low read strobe; gates output drivers during asynchronous read cycles. |
| WE# | Write enable | Active-low write strobe; initiates command loading or data programming sequence. |
| RY/BY# | Ready/Busy indicator | Open-drain status pin; low during embedded operations (erase/program), high when idle or ready. |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into known state, clears status register and aborts ongoing operations. |
| VCC | Core supply | 2.7–3.6 V single supply for core logic, programming, and erase - eliminates need for separate VPP. |
| VIO | I/O supply | 1.65–3.6 V independent I/O voltage - enables interfacing with 1.8 V, 2.5 V, or 3.3 V controllers. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page-mode read | 32-byte aligned page access with 15 ns cycle time - improves instruction fetch bandwidth over standard random access. |
| 512-byte write buffer | Reduces effective programming time by up to 4× vs. single-word writes - critical for fast firmware updates. |
| Hardware ECC engine | On-the-fly single-bit correction per sector without CPU intervention - satisfies ASIL-B functional safety requirements. |
| Uniform 128 kB sectors | 64 identical erase blocks simplify wear leveling and field update partitioning in embedded file systems. |
| OTP array with dual lock | 1024-byte one-time-programmable region split into two independently lockable 512-byte zones - secures calibration data and cryptographic keys. |
Applications
| Automotive Engine Control Unit (ECU) | Industrial Human-Machine Interface (HMI) |
|---|---|
Use Scenario: Storing calibrated engine maps, diagnostic routines, and boot firmware in under-hood ECUs. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability and AEC-Q100 Grade 2 thermal resilience. Use Value: 90 ns random access enables deterministic interrupt response; 100K-cycle endurance supports lifetime reprogramming. |
Use Scenario: Hosting GUI assets, configuration profiles, and firmware images in panel-mounted HMIs operating in factory environments. IC Role / Device Role / Timing Role: High-reliability parallel flash for static content storage with CFI-based bootloader compatibility. Use Value: Versatile I/O (1.65–3.6 V) interfaces directly with 3.3 V ARM Cortex-A/M cores; 20-year retention prevents data loss during equipment downtime. |
| Medical Imaging System Boot Memory | Railway Signaling Controller Firmware |
Use Scenario: Secure boot code and FPGA configuration bitstreams in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Trusted firmware storage with hardware ECC and OTP-protected security keys. Use Value: Internal ECC eliminates need for redundant software checksums; dual-lock OTP prevents unauthorized calibration tampering. |
Use Scenario: Storing fail-safe control logic and communication protocol stacks in EN 5012x-certified signaling hardware. IC Role / Device Role / Timing Role: Radiation-tolerant, long-life flash for SIL-3 compliant firmware persistence. Use Value: 128 kB uniform sectors simplify certified firmware partitioning; AEC-Q100 Grade 2 rating exceeds industrial temp range requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P11TFI010 | Same density and architecture, but 64-ball LAE FBGA (9 mm × 9 mm); lacks AEC-Q100 qualification. | Targeted at industrial/commercial designs where automotive qualification is not required. | Select when board layout allows larger footprint and automotive temp grade is unnecessary. |
| MX29GL256FHI-90G | Macronix part; 90 ns access, 128 kB sectors, but no integrated hardware ECC or OTP array. | Requires external ECC handling and lacks secure key storage - unsuitable for ASIL-B or regulated medical use. | Choose only for cost-sensitive commercial applications with relaxed data integrity requirements. |
Compared with S29GL256P11TFI010 and MX29GL256FHI-90G, the S29GL256S11DHB010 uniquely combines AEC-Q100 Grade 2 operation, on-die ECC, and dual-lock OTP - making it the only option qualified for safety-critical automotive boot memory without external error-handling logic.
Availability
S29GL256S11DHB010 is available at Aetrix Electronics and suitable for automotive engine control units, industrial HMIs, and railway signaling controllers requiring stable component supply across extended product lifecycles.
Supply support for S29GL256S11DHB010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.
The GL-S family targets high-reliability embedded systems needing robust, high-density parallel NOR flash - specifically engineered for automotive, industrial, and medical applications demanding AEC-Q100 compliance and long-term data integrity.
FAQ
Does S29GL256S11DHB010 support execute-in-place (XIP) operation?
Yes. The device supports true XIP operation due to its 90 ns random access time and asynchronous interface, allowing microcontrollers to fetch instructions directly from flash without copying to RAM. Its page-mode read capability further enhances sequential instruction throughput during loop execution.
What is the function of the Versatile I/O (VIO) feature?
VIO allows independent I/O voltage supply (1.65–3.6 V) separate from core VCC, enabling direct interfacing with mixed-voltage SoCs - for example, connecting to a 1.8 V FPGA I/O bank while maintaining 3.3 V core operation for optimal performance and noise immunity.
How does the 512-byte write buffer improve programming efficiency?
The buffer accepts up to 512 bytes in a single command sequence and programs them internally in burst mode, achieving 1.5 MBps effective throughput - reducing total programming time by ~75% compared to single-word writes, which is essential for rapid field firmware updates.
Is the OTP array truly one-time programmable?
Yes. The 1024-byte OTP region is physically fused during programming; once a bit is set to '0', it cannot be reversed. Each of the two 512-byte zones has independent lock bits - once locked, that zone becomes permanently read-only, preventing further writes or erases.
S29GL256S11DHB010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- CFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL256S11DHB010 FAQ
1.How can I place an order for S29GL256S11DHB010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S11DHB010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S11DHB010 reliable?
The price and inventory of S29GL256S11DHB010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S11DHB010 is usually 5 days.
3.What payment methods are accepted for S29GL256S11DHB010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S11DHB010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S11DHB010?
S29GL256S11DHB010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S11DHB010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S11DHB010?
For technical support, including S29GL256S11DHB010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S11DHB010 requirements.
6.How does Aetrix verify that S29GL256S11DHB010 is sourced from the original manufacturer or authorized distributors?
All S29GL256S11DHB010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S11DHB010 meets industry standards.
7.What is the process for return or replacement of S29GL256S11DHB010?
All S29GL256S11DHB010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S11DHB010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S11DHB010 part is unused and in its original packaging.
Return procedure for S29GL256S11DHB010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S11DHB010 Tags
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