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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S11DHB023

Name: S29GL256S11DHB023
Brand: Infineon Technologies
SKU: S29GL256S11DHB023
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S11DHB023

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S11DHB023.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL256S11DHB023 from Infineon is a 256 Mb (32 MB), 16-bit parallel NOR flash memory using 65 nm MIRRORBIT™ Eclipse technology, operating from a single 2.7–3.6 V supply with 90 ns random access time and 15 ns page access time. It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sectors, and a 512-byte write buffer-enabling fast embedded code storage and execution in automotive instrument clusters, industrial HMIs, and network boot firmware.

For engineers reviewing the S29GL256S11DHB023 datasheet, S29GL256S11DHB023 pinout, S29GL256S11DHB023 application, or S29GL256S11DHB023 equivalent, key selection considerations include its Versatile I/O (1.65–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), 100,000 program/erase cycles, and support for suspend/resume during erase and program operations.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages all program and erase operations-including sector erase, buffer programming, and automatic ECC generation-without external microcontroller intervention.

The internal architecture includes dedicated voltage generators for programming (VPP) and erasing, a status register with DQ7 data polling and RY/BY# pin signaling, and dual protection mechanisms: Advanced Sector Protection (ASP) with volatile/non-volatile lock bits and a separate 1024-byte OTP array with two lockable regions.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mb (32 MB); supports full firmware images for mid-tier microcontrollers without external memory expansion.
Interface	Asynchronous 16-bit parallel; enables XIP (execute-in-place) operation directly from flash without RAM copy.
Access Time	90 ns random / 15 ns page; meets real-time boot latency requirements in automotive ECUs.
Write Buffer	512-byte buffer; reduces effective programming time by up to 4× vs. single-word writes.
ECC	On-die hardware single-bit correction; eliminates need for external ECC logic or software overhead.
Endurance & Retention	100,000 program/erase cycles / 20-year data retention; qualified for long-life industrial deployments.
Operating Temp	–40°C to +105°C (AEC-Q100 Grade 2); validated for under-hood automotive use cases.

Pinout & Package

Package: 56-ball VBU Fortified BGA (9 mm × 7 mm), RoHS-compliant, lead-free, moisture sensitivity level 3.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address inputs	24-bit word address bus; A23 is MSB for 256 Mb density (max address = 0x1FFFFFF).
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes and reads per JEDEC-standard NOR protocol.
CE#	Chip enable	Active-low chip select; controls device power state and enables multi-chip addressing in dense memory subsystems.
OE#	Output enable	Active-low read strobe; gates output drivers independently of CE#, enabling shared-bus timing control.
WE#	Write enable	Active-low write strobe; initiates command sequences (e.g., program, erase, unlock) when combined with address/data.
RY/BY#	Ready/Busy indicator	Open-drain active-low status pin; signals ongoing embedded operations (program/erase) to host controller.
VCC	Core supply	2.7–3.6 V single supply for read/program/erase; eliminates need for auxiliary VPP voltage rail.
VIO	I/O supply	1.65–VCC versatile I/O; allows interfacing with 1.8 V, 2.5 V, or 3.3 V controllers without level shifters.

Key Features

Feature	Design Value
Page-mode read (32-byte aligned)	Enables 15 ns subsequent reads within same page-critical for tight-loop instruction fetch in XIP applications.
Suspend/resume capability	Allows interrupting erase or program to service high-priority reads, improving system responsiveness in multitask environments.
Advanced Sector Protection (ASP)	Per-sector volatile/non-volatile locking prevents accidental firmware overwrite during field updates or diagnostics.
Secure Silicon Region (OTP)	1024-byte one-time-programmable area with dual lockable regions-used for keys, calibration data, or secure boot seeds.
Common Flash Interface (CFI)	Standardized parameter table accessible via read commands-enables auto-configuration in bootloader and OS flash drivers.

Applications

Automotive Instrument Cluster

Industrial HMI Firmware Storage

Use Scenario: Storing calibrated gauge graphics, driver alerts, and firmware updates in digital dashboards.

IC Role / Device Role / Timing Role: Non-volatile code and asset storage with XIP support and AEC-Q100 Grade 2 thermal reliability.

Use Value: Eliminates external SRAM copy step; 90 ns random access ensures sub-100 µs response to CAN-triggered display changes.

Use Scenario: Holding GUI binaries, localization strings, and configuration profiles in factory-floor HMIs.

IC Role / Device Role / Timing Role: Parallel boot memory mapped to ARM Cortex-A/M cores with CFI-based driver initialization.

Use Value: 512-byte write buffer cuts firmware update time by >70% vs. legacy 16-bit NOR parts; ASP prevents misflash during OTA rollout.

Network Router Boot Image

Medical Diagnostic Device Log Storage

Use Scenario: Hosting primary bootloader, Linux kernel, and initramfs for carrier-grade edge routers.

IC Role / Device Role / Timing Role: High-reliability parallel flash with hardware ECC and 20-year retention for unattended operation.

Use Value: On-die ECC corrects bit flips from cosmic radiation or aging-avoiding silent corruption in critical boot path.

Use Scenario: Archiving calibration logs, sensor trace data, and audit trails in portable ultrasound units.

IC Role / Device Role / Timing Role: Sector-erasable non-volatile storage with OTP-secured serial number and calibration constants.

Use Value: 128-kbyte uniform sectors allow deterministic log rotation; OTP lock guarantees regulatory compliance traceability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P11TFI020	Same density and core specs, but TSOP-56 package (not BGA); no VBU footprint compatibility.	Limited to space-tolerant PCBs; lacks VBU's thermal performance and board-level reliability in vibration-prone systems.	Select only if legacy board layout rework is prohibited and thermal cycling is minimal.
MX29GL256FHT2I-90G	Micron part with identical 256 Mb / 16-bit / 90 ns spec, but no integrated ECC or ASP; requires external error handling.	Suitable for cost-sensitive designs where firmware integrity is managed in software or external controller.	Choose when BOM cost is prioritized over long-term field reliability and security features.

Compared with S29GL256P11TFI020 and MX29GL256FHT2I-90G, the S29GL256S11DHB023 delivers unique value through on-die ECC, ASP, and AEC-Q100 Grade 2 qualification-making it the only choice for safety-critical automotive and industrial firmware storage where data integrity and lifecycle assurance are mandatory.

Availability

S29GL256S11DHB023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMIs, and network router boot applications requiring stable component supply across extended product lifecycles.

Supply support for S29GL256S11DHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and secure embedded solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

The GL-S family targets high-reliability embedded systems needing robust, pin-compatible NOR flash with enhanced data integrity-designed specifically for automotive, industrial, and networking applications demanding AEC-Q100 qualification and 20-year data retention.

FAQ

Does S29GL256S11DHB023 support execute-in-place (XIP) operation?

Yes. The device supports true XIP via its asynchronous 16-bit parallel interface and fast 90 ns random access time. Code stored in its memory can be fetched and executed directly by compatible microcontrollers without copying to RAM, reducing boot latency and memory footprint in resource-constrained systems.

What is the function of the VIO pin, and how does it differ from VCC?

VIO supplies power to input/output buffers only and operates from 1.65 V to VCC, enabling direct interfacing with 1.8 V or 2.5 V host processors without level shifters. VCC powers the core logic and flash array (2.7–3.6 V). This separation allows mixed-voltage system integration while maintaining full functionality and timing compliance.

How is sector protection implemented, and can it be changed in the field?

Sector protection uses Advanced Sector Protection (ASP) with both volatile (temporary, cleared on reset) and non-volatile (permanent until unlocked) lock bits per 128-kbyte sector. Unlocking requires specific command sequences and is possible in the field-but non-volatile locks persist across power cycles and require explicit unlock commands before reprogramming.

Is the 512-byte write buffer mandatory for programming, or can single-word writes be used?

Both modes are supported. The device accepts single-word programming (16-bit) and multiple-word writes up to 512 bytes in buffer mode. Buffer programming is optional but strongly recommended-it improves effective write speed by ~4× and reduces total programming time for firmware updates or large data blocks.

S29GL256S11DHB023 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL256S11DHB023 FAQ

1.How can I place an order for S29GL256S11DHB023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S11DHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S11DHB023 reliable?

The price and inventory of S29GL256S11DHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S11DHB023 is usually 5 days.

3.What payment methods are accepted for S29GL256S11DHB023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S11DHB023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S11DHB023?

S29GL256S11DHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S11DHB023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S11DHB023?

For technical support, including S29GL256S11DHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S11DHB023 requirements.

6.How does Aetrix verify that S29GL256S11DHB023 is sourced from the original manufacturer or authorized distributors?

All S29GL256S11DHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S11DHB023 meets industry standards.

7.What is the process for return or replacement of S29GL256S11DHB023?

All S29GL256S11DHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S11DHB023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S11DHB023 part is unused and in its original packaging.

Return procedure for S29GL256S11DHB023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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