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Infineon Technologies S29GL256S11DHIV10
- Part No.:
- S29GL256S11DHIV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S11DHIV10.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,838
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Product details
Overview
S29GL256S11DHIV10 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile program retention.
For engineers reviewing the S29GL256S11DHIV10 datasheet, S29GL256S11DHIV10 pinout, S29GL256S11DHIV10 application, or S29GL256S11DHIV10 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and OTP array for secure configuration storage.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supports both standard and page-mode reads, and uses embedded algorithms for sector erase and buffered programming without external timing control. Its internal state machine handles command execution, status reporting via RY/BY#, and automatic ECC generation/correction during read.
The GL-S architecture separates address decoding, erase voltage generation, and program voltage regulation into dedicated on-die blocks. Sector protection is managed through volatile (SR bits) and non-volatile (ASP lock bits) methods, while the 1024-byte OTP array provides two independently lockable regions for immutable calibration or security keys.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 2,097,152 × 16-bit words - enables full firmware image storage for mid-range MCUs. |
| Access time (random) | 90 ns at VCC = VIO - meets real-time boot latency requirements for industrial PLCs and gateways. |
| Page access time | 15 ns - accelerates sequential instruction fetch in XIP mode across 32-byte aligned pages. |
| Write buffer size | 512 bytes (256 words) - reduces effective programming time by >3× vs. single-word writes. |
| ECC capability | Internal hardware single-bit error correction - eliminates need for external ECC logic in safety-critical systems. |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention - supports long-lifecycle deployments in infrastructure equipment. |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive ECUs and high-ambient industrial controllers. |
Pinout & Package
Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.5 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit word-aligned address bus; A23 is MSB for 256 Mb density (224 × 16 = 32 MB). |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports 1.65–3.6 V I/O voltage (VIO) independent of VCC. |
| CE# | Chip enable | Active-low chip select; controls device power state and enables read/write operations. |
| OE# | Output enable | Active-low control for data bus output drivers; used to gate read data onto DQ lines. |
| WE# | Write enable | Active-low strobe for write operations; latches address/data during programming/erase commands. |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation (low = busy); replaces polling overhead. |
| RESET# | Hardware reset | Asynchronous active-low reset that halts ongoing operations and returns device to read mode. |
| WP# | Write protect | Hardware sector protection enable; when asserted, prevents accidental program/erase of protected sectors. |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65–3.6 V independently of VCC - simplifies interfacing with mixed-voltage SoCs and FPGAs. |
| 512-byte write buffer | Enables burst programming of up to 256 words in one command - cuts firmware update time by ~75% vs. byte-wise writes. |
| Uniform 128 kB sectors | 256 identical erase sectors simplify BOM management and field firmware partitioning across product variants. |
| Hardware ECC engine | On-the-fly single-bit correction with no software intervention - required for ASIL-B compliance in automotive boot ROM. |
| OTP array with dual lock | 1024-byte one-time-programmable region split into two independently lockable sections - secures calibration data and cryptographic keys. |
Applications
| Automotive Engine Control Unit (ECU) | Industrial Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Storing calibrated engine maps and bootloader firmware in under-hood ECU modules. IC Role / Device Role / Timing Role: Non-volatile boot ROM with XIP-capable parallel interface and AEC-Q100 Grade 2 qualification. Use Value: 90 ns random access ensures deterministic boot within 100 ms; hardware ECC guarantees integrity of critical calibration tables over 15+ years. |
Use Scenario: Holding firmware and configuration data for DIN-rail mounted PLCs operating in factory environments. IC Role / Device Role / Timing Role: Primary code storage with sector-level protection for field-upgradable logic programs. Use Value: 128 kB uniform sectors allow atomic firmware updates without erasing operational parameters; WP# pin enables hardware write lock during runtime. |
| Telecom Base Station Controller | Medical Imaging System Boot Module |
Use Scenario: Storing FPGA configuration bitstreams and control firmware in 5G remote radio units exposed to wide thermal cycling. IC Role / Device Role / Timing Role: High-reliability parallel flash with extended temperature operation and 20-year data retention. Use Value: –40°C to +105°C rating ensures stable operation during outdoor thermal transients; 100,000 erase cycles support frequent field upgrades over 10+ year service life. |
Use Scenario: Securing boot code and DICOM configuration in FDA-cleared MRI and CT scanner mainboards. IC Role / Device Role / Timing Role: Safety-certified firmware storage with OTP-based cryptographic key vault. Use Value: Dual-lock OTP array isolates private keys from firmware updates; hardware ECC satisfies IEC 62304 SW safety Class C requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P11TFIV10 | Same density and core specs, but 64-ball LAE FBGA (9 mm × 9 mm) package - no TSOP footprint compatibility. | Targeted at space-constrained designs where PCB area is prioritized over legacy socket compatibility. | Select when board layout requires BGA miniaturization and thermal performance exceeds TSOP limits. |
| MX29GL256FHT2I-90G | Micron part with 90 ns access, but lacks integrated ECC and OTP array; requires external error handling logic. | Suitable for cost-sensitive consumer applications where ECC is managed in software or omitted. | Choose only if system-level ECC is already implemented and footprint compatibility with Infineon's TSOP is not required. |
Compared with S29GL256P11TFIV10, this TSOP variant offers drop-in replacement for legacy designs; versus MX29GL256FHT2I-90G, it delivers built-in reliability features essential for medical and automotive use - eliminating external ECC ICs and reducing BOM count by one component.
Availability
S29GL256S11DHIV10 is available at Aetrix Electronics and suitable for automotive ECU firmware storage, industrial PLC boot code retention, and telecom base station configuration requiring stable component supply across multi-year production cycles.
Supply support for S29GL256S11DHIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.
The GL-S family targets high-reliability embedded systems needing fast XIP execution and robust data retention - designed specifically for automotive, industrial, and networking applications demanding AEC-Q100 or extended temperature operation.
FAQ
What is the maximum clock frequency supported for read operations?
S29GL256S11DHIV10 is an asynchronous parallel flash device with no clock input. Read timing is governed by access times: 90 ns random access and 15 ns page access. System timing must meet tACC ≤ 90 ns and tCE/tOE ≤ 90/25 ns respectively, verified under load conditions of 30 pF and VCC = 3.0 V.
Does this device support JEDEC-standard Common Flash Interface (CFI)?
Yes, the device implements the Common Flash Interface (CFI) parameter table per JEDEC JESD68, accessible via specific command sequences. The CFI table provides standardized identification, geometry, and command-set information, enabling OS-level flash drivers to auto-configure without vendor-specific code.
Can the OTP array be reprogrammed after locking?
No. Once either of the two OTP lock bits is set (via specific unlock-and-program sequence), the corresponding 512-byte region becomes permanently read-only. Locking is irreversible and requires VPP = 12 V in older generations, but GL-S uses internal charge pump - no external high-voltage supply needed.
How does suspend/resume functionality work during sector erase?
The device supports suspend of ongoing sector erase to perform high-priority reads. Issuing the Erase Suspend command halts erase after ≤ 2 µs, allowing immediate read access. Resume restores erase from the exact suspended point - no data loss or timing penalty beyond the suspend latency.
S29GL256S11DHIV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL256S11DHIV10 FAQ
1.How can I place an order for S29GL256S11DHIV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S11DHIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S11DHIV10 reliable?
The price and inventory of S29GL256S11DHIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S11DHIV10 is usually 5 days.
3.What payment methods are accepted for S29GL256S11DHIV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S11DHIV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S11DHIV10?
S29GL256S11DHIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S11DHIV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S11DHIV10?
For technical support, including S29GL256S11DHIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S11DHIV10 requirements.
6.How does Aetrix verify that S29GL256S11DHIV10 is sourced from the original manufacturer or authorized distributors?
All S29GL256S11DHIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S11DHIV10 meets industry standards.
7.What is the process for return or replacement of S29GL256S11DHIV10?
All S29GL256S11DHIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S11DHIV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S11DHIV10 part is unused and in its original packaging.
Return procedure for S29GL256S11DHIV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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