Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S11DHIV20

Name: S29GL256S11DHIV20
Brand: Infineon Technologies
SKU: S29GL256S11DHIV20
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: S29GL256S11DHIV20

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S11DHIV20.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:197

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

S29GL256S11DHIV20 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse technology. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction - deployed in automotive instrument clusters requiring fast XIP boot code execution.

For engineers reviewing the S29GL256S11DHIV20 datasheet, S29GL256S11DHIV20 pinout, S29GL256S11DHIV20 application, or S29GL256S11DHIV20 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte programming buffer throughput (1.5 MBps), Versatile I/O support (1.65 V to VCC), and AEC-Q100 Grade 2 qualification (–40°C to +105°C).

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.

The flash array is organized into uniform 128 kB sectors, each individually erasable, and includes a dedicated 1024-byte OTP array split into two lockable regions. Internal hardware ECC corrects single-bit errors on-the-fly during read, with ECC status accessible via dedicated ASO address space.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mb (32 MB), mapped as 2²³ × 16-bit words - supports full firmware image storage for mid-tier automotive ECUs.
Random Access Time	90 ns at VCC = VIO - enables sub-11 MHz bus timing for legacy microcontroller interfaces without wait states.
Page Access Time	15 ns - allows burst reads of up to 32 bytes within same page, accelerating sequential instruction fetch in XIP mode.
Programming Buffer	512 bytes - reduces effective programming time by batching writes; achieves 1.5 MBps sustained write rate.
ECC Support	On-die single-bit error correction - eliminates need for external ECC logic or software overhead in safety-critical boot memory.
Endurance & Retention	100,000 program/erase cycles and 20-year data retention - meets long-life requirements for automotive infotainment and ADAS modules.
Operating Temperature	–40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood and display module deployment.
Supply Voltage	VCC = 2.7–3.6 V, VIO = 1.65 V to VCC - supports mixed-voltage system interfacing with 1.8 V or 3.3 V controllers.

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width), JEDEC MO-141AC compliant. Pin count and physical layout match industry-standard parallel NOR footprint for drop-in replacement in legacy designs.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address Inputs	24-bit word-aligned address bus; A23 is MSB for 256 Mb density (2²³ words).
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports high-speed page reads and buffered programming.
CE#	Chip Enable	Active-low enable controlling device selection; tCE = 90 ns max defines minimum chip select assertion window.
OE#	Output Enable	Active-low control for data output gating; tOE = 25 ns max ensures timely read data validity.
WE#	Write Enable	Active-low signal initiating write/program/erase commands; latched with address/data for command decoding.
RY/BY#	Ready/Busy Output	Open-drain status indicator: low = operation in progress, high = ready - used for polling-free interrupt-driven control.
RESET#	Hardware Reset	Active-low asynchronous reset that halts ongoing operations and returns device to read mode.
WP#	Write Protect	Hardware sector protection enable; when asserted, prevents accidental program/erase of protected sectors.

Key Features

Feature	Design Value
65 nm MIRRORBIT™ Eclipse process	Enables higher density and lower power vs. older 90 nm NOR, with improved reliability for automotive thermal cycling.
Asynchronous 32-byte page read	Reduces average instruction fetch latency in XIP applications by >80% compared to full random access.
512-byte programming buffer	Allows one command to program up to 256 words, cutting total programming time by ~5× vs. single-word writes.
Internal hardware ECC	Corrects single-bit errors transparently during read, eliminating software ECC overhead and improving boot-time predictability.
Advanced Sector Protection (ASP)	Supports volatile (power-on default) and non-volatile (permanent) locking per 128 kB sector - critical for bootloader partitioning.

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated gauge graphics, driver alert logic, and real-time CAN message handlers in a digital dashboard ECU.

IC Role / Device Role / Timing Role: Boot ROM and runtime XIP code storage; executes directly from flash with <90 ns instruction fetch latency.

Use Value: AEC-Q100 Grade 2 qualification and 20-year data retention ensure functional safety compliance over vehicle lifetime.

Use Scenario: Holding field-upgradable ladder logic firmware and I/O configuration tables in modular automation controllers.

IC Role / Device Role / Timing Role: Non-volatile firmware repository with sector-level write protection to prevent corruption during brown-out events.

Use Value: 128 kB uniform sectors allow atomic firmware updates without erasing unrelated configuration data.

Avionics Display Module

Medical Imaging Control Board

Use Scenario: Hosting certified flight display boot code and static UI assets in DO-254-compliant cockpit displays.

IC Role / Device Role / Timing Role: High-reliability boot memory with hardware ECC and 100,000-cycle endurance for periodic firmware validation.

Use Value: Internal ECC eliminates latent bit errors in SRAM-less systems, reducing need for redundant checksum verification.

Use Scenario: Storing FPGA configuration bitstreams and diagnostic calibration constants in portable ultrasound control units.

IC Role / Device Role / Timing Role: Secure, tamper-resistant storage with OTP region for cryptographic keys and calibration signatures.

Use Value: Two-lockable 512-byte OTP regions enable separate secure storage for manufacturer keys and field-service keys.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P11TFIV20	Same density and core specs, but uses 64-ball LAE Fortified BGA (9 mm × 9 mm) instead of TSOP.	Requires PCB redesign for BGA routing and reflow profile; better for space-constrained, high-vibration environments.	Select when board area is constrained and thermal/mechanical robustness outweighs ease of prototyping.
MX29GL256FHT2I-90G	Macronix part with 90 ns access, but no integrated hardware ECC and only 10,000 erase cycles.	Lacks on-die ECC and lower endurance limit it to non-safety-critical consumer or industrial use.	Choose only if cost sensitivity outweighs long-term reliability and functional safety requirements.

Compared with S29GL256P11TFIV20, this TSOP variant offers easier hand-soldering and legacy socket compatibility; versus MX29GL256FHT2I-90G, it delivers verified ECC, 10× endurance, and AEC-Q100 qualification - essential for automotive and medical deployments.

Availability

S29GL256S11DHIV20 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, avionics display modules, and medical imaging control boards requiring stable component supply across extended product lifecycles.

Supply support for S29GL256S11DHIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and trusted security solutions, with global manufacturing and automotive qualification expertise.

The GL-S family targets high-reliability embedded systems needing fast XIP execution and robust non-volatile storage - designed specifically for automotive, industrial, and aerospace applications demanding AEC-Q100 or extended temperature operation.

FAQ

What is the difference between S29GL256S11DHIV20 and S29GL256S11DHIV10?

The suffix 'V20' indicates AEC-Q100 Grade 2 qualification (–40°C to +105°C), while 'V10' denotes Grade 3 (–40°C to +85°C). Both share identical electrical specs and pinout, but V20 is validated for higher-temperature under-hood automotive use with additional reliability testing per AEC-Q100 stress requirements.

Does S29GL256S11DHIV20 support byte-level writes?

No - it is a 16-bit word-wide device with no byte-write capability. All write operations occur on 16-bit boundaries; DQ0–DQ15 must be driven simultaneously, and unaligned accesses require software masking or external glue logic to emulate byte writes.

Can the OTP array be reprogrammed after locking?

No - once either of the two 512-byte OTP regions is permanently locked via the appropriate command sequence, its contents become read-only and cannot be altered, erased, or reprogrammed, even with power cycle or reset.

Is hardware reset (RESET#) required before power-up?

No - the device includes internal power-on reset (POR) circuitry that automatically initializes the state machine upon VCC ramp. RESET# is optional and used only for synchronous recovery from error conditions or forced return to read mode during active operations.

S29GL256S11DHIV20 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL256S11DHIV20 FAQ

1.How can I place an order for S29GL256S11DHIV20 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S11DHIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S11DHIV20 reliable?

The price and inventory of S29GL256S11DHIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S11DHIV20 is usually 5 days.

3.What payment methods are accepted for S29GL256S11DHIV20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S11DHIV20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S11DHIV20?

S29GL256S11DHIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S11DHIV20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S11DHIV20?

For technical support, including S29GL256S11DHIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S11DHIV20 requirements.

6.How does Aetrix verify that S29GL256S11DHIV20 is sourced from the original manufacturer or authorized distributors?

All S29GL256S11DHIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S11DHIV20 meets industry standards.

7.What is the process for return or replacement of S29GL256S11DHIV20?

All S29GL256S11DHIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S11DHIV20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S11DHIV20 part is unused and in its original packaging.

Return procedure for S29GL256S11DHIV20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

2026-08-11 LDO Regulator: Dropout Voltage, Noise, PSRR and Power Dissipation

LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…