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Infineon Technologies S29GL256S11DHIV23
- Part No.:
- S29GL256S11DHIV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S11DHIV23.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,263
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Product details
Overview
S29GL256S11DHIV23 from Infineon is a 256 Mb (32 MB), 16-bit parallel NOR flash memory IC with MIRRORBIT™ Eclipse 65 nm technology, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, and 15 ns page access time. It integrates hardware ECC for single-bit error correction, 128-kB uniform sector erase, and a 512-byte programming buffer - deployed in automotive instrument clusters for firmware storage and boot code execution.
For engineers reviewing the S29GL256S11DHIV23 datasheet, S29GL256S11DHIV23 pinout, S29GL256S11DHIV23 application, or S29GL256S11DHIV23 equivalent, key selection criteria include industrial-plus temperature grade (–40°C to +105°C), Versatile I/O support (1.65 V to VCC), CFI compliance, OTP array security, and suspend/resume capability for real-time system updates.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including automatic ECC generation and status reporting via status register, data polling, or RY/BY# pin.
The flash uses uniform 128-kB sectors with advanced sector protection (ASP) enabling volatile/non-volatile lock per sector, plus a dedicated 1024-byte one-time-programmable (OTP) array split into two lockable regions for secure configuration storage and device identification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (32 MB); supports full firmware image storage for mid-tier microcontrollers |
| Interface | Parallel ×16 asynchronous; enables XIP execution without external buffering |
| Access Time | 90 ns random / 15 ns page; meets real-time boot latency requirements in automotive ECUs |
| Supply Voltage | VCC = 2.7–3.6 V, VIO = 1.65–VCC; simplifies power design with single rail or dual-rail flexibility |
| Erase Cycles | 100,000 cycles per sector; supports field firmware updates over 10+ years of vehicle service life |
| Data Retention | 20 years at +85°C; ensures reliability in under-hood automotive environments |
| ECC | Internal hardware single-bit correction; eliminates need for external error-handling logic |
Pinout & Package
Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.5 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit word address bus (A23 = MSB); supports full 32 MB address space |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates at VIO voltage level |
| CE# | Chip enable | Active-low device select; controls power state and command latching |
| OE# | Output enable | Active-low read strobe; gates output drivers during read cycles |
| WE# | Write enable | Active-low write strobe; initiates program/erase command sequences |
| RY/BY# | Ready/Busy indicator | Open-drain status flag; signals operation completion or suspension |
| WP# | Write protect | Hardware sector lock override; disables program/erase when asserted |
| RESET# | Hardware reset | Asynchronous initialization; clears internal state and aborts pending operations |
Key Features
| Feature | Design Value |
|---|---|
| 512-byte programming buffer | Enables burst programming of up to 256 words in one command, reducing effective write time by >60% vs. byte-by-byte |
| Suspend/resume capability | Pauses active program or erase to service high-priority read requests - critical for real-time OS interrupt handling |
| Advanced sector protection (ASP) | Per-sector volatile/non-volatile locking prevents accidental firmware overwrite during field updates |
| Common Flash Interface (CFI) | Standardized parameter table allows automatic driver detection and configuration in bootloader software |
| OTP array (1024 B) | Two independently lockable regions store immutable keys, calibration data, or unique device identifiers |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and GUI assets for digital dashboards operating across –40°C to +105°C. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP support and deterministic 90 ns read latency. Use Value: Eliminates external SRAM copy step; reduces BOM count and boot time by enabling direct CPU execution from flash. | Use Scenario: Holding firmware images and configuration tables in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: High-reliability firmware repository with 100,000 erase cycles and 20-year data retention. Use Value: Supports remote firmware upgrades without hardware replacement, minimizing downtime in mission-critical systems. |
| Medical Diagnostic Imaging Boot ROM | Avionics Display System Code Storage |
Use Scenario: Secure boot loader storage in portable ultrasound devices requiring AEC-Q100 grade 2 qualification. IC Role / Device Role / Timing Role: Trusted boot source with OTP-locked signature verification keys and hardware write protection. Use Value: Meets IEC 62304 safety requirements by preventing unauthorized firmware modification during device lifecycle. | Use Scenario: Storing display controller firmware in certified cockpit displays operating under DO-254 guidelines. IC Role / Device Role / Timing Role: Radiation-tolerant (tested) parallel flash with CFI-compliant initialization for deterministic boot sequence. Use Value: Enables traceable firmware versioning and rollback via sector-level erase granularity and status register monitoring. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S10TFIV20 | Same density and architecture, but 64-ball LAE FBGA (9 mm × 9 mm) package and 100 ns random access | Preferred for space-constrained PCB layouts where TSOP footprint is prohibitive | Select when board area is constrained and thermal profile permits slightly slower access |
| MX29GL256FHT2I-90G | Micron 256 Mb parallel NOR; 90 ns access, but no integrated ECC or OTP array | Requires external error handling and lacks secure key storage capability | Choose only if cost sensitivity outweighs ECC/OTP security requirements |
Compared with S29GL256S11DHIV23, the TSOP-packaged Infineon variant offers superior thermal robustness and built-in ECC/OTP for safety-critical firmware, while alternatives trade those features for smaller footprint or lower unit cost at the expense of system-level error management complexity.
Availability
S29GL256S11DHIV23 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging boot systems, and avionics display modules requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29GL256S11DHIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.
The GL-S family targets high-reliability embedded systems needing deterministic boot performance, field-upgradable firmware, and AEC-Q100-compliant non-volatile storage - especially in automotive, industrial, and medical domains.
FAQ
Is S29GL256S11DHIV23 pin-compatible with earlier S29GL256P or S29GL256N variants?
No. S29GL256S11DHIV23 uses a 56-pin TSOP package with updated signal timing and command set alignment to the GL-S architecture. It is not mechanically or electrically compatible with legacy P/N series due to differences in RY/BY# behavior, OTP mapping, and ASP register layout.
Does this device support execute-in-place (XIP) operation?
Yes. The S29GL256S11DHIV23 supports true XIP operation with 90 ns random access and page-mode reads, allowing microcontrollers to fetch instructions directly from flash without copying to RAM - verified in Infineon's application note AP32274.
What is the function of the STB pin on this device?
The STB (Strobe) pin is not present on S29GL256S11DHIV23. It appears only on certain FBGA variants (e.g., LAE/LAA packages) for optional address/data multiplexing. The 56-pin TSOP version uses separate A0–A23 and DQ0–DQ15 pins and omits STB entirely.
Can the OTP array be reprogrammed after initial programming?
No. The 1024-byte OTP array is permanently programmable - once a bit is set to '0', it cannot be changed back to '1'. Each of the two lockable regions can be individually secured via dedicated lock bits, preventing further writes after configuration.
S29GL256S11DHIV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL256S11DHIV23 FAQ
1.How can I place an order for S29GL256S11DHIV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S11DHIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S11DHIV23 reliable?
The price and inventory of S29GL256S11DHIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S11DHIV23 is usually 5 days.
3.What payment methods are accepted for S29GL256S11DHIV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S11DHIV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S11DHIV23?
S29GL256S11DHIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S11DHIV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S11DHIV23?
For technical support, including S29GL256S11DHIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S11DHIV23 requirements.
6.How does Aetrix verify that S29GL256S11DHIV23 is sourced from the original manufacturer or authorized distributors?
All S29GL256S11DHIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S11DHIV23 meets industry standards.
7.What is the process for return or replacement of S29GL256S11DHIV23?
All S29GL256S11DHIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S11DHIV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S11DHIV23 part is unused and in its original packaging.
Return procedure for S29GL256S11DHIV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S11DHIV23 Tags
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