My Inquiry
My Account
Infineon Technologies S29GL256S11DHV023
- Part No.:
- S29GL256S11DHV023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S11DHV023.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,856
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL256S11DHV023 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access and 15 ns page access, and integrates hardware ECC for single-bit error correction - used in boot code storage and firmware update storage for industrial microcontroller-based systems.
For engineers reviewing the S29GL256S11DHV023 datasheet, S29GL256S11DHV023 pinout, S29GL256S11DHV023 application, or S29GL256S11DHV023 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer, Versatile I/O (1.65–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and support for suspend/resume during program/erase.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages all program/erase operations, including automatic ECC generation and verification, status register reporting, and data polling via DQ7/DQ6.
The architecture includes a dedicated 1024-byte OTP array with two lockable regions, CFI-compliant parameter tables for host auto-configuration, and advanced sector protection (ASP) with volatile/non-volatile locking per 128 kB sector - enabling secure firmware partitioning and field-upgrade integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 2,097,152 × 16-bit words - sufficient for full MCU boot image + application firmware in space-constrained designs |
| Access time | 90 ns random / 15 ns page - enables fast XIP execution without external cache in real-time control applications |
| Write buffer size | 512 bytes (256 words) - reduces average programming time by >60% vs. single-word writes in firmware update routines |
| ECC capability | On-die hardware single-bit error correction - eliminates need for external ECC logic in safety-critical boot storage |
| Endurance & retention | 100,000 program/erase cycles / 20-year data retention - validated for industrial lifecycle requirements |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive ECUs and high-temp industrial controllers |
| I/O voltage range | VIO = 1.65 V to VCC - supports mixed-voltage system interfacing (e.g., 1.8 V I/O with 3.3 V core) |
Pinout & Package
Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit word address bus (A23 = MSB); A0–A3 select byte within 32-byte page for fast intra-page reads |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports 1.65–3.6 V I/O voltage independent of VCC |
| CE# | Chip enable | Active-low chip select; controls device power state and enables multi-chip addressing in parallel configurations |
| OE# | Output enable | Active-low read strobe; gates output drivers to prevent bus contention during shared-memory access |
| WE# | Write enable | Active-low write strobe; initiates command sequences and data latching for program/erase operations |
| RY/BY# | Ready/Busy indicator | Open-drain status output; low during internal operations (program/erase), high when ready for next command |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into standby and clears internal state without power cycle |
| WP# | Write protect | Hardware sector lock override; disables program/erase when asserted, independent of software protection |
Key Features
| Feature | Design Value |
|---|---|
| Page mode read | 32-byte aligned page access with 15 ns intra-page timing - accelerates sequential instruction fetch in XIP applications |
| Suspend/resume | Interruptible program/erase operations - allows high-priority read access during long erase cycles in real-time systems |
| Advanced sector protection | Volatile and non-volatile locking per 128 kB sector - enables secure bootloader partitioning and OTA update staging |
| CFI compliance | Standardized parameter table accessible via read commands - enables automatic host driver configuration without hard-coded timing |
| OTP array | 1024-byte one-time-programmable region with dual lock bits - stores cryptographic keys or calibration data with irreversible write security |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot loader and calibrated engine maps in diesel ECU with AEC-Q100 Grade 2 requirement. IC Role / Device Role / Timing Role: Primary non-volatile firmware storage with XIP-capable read performance and hardware ECC for ASIL-B functional safety compliance. Use Value: 90 ns random access enables deterministic boot timing; 100,000-cycle endurance supports field reprogramming over 15+ years. | Use Scenario: Holding ladder logic firmware and configuration data in modular PLC backplane modules operating at 85°C ambient. IC Role / Device Role / Timing Role: High-reliability firmware repository with suspend/resume to maintain scan cycle integrity during updates. Use Value: 128 kB uniform sectors simplify firmware partitioning; Versatile I/O allows direct interface to 1.8 V FPGA logic without level shifters. |
| Medical Imaging System Boot Memory | Avionics Data Logger Configuration |
Use Scenario: Secure boot image storage in FDA-cleared MRI subsystem requiring tamper-resistant firmware integrity. IC Role / Device Role / Timing Role: Trusted boot source with OTP-locked security keys and hardware ECC to detect latent bit errors in long-term storage. Use Value: On-die ECC eliminates need for redundant storage; OTP array stores asymmetric keys for secure boot chain validation. | Use Scenario: Storing flight-critical configuration parameters and sensor calibration tables in DO-178C-certified avionics data recorders. IC Role / Device Role / Timing Role: Radiation-tolerant configuration store with 20-year data retention and sector-level write protection for certified software versions. Use Value: Non-volatile sector locks prevent accidental overwrite during maintenance; AEC-Q100 Grade 2 thermal rating matches airborne environmental profiles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S10TFV020 | Same die, 64-ball LAE FBGA (9 mm × 9 mm), 100 ns random access (versus 90 ns) | Larger package footprint; slightly slower timing limits max clock rate in high-speed XIP systems | Select when board layout requires larger BGA pad spacing or when 100 ns access meets timing budget |
| MX29GL256FHT2I-90G | Macronix 256 Mb parallel NOR, 90 ns access, no integrated ECC, 1.7–3.6 V I/O | Requires external ECC implementation; lacks CFI and suspend/resume features | Select only if cost sensitivity outweighs safety certification needs and host has ECC capability |
Compared with S29GL256S11DHV023, the Infineon S29GL256S10TFV020 trades minor speed loss for mechanical compatibility with larger BGA footprints, while the Macronix MX29GL256FHT2I-90G omits hardware ECC and CFI - increasing host firmware complexity and reducing functional safety readiness.
Availability
S29GL256S11DHV023 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware storage, and medical imaging system boot memory requiring stable component supply across extended product lifecycles.
Supply support for S29GL256S11DHV023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.
The GL-S family targets high-reliability embedded systems requiring robust, high-density parallel NOR flash - optimized for automotive, industrial, and medical applications demanding AEC-Q100 qualification, ECC, and long-term data integrity.
FAQ
Is S29GL256S11DHV023 pin-compatible with earlier S29GL256P or S29GL256N devices?
No. S29GL256S11DHV023 uses a 56-ball VBU BGA package with different ball map and signal assignments than the legacy TSOP-56 S29GL256P/N. Pin mapping, timing parameters, and command set differ significantly - PCB redesign and firmware adaptation are required for migration.
Does this device support burst read or synchronous interface modes?
No. S29GL256S11DHV023 is strictly asynchronous and does not support burst read, clocked interfaces, or DDR modes. All read/write operations are controlled by CE#, OE#, and WE# strobes with timing governed by tACC, tPACC, and tCE specifications in the datasheet.
Can the OTP array be reprogrammed after initial programming?
No. The 1024-byte OTP array is permanently programmable - once a bit is set to '0', it cannot be changed back to '1'. Each of the two lockable regions can be independently locked via dedicated command sequences, preventing further writes to that region.
What happens during power loss while a sector erase is in progress?
The device implements hardware data protection: if VCC drops below the reset threshold during erase, the embedded algorithm controller aborts the operation and places the sector in a protected state. Subsequent access returns status indicating erase suspension, requiring explicit resume or sector unlock before reuse.
S29GL256S11DHV023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL256S11DHV023 FAQ
1.How can I place an order for S29GL256S11DHV023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S11DHV023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S11DHV023 reliable?
The price and inventory of S29GL256S11DHV023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S11DHV023 is usually 5 days.
3.What payment methods are accepted for S29GL256S11DHV023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S11DHV023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S11DHV023?
S29GL256S11DHV023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S11DHV023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S11DHV023?
For technical support, including S29GL256S11DHV023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S11DHV023 requirements.
6.How does Aetrix verify that S29GL256S11DHV023 is sourced from the original manufacturer or authorized distributors?
All S29GL256S11DHV023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S11DHV023 meets industry standards.
7.What is the process for return or replacement of S29GL256S11DHV023?
All S29GL256S11DHV023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S11DHV023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S11DHV023 part is unused and in its original packaging.
Return procedure for S29GL256S11DHV023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S11DHV023 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
