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Infineon Technologies S29GL256S11DHVV23
- Part No.:
- S29GL256S11DHVV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S11DHVV23.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,549
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Product details
Overview
S29GL256S11DHVV23 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring deterministic XIP execution.
For engineers reviewing the S29GL256S11DHVV23 datasheet, S29GL256S11DHVV23 pinout, S29GL256S11DHVV23 application, or S29GL256S11DHVV23 equivalent, key selection factors include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), OTP array support, and AEC-Q100 Grade 2 qualification for automotive engine control units.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.
The internal architecture includes separate secure silicon region (1024-byte OTP with dual lockable regions), advanced sector protection (volatile/non-volatile per sector), and CFI-compliant parameter table for host software identification. ECC logic operates transparently during read cycles without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB); supports full firmware image storage for mid-tier MCUs |
| Random access time | 90 ns at VCC = VIO; enables real-time XIP execution in safety-critical boot loaders |
| Page access time | 15 ns; allows rapid sequential reads within 32-byte aligned pages |
| Write buffer size | 512 bytes; reduces effective programming time by batching up to 256 words per command |
| Erase endurance | 100,000 cycles per sector; suitable for field-upgradable firmware with infrequent reprogramming |
| Data retention | 20 years at +85°C; ensures long-term reliability in unpowered industrial deployments |
| Operating temperature | –40°C to +105°C (Industrial Plus grade); validated for under-hood automotive use |
| I/O voltage range | VIO = 1.65 V to VCC; enables direct interfacing with 1.8 V or 3.3 V logic without level shifters |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width). Pinout conforms to standard parallel NOR flash layout with address (A0–A23), data (DQ0–DQ15), and control signals (CE#, OE#, WE#, RESET#, RY/BY#, WP#, VCC, VSS, VIO).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | Word-aligned addressing; A23 is MSB for 256 Mb density (2^24 × 16 bits) |
| DQ0–DQ15 | Data I/O bus | 16-bit bidirectional bus; supports byte/word writes and reads per JEDEC standard |
| CE# | Chip enable | Active-low chip select; controls device power state and bus contention |
| OE# | Output enable | Active-low read strobe; gates output drivers during read cycles |
| WE# | Write enable | Active-low write strobe; initiates command latching and embedded operations |
| RY/BY# | Ready/Busy indicator | Open-drain active-low signal indicating internal operation progress |
| WP# | Write protect | Hardware sector protection override; disables program/erase when asserted |
| RESET# | Hardware reset | Asynchronous reset input that halts ongoing operations and clears status registers |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | Single-bit error correction with no software overhead; maintains data integrity across 20-year retention |
| 512-byte write buffer | Enables 1.5 MBps effective programming rate; cuts firmware update time vs. byte-by-byte writes |
| Uniform 128 kB sectors | Allows precise firmware partitioning and independent sector locking for secure boot and OTA updates |
| Secure silicon region | 1024-byte OTP array with two lockable regions; stores cryptographic keys or calibration data permanently |
| Versatile I/O (VIO) | Supports 1.65–3.6 V I/O voltage independently of core VCC; eliminates external level shifters in mixed-voltage systems |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in diesel engine ECUs operating at 105°C ambient. IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 90 ns read latency for hard real-time instruction fetch. Use Value: AEC-Q100 Grade 2 qualification and 20-year data retention ensure compliance with ISO 26262 ASIL-B requirements. | Use Scenario: Holding firmware and configuration data in modular programmable logic controllers deployed in factory automation cabinets. IC Role / Device Role / Timing Role: Parallel interface flash providing fast, reliable firmware reload after power loss or field upgrade. Use Value: 128 kB uniform sectors enable atomic firmware updates without corrupting active runtime code partitions. |
| Medical Imaging System Boot Memory | Avionics Data Logger |
Use Scenario: Hosting boot firmware and FPGA configuration bitstreams in portable ultrasound devices requiring high reliability. IC Role / Device Role / Timing Role: Primary boot memory with hardware ECC and OTP-protected calibration constants. Use Value: Internal ECC eliminates need for external error-checking logic, reducing BOM count and board area. | Use Scenario: Recording flight-critical telemetry and fault logs in certified avionics black box recorders. IC Role / Device Role / Timing Role: High-endurance non-volatile storage for cyclic logging with guaranteed 100,000 erase cycles. Use Value: Sector suspend/resume capability allows logging continuity during concurrent system diagnostics or communication events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P11TFIV20 | Same density and timing, but 64-ball LAE Fortified BGA (9 mm × 9 mm) package | Targeted at space-constrained PCBs where TSOP footprint is prohibitive | Select for high-density layouts needing smaller footprint and better thermal performance |
| MX29GL256FHT2I-90G | Macronix part; 90 ns access, 128 kB sectors, but lacks OTP array and has no AEC-Q100 qualification | Cost-sensitive industrial applications without automotive certification requirements | Select only when OTP and automotive qualification are not required |
Compared with S29GL256P11TFIV20, this TSOP variant offers easier manual rework and lower assembly cost; compared with MX29GL256FHT2I-90G, it adds OTP security and AEC-Q100 Grade 2 validation-critical for functional safety designs.
Availability
S29GL256S11DHVV23 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLC firmware storage, medical imaging system boot memory, and avionics data loggers requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL256S11DHVV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and R&D infrastructure.
The GL-S family targets high-reliability embedded systems requiring deterministic XIP performance, robust data integrity, and long-term firmware storage-especially in automotive, industrial, and medical applications demanding AEC-Q100 or extended temperature operation.
FAQ
What is the purpose of the Versatile I/O (VIO) feature?
The VIO feature allows independent I/O voltage operation from 1.65 V to VCC, enabling direct interface with 1.8 V or 3.3 V logic families without external level shifters. This simplifies system design in mixed-voltage environments such as automotive domain controllers and industrial gateways where multiple voltage rails coexist.
Does S29GL256S11DHVV23 support execute-in-place (XIP) operation?
Yes-it supports true XIP operation with 90 ns random access time and 15 ns page-mode reads, allowing microcontrollers to fetch instructions directly from flash without copying to RAM. Its deterministic timing and hardware ECC make it suitable for safety-critical boot code execution in ASIL-B systems.
How does the 512-byte write buffer improve programming efficiency?
The 512-byte buffer allows up to 256 words to be loaded and programmed in a single embedded operation, achieving 1.5 MBps effective throughput. This reduces total firmware update time by ~70% versus byte-wise programming and minimizes CPU intervention during large writes, improving system responsiveness during field upgrades.
Can the OTP array be used for storing cryptographic keys?
Yes-the 1024-byte OTP array is divided into two lockable regions, each programmable once and permanently secured. It is commonly used to store root-of-trust keys, device-specific certificates, or calibration data in automotive and medical applications where tamper resistance and immutability are required.
S29GL256S11DHVV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL256S11DHVV23 FAQ
1.How can I place an order for S29GL256S11DHVV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S11DHVV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S11DHVV23 reliable?
The price and inventory of S29GL256S11DHVV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S11DHVV23 is usually 5 days.
3.What payment methods are accepted for S29GL256S11DHVV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S11DHVV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S11DHVV23?
S29GL256S11DHVV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S11DHVV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S11DHVV23?
For technical support, including S29GL256S11DHVV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S11DHVV23 requirements.
6.How does Aetrix verify that S29GL256S11DHVV23 is sourced from the original manufacturer or authorized distributors?
All S29GL256S11DHVV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S11DHVV23 meets industry standards.
7.What is the process for return or replacement of S29GL256S11DHVV23?
All S29GL256S11DHVV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S11DHVV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S11DHVV23 part is unused and in its original packaging.
Return procedure for S29GL256S11DHVV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S11DHVV23 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
Microchip Technology
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