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Nexperia USA Inc. S29GL256S11FHIV10
- Part No.:
- S29GL256S11FHIV10
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Memory
- Package:
- -
- Datasheet:
-
S29GL256S11FHIV10.pdf
- Description:
- S29GL256S - 256-Mbit (32 Mbyte),
- Quantity:
- Payment:
- Shipping:
Inventory:170
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Product details
Overview
S29GL256S11FHIV10 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction - deployed in automotive instrument clusters requiring fast XIP boot code execution and reliable firmware storage.
For engineers reviewing the S29GL256S11FHIV10 datasheet, S29GL256S11FHIV10 pinout, S29GL256S11FHIV10 application, or S29GL256S11FHIV10 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte programming buffer throughput (1.5 MBps), Versatile I/O support (1.65–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and OTP array for secure configuration storage.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages all program/erase operations, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.
The internal architecture includes dedicated erase voltage and program voltage generators, hardware ECC engine covering all array sectors, and a 1024-byte one-time-programmable (OTP) array split into two lockable regions - enabling secure boot configuration and device-specific calibration data storage without external encryption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (32 MB); supports full firmware image storage for mid-tier automotive ECUs. |
| Random Access Time | 90 ns at VCC = VIO; enables sub-100 ns XIP execution latency critical for real-time boot sequences. |
| Page Access Time | 15 ns; allows rapid sequential instruction fetch within 32-byte aligned pages during runtime code execution. |
| Programming Buffer | 512 bytes; reduces effective programming time by batching writes - essential for field firmware updates. |
| ECC Support | Internal hardware single-bit error correction; eliminates need for external ECC logic in safety-critical systems. |
| Endurance & Retention | 100,000 program/erase cycles / 20 years data retention; meets long-life requirements of industrial and automotive deployments. |
| Operating Temperature | –40°C to +105°C (AEC-Q100 Grade 2); qualified for under-hood ECU environments with thermal cycling stress. |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pin assignment validated per Infineon datasheet 001-98285 Rev. *U, Section 12.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit word-aligned address bus; A23 is MSB for 256 Mb density (2²⁴ × 16 bits = 32 MB). |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes and reads per JEDEC-standard parallel NOR protocol. |
| CE# | Chip Enable | Active-low chip select; controls device power state and enables command decoding when asserted. |
| OE# | Output Enable | Active-low read strobe; gates output drivers during read cycles without affecting internal state. |
| WE# | Write Enable | Active-low write strobe; initiates command latching or data loading during program/erase sequences. |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low = operation in progress, high = ready for next command. |
| RESET# | Hardware Reset | Active-low asynchronous reset; forces device into known state and aborts ongoing embedded operations. |
| VCC | Core Supply | 2.7–3.6 V single supply powering core logic, memory array, and internal voltage generators. |
| VIO | I/O Supply | 1.65–VCC versatile I/O voltage; decouples interface signaling from core voltage for mixed-voltage system integration. |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse Technology | Enables higher density and lower power vs. older floating-gate NOR, with improved endurance and retention stability. |
| Uniform 128 kB Sector Erase | Eliminates erase block size mismatches in firmware partitioning; simplifies OTA update design with predictable timing (477 kBps typical). |
| Advanced Sector Protection (ASP) | Supports independent volatile/non-volatile locking per sector - prevents accidental overwrite of bootloader or calibration data. |
| Common Flash Interface (CFI) | Standardized parameter table accessible via read commands; enables automatic driver detection and configuration in OS/bootloader stacks. |
| Secure Silicon Region (OTP) | 1024-byte factory-programmable area with dual lock bits; stores immutable keys, MAC addresses, or production IDs without risk of reprogramming. |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code, GUI assets, and real-time gauge rendering logic in digital dashboards. IC Role / Device Role / Timing Role: XIP-capable NOR flash executing code directly from memory with ≤90 ns latency. Use Value: Eliminates external RAM copy step during boot; reduces BOM count and improves startup time by >15% vs. SPI flash alternatives. | Use Scenario: Holding firmware images and configuration tables for programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Non-volatile program storage with AEC-Q100 Grade 2 temperature rating and 20-year data retention. Use Value: Ensures firmware integrity across thermal cycling and vibration; avoids field failures due to bit corruption without external ECC overhead. |
| Medical Diagnostic Imaging Boot ROM | Avionics Display System Code Storage |
Use Scenario: Hosting certified boot firmware and safety monitor routines in portable ultrasound and MRI control units. IC Role / Device Role / Timing Role: Secure, tamper-resistant code storage with OTP region for cryptographic key binding. Use Value: Meets IEC 62304 Class C software requirements via hardware-enforced write protection and ECC coverage. | Use Scenario: Storing display controller firmware and font assets in DO-178C-certified cockpit displays. IC Role / Device Role / Timing Role: High-reliability parallel flash with deterministic 15 ns page read for real-time graphics rendering. Use Value: Guarantees worst-case instruction fetch latency under DO-254 timing analysis constraints; supports dual-lock OTP for version control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P11TFIV10 | Same density and timing, but TSOP-56 package (vs. LAE BGA); no Versatile I/O (VIO fixed to VCC). | Limited to board-level space-constrained designs where BGA assembly is unavailable or cost-prohibitive. | Select when legacy PCB layout requires through-hole or gull-wing footprint compatibility. |
| MX29GL256FHI-90G | Macronix part; same 256 Mb, 90 ns access, but lacks integrated ECC and OTP array; uses different command set. | Requires external ECC logic and software-managed protection; not suitable for ASIL-B/C systems without redesign. | Consider only for cost-sensitive non-safety applications where firmware integrity is managed at software layer. |
Compared with S29GL256P11TFIV10, this LAE BGA variant offers superior thermal performance and Versatile I/O flexibility; versus MX29GL256FHI-90G, it delivers hardware ECC and OTP security out-of-box - reducing validation effort for functional safety certification.
Availability
S29GL256S11FHIV10 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging boot systems, and avionics display controllers requiring stable component supply across extended product lifecycles.
Supply support for S29GL256S11FHIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions.
The GL-S family targets automotive and industrial applications demanding AEC-Q100 qualification, deterministic timing, and hardware-based data integrity - designed specifically for XIP-capable firmware storage in safety-critical ECUs.
FAQ
What is the maximum operating frequency supported by S29GL256S11FHIV10?
The device does not operate synchronously and has no clock input; its performance is defined by access times - 90 ns random access and 15 ns page access - which correspond to effective throughput up to ~11 MHz sustained read rate in page mode. Timing compliance is verified under specified load and voltage conditions per datasheet AC characteristics table.
Does S29GL256S11FHIV10 support quad or octal SPI interfaces?
No. This is a parallel-interface NOR flash with a 16-bit DQ bus and asynchronous control signals (CE#, OE#, WE#). It does not implement SPI, QSPI, or Octal SPI protocols. For serial interface alternatives, Infineon's Semper™ family provides SPI-compatible devices with comparable density and ECC features.
How is the 1024-byte OTP array protected against accidental programming?
The OTP region contains two independent lock bits - one for each 512-byte sub-region - that permanently disable further programming once set. Locking is performed via specific unlock-bypass-write command sequences; no hardware fuse is used. Once locked, the region remains read-only across power cycles and temperature extremes.
Can S29GL256S11FHIV10 be used in systems with 1.8 V I/O rails?
Yes. Its Versatile I/O feature supports VIO from 1.65 V to VCC, so with VCC = 3.3 V, it interfaces directly with 1.8 V logic using level-shifting circuitry or compatible 1.8 V tolerant drivers. The datasheet specifies timing parameters for VIO = 1.8 V in the VersatileIO column of the performance summary table.
S29GL256S11FHIV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
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- Supplier Device Package:
- -
S29GL256S11FHIV10 FAQ
1.How can I place an order for S29GL256S11FHIV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S11FHIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S11FHIV10 reliable?
The price and inventory of S29GL256S11FHIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S11FHIV10 is usually 5 days.
3.What payment methods are accepted for S29GL256S11FHIV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S11FHIV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S11FHIV10?
S29GL256S11FHIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S11FHIV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S11FHIV10?
For technical support, including S29GL256S11FHIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S11FHIV10 requirements.
6.How does Aetrix verify that S29GL256S11FHIV10 is sourced from the original manufacturer or authorized distributors?
All S29GL256S11FHIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S11FHIV10 meets industry standards.
7.What is the process for return or replacement of S29GL256S11FHIV10?
All S29GL256S11FHIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S11FHIV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S11FHIV10 part is unused and in its original packaging.
Return procedure for S29GL256S11FHIV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S11FHIV10 Tags
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M24C02-WMN6TP
STMicroelectronics
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Microchip Technology
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STMicroelectronics
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